• Title/Summary/Keyword: 계면 모서리 균열

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Viscoelastic Analysis of Stress Intensity Factor for Interface Edge Crack in a Unidirectional Liminate (단일방향 복합재료의 공유면에 존재하는 계면 모서리균열의 점탄성 해석)

  • 이상순;김범식
    • Computational Structural Engineering
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    • v.10 no.1
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    • pp.129-134
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    • 1997
  • Interfacial stress singularity in a unidirectional two-dimensional laminate model consisting of an elastic fiber and a viscoelastic matrix has been investigated using the time-domain boundary element method. First, the interfacial singular stresses between the fiber and the matrix of a unidirectional laminate subjected to a uniform transverse tensile strain have been investigated near the free surface, but without any defect or any edge crack. Such a stress singularity might lead to fiber-matrix debonding or interfacial edge cracks. Then, the overall stress intensity factor for the case of a small interfacial edge crack of length a has been computed.

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Boundary Element Analysis for Edge Cracks at the Bonding Interface of Semiconductor Chip (반도체 칩 접착계면의 모서리 균열에 대한 경계요소 해석)

  • 이상순
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.3
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    • pp.25-30
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    • 2001
  • The stress intensity factors for edge cracks located at the bonding interface between the semiconductor chip and the adhesive layer subjected to a uniform transverse tensile strain are investigated. Such cracks might be generated due to a stress singularity in the vicinity of the free surface. The boundary element method (BEM) is employed to investigate the behavior of interface stresses. The amplitude of complex stress intensity factor depends on the crack length, but it has a constant value at large crack lengths. The rapid propagation of interface crack is expected if the transverse tensile strain reaches a critical value.

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Viscoelastic Analysis for Behavior of Edge Cracks at the Bonding Interface of Semiconductor Chip (반도체 칩 접착 계면에 존재하는 모서리 균열 거동에 대한 점탄성 해석)

  • 이상순
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.14 no.3
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    • pp.309-315
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    • 2001
  • The Stress intensity factors for edge cracks located at the bonding interface between the elastic semiconductor chip and the viscoelastic adhesive layer have been investigated. Such cracks might be generated due to stress singularity in the vicinity of the free surface. The domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The overall stress intensity factor for the case of a small interfacial edge crack has been computed. The magnitude of stress intensity factors decrease with time due to viscoelastic relaxation.

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