• Title, Summary, Keyword: 와이어 본딩

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Tolerance analysis of Multi-Configurative Microscopic System for Inspecting the Wire-Bonding Status of Semiconductor Chips (반도체 와이어 본딩 검사용 다중배치 현미경 광학계에 대한 공차분석)

  • Ryu, Jae-Myung;Kim, Jae-Bum;Kang, Geon-Mo;Jung, Jin-Ho;Baek, Seung-Sun;Jo, Jae-Heung
    • Korean Journal of Optics and Photonics
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    • v.17 no.2
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    • pp.149-158
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    • 2006
  • We have analyzed various tolerances of the multi-configurative microscopic system for inspecting the wire-bonding of a reed frame by using the Gaussian bracket method and the equivalent lens method. The tolerances for the curvature and the thickness, which are axial symmetric tolerances, are given by varying the back focal length within a fecal depth under diffraction-limited conditions. Moreover, by using the trial and error method, the axial non-symmetric tolerances for decenter and tilt are established by assigning the 5% variation of MTF(modulation transfer function) at the spatial frequency of 50 lp/mm and at the field angle of 0.7 field. As the tolerances with the most probable distribution are distributed within the range of the decay rate of less than 5% independent of the probability distribution of tolerances, we can achieve completely the desired design performances of the multi-configurative microscopic system by using the various ranges of these tolerances.

Study for Inspection Method of Electronic Components Using 3-D X-ray Imaging Technology (3차원 X-ray 영상 기법을 이용한 전자부품 검사 기술 연구)

  • Sim, Hyeok-Hun;Park, Gi-Nam;Kim, Jong-Hyeong;Park, Hui-Jae
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.16 no.5
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    • pp.157-161
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    • 2007
  • There are technological changes to reduce the size and weight of electronic components and to accommodate multi-functions in them. To meet this trend, more complicated technological processes are required. To maintain the processes, more accurate inspection systems are also necessary. Therefore, new inspection methods are needed, which is differ from conventional inspection methods such as electrical test methods ICT(In-Circuit Test), FCT(Function Test) and visual test using optical equipments. One of the possible approaches is non-destructive test using X-ray. In this paper, an inspection method using X-ray is developed and applied to inspection of soldering state and internal defects of electronic components.

Vibration Characteristics of a Wire-Bonding Piezoelectric Actuator (와이어 본딩용 압전 액츄에이터의 진동 특성)

  • Kim, Young-Woo;Kim, Kyoung-Up;Lee, Seung-Yop
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • pp.578-582
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    • 2007
  • In this paper, vibration modes and frequencies of a ring-type stacked piezoelectric actuator for a wire bonding transducer system are analyzed using FEM simulations. We implement experiments using a commercial product model of the actuator PZT module which consists of 6 layer ring-type PZT and 7 electrodes, combined bolts, nut and tinut. There are two main results: One is that FEM analysis should consider the effect the harmonic voltage input in order to meet the experimental results. The other is that the current wire bonder using exciting frequency of 136 kHz should be modified in order to improve the actuator and bonding performance because the actuator module has the main longitudinal mode of 145 kHz.

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Solvent-assisted sealing of poly(methylmethacrylate) microchannel under mild conditions (용매를 이용한 Poly(methylmethacrylate)의 저온 저압 본딩 및 마이크로 채널 표면의 선택적 소수성 코팅기법 개발)

  • Lee, Jae-Seon;Lee, Nae-Yun
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • pp.110-110
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    • 2017
  • 마이크로 플루이딕 디바이스는 화학, 생물학 실험 및 생체 의학 진단을 위한 플랫폼으로 지난 20년간 그 사용 및 연구가 증가되어 왔다. 마이크로 플루이딕 디바이스를 제작하는 데 있어 가장 일반적으로 사용되는 재료는 실리콘이지만 비용이 많이 들고 불투명하므로 광학 검출이 필요한 곳에 적용이 제한된다. 이러한 측면에서 열가소성 플라스틱은 상업화의 중요한 요소인 대량 생산에 있어 큰 잠재력을 가지고 있으며 저렴하고, 가공이 쉽고, 유연하고, 광학적으로 투명하고, 화학적으로 불활성이며, 생체적합성을 가진다. 본 연구에서는 열가소성 플라스틱의 일종인 PMMA Poly(methylmethacrylate)를 효율적으로 접합하기 위해 비교적 낮은 온도와 낮은 압력에서 에탄올을 활용한 접착방식을 개발하였다. 먼저, PMMA 기판의 전체 표면을 $80^{\circ}C$에서 20 분 동안 에탄올로 처리한 후, $60^{\circ}C$에서 20 분간 열 압착하는 방식으로 영구적인 결합이 이루어졌다. 결합 강도 및 채널의 sealing 정도를 확인하기 위해, 인장 강도, 누수 및 파열 테스트를 수행하였다. 결합강도는 약 12.4 MPa로 타 연구와 비교할 때 매우 높았으며 마이크로 채널의 전체 내부 체적보다 거의 450 배 높은 강한 액체 흐름을 견딜 정도로 견고한 결합이 유지되었다. 열가소성 플라스틱의 본딩에 사용되는 유기 용매는 광학 특성을 희생시키지 않으면서 결합 속도를 높일 수 있지만, 결합 공정 중에 용매로 인해 마이크로 채널이 막히는 현상이 발생될 수 있다. 따라서, 견고한 본딩을 유지하면서 채널 막힘을 방지하기 위해 마이크로 채널을 소수성으로 선택적으로 처리하여 내벽의 표면 특성을 튜닝해 주는 기법을 추가로 적용하였다. 본 연구에서 사용한 방법은 아민-PDMS (polydimethylsiloxane) 링커를 적용하