• Title, Summary, Keyword: 와이어 본딩

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Vertical Integrated Transformer using Bondwires (본딩와이어를 이용한 수직형 집적 트랜스포머)

  • Song, Byeong-Uk;Lee, Hae-Yeong
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.37 no.3
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    • pp.43-48
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    • 2000
  • In this paper, vortical integrated transformers using bondwires are proposed and characterized for MMIC's (Monolithic Microwave Integrated Circuits) In a wide range of frequencies (1∼20 GHz), where full-wave analysis by the FEM (Finite Element Method) was adopted. The electrical characteristics of the proposed transformers are compared with those of the spiral transformer. We extracted mutual inductances from S -parameters. The vertical transformers using bondwires have not only low insertion loss but also reduce parasitic capacitances and dielectric loss due to their separation from substrates. It can be fabricated easily by used of the modern automatic wirebonding technology. It is expected that the proposed transformers are to improve the performance of MMIC's applied to impedance matching, and phase shifting circuits.

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Surface bonding pad design for universal wire bonding(Au ball bonding + Al wedge bonding) (Universal wire bonding(Au ball bonding + Al wedge bonding)을 위한 표층 전극 구조 설계)

  • Sung, Je-Hong;Kim, Jin-Wuan;Choi, Yun-Huek
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • pp.171-171
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    • 2008
  • 본 연구는 초음파 알루미늄 웨지 및 금 볼 본딩을 동시에 적용 가능한 본딩 Pad의 금속학적 안정성을 고려한 표층전극 형성 방법에 관한 것이다. 특히, 이동통신 및 전장용 모듈의 복합 및 융합화로 LTCC기판 패키징에 있어서 다양한 본딩 기술이 요구되고 있다. 전통적인 interconnection 기술인 Au ball 본딩 및 초음파 에너지를 이용한 Al wedge 본딩 기술이 동시에 사용되어야 하는 패키지 구조의 경우 본딩 패드의 표층전극 설계는 서로 상충되는 조건이 요구된다. 따라서, 본 연구에서는 LTCC기판의 표층전극의 Metal finish 방법으로 이용되는 ENEPIG(무전해 Ni/Pd/Au도금)공법으로 Au ball 본딩 및 초음파 Al wedge 본딩을 동시에 가능하게 하는 solution을 제시하여 패키징 자유도뿐만 아니라 Interconnection 신뢰성을 확보할 수 있었다.

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Wideband Crosstalk Analysis of Coupled Bondwires for High-Speed Plastic Packaging (초고속 플라스틱 패키지를 위한 본딩와이어의 광대역 혼신 해석)

  • 윤상기;이해영
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.35D no.10
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    • pp.22-28
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    • 1998
  • Signal transmission and crosstalk of coupled bondwires buried in plastic packages are analyzed using the Method of Moments and the Fourier Transform algorithm. It is also shown that the quasi-static crosstalk model of SPICE is inappropriate for designing the high-speed plastic packages. Plastic packaging material, increasing the self and mutual capacitances, is found to be helpful for the signal transmission integrity due to the dielectric compensation effect. However, it is also observed that the plastic material increases the crosstalk due to the radiation-enhanced mutual coupling effect. By investigating the geometrical and material dependence of the pulse transmission and crosstalk, it is found that the radiation-enhanced coupling effect is significant for most of typical bondwire geometries and plastic package materials. These calculation results can be effectively used for designing plastic packages of high-speed digital IC's and monolithic RFIC's.

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A Study on the Reliability of the Au Wire Bonding due to Baking (Baking 처리에 따른 금선 본딩의 신뢰성 연구)

  • Park, Yong-Cheol;Kim, Yeong-Ho
    • Korean Journal of Materials Research
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    • v.8 no.11
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    • pp.982-986
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    • 1998
  • baking 전후의 금선의 접합강도 변화를 연구하였다. 금선을 이용하여 Si 칩의 AI 패드와 은도금된 리드프레임 사이를 thermosonic 방법으로 본딩하였다. 본딩된 금선을 $175^{\circ}C$에서 시간을 변화시키면서 baking 처리하였다. 접합강도는 와이어 풀 테스트, 볼 전단 테스트, stud 풀 테스트로 평가하였다. 와이어 풀 접합강도는 baking 처리를 거쳐도 크게 변화하지 않았지만 파괴 유형이 baking 전에는 볼목 파괴에서 baking 후 스티치 파괴로 바뀌었다. 본딩과 baking 중 금선의 결정립이 크게 성장하였는데 이런 결정립 크기 변화와 금선 접합 부위의 기하학적인 모양에 따라 파괴 유형이 바뀌었다.

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Optimization of Performances in GaN High Power Transistor Package (질화갈륨 고출력 트랜지스터 패키지의 성능 최적화)

  • Oh, Seong-Min;Lim, Jong-Sik;Lee, Yong-Ho;Park, Chun-Seon;Park, Ung-Hee;Ahn, Dal
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.9 no.3
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    • pp.649-657
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    • 2008
  • This paper describes the optimized output performances such as output power and the third order intermodulation in GaN high power transistor packages which consist of chip die, chip capacitors, and wire bonding. The optimized output power according to wire bonding techniques, and third order intermodulation performances according to wire bonding and bias conditions are discussed. In addition, it is shown through the nonlinear simulation that how the output performances are sensitive to the inductance values which are realized by wire bonding for matching network in the limited package area.

Vibration Characteristics of a Wire-Bonding Ultrasonic Horn (와이어 본딩용 초음파 혼의 진동 특성)

  • Kim, Young Woo;Yim, Vit;Han, Daewoong;Lee, Seung-Yop
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.38 no.2
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    • pp.227-233
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    • 2014
  • This study investigates the vibration characteristics of a wire-bonding piezoelectric transducer and ultrasonic horn for high-speed and precise welding. A ring-type piezoelectric stack actuator is excited at 136 kHz to vibrate a conical-type horn and capillary system. The nodal lines and amplification ratio of the ultrasonic horn are obtained using a theoretical analysis and FEM simulation. The vibration modes and frequencies close to the driving frequency are identified to evaluate the bonding performance of the current wire-bonder system. The FEM and experimental results show that the current wire-bonder system uses the bending mode of 136 kHz as the principal motion for bonding and that the transverse vibration of the capillary causes the bonding failure. Because the major longitudinal mode exists at 119 kHz, it is recommended that the design of the current wire-bonding system be modified to use the major longitudinal mode at the excitation frequency and to minimize the transverse vibration of capillary in order to improve the bonding performance.

The Design of Zoom Microscope System for Inspecting Wire-Bonding (와이어 본딩 검사용 현미경 광학계의 설계)

  • 류재명;임천석;조재흥;정진호;전영세
    • Proceedings of the Optical Society of Korea Conference
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    • pp.256-257
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    • 2003
  • 반도체 와이어 본딩(wire-bonding) 조립공정에 사용되는 검사용 현미경 광학계를 설계하였다. 이러한 와이어는 리드프레임에 대해 $\pm$ 1 mm의 단차를 가진다. 이 때 리드프레임은 6배로 관찰하며, 와이어 부분은 2배로 관찰하고자 한다. 그러나 와이어의 단차로 인해 물체거리가 변하게 되며, 일반 광학계로는 배율도 변하게 된다. 물체거리가 변해도 동일한 배율을 가지는 광학계를 설계하기 위해 유한 물점용 3군 줌 광학계를 목적에 맞게 변형시켰다. (중략)

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Process Capability Optimization of Ball Bonding Using Response Surface Analysis in Light Emitting Diode(LED) Wire Bonding (반응 표면 분석법을 이용한 Light Emitting Diode(LED) wire bonding 용 Ball Bonding 공정 최적화에 관한 연구)

  • Kim, Byung-Chan;Ha, Seok-Jae;Yang, Ji-Kyung;Lee, In-Cheol;Kang, Dong-Seong;Han, Bong-Seok;Han, Yu-Jin
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.18 no.4
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    • pp.175-182
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    • 2017
  • In light emitting diode (LED) chip packaging, wire bonding is an important process that connects the LED chip on the lead frame pad with the Au wire and enables electrical operation for the next process. The wire bonding process is divided by two types: thermo compression bonding and ultrasonic bonding. Generally, the wire bonding process consists of three steps: 1st ball bonding that bonds the shape of the ball on the LED chip electrode, looping process that hangs the wire toward another connecting part with a loop shape, and 2nd stitch bonding that forms and bonds to another electrode. This study analyzed the factors affecting the LED die bonding processes to optimize the process capability that bonds a small Zener diode chip on the PLCC (plastic-leaded chip-carrier) LED package frame, and then applied response surface analysis. The design of experiment (DOE) was established considering the five factors, three levels, and four responses by analyzing the factors. As a result, the optimal conditions that meet all the response targets can be derived.

반도체 제조공정의 조립자동화 기술

  • 변증남;유범재;오상록;김정덕
    • 전기의세계
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    • v.39 no.6
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    • pp.42-49
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    • 1990
  • 반도체 조립과 관련하여 다이본딩 시스템, 와이어본딩 시스템 및 인라인 시스템의 구성 및 기능을 살펴보고, 자동화를 위해 필요한 관리제어, 시각처리 및 통신에 대하여 간략하게 알아보고자 한다.

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Study on the Bonding Pad Lift Failure in Wire Bonding (와이어 본딩시 본딩 패드 리프트 불량에 관한 연구)

  • 김경섭;장의구;신영의
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.12
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    • pp.1079-1083
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    • 1998
  • In this study, ultrasonic power of Aluminum wire bonder, bond time and bond force are investigated and valued in order to minimize failure of bonding pad lift. We also tried to control those 3 factors properly. We got the conclusion that if we turn down the ability of ultrasonic power or bond time, we can get a pad lift from a boundary between bond pad ad wire because pad metal and wire joining is unstable, but it is best condition when it ultrasonic power is 100∼130unit, bond time is 15∼20msec and bond force is 4∼6gf.

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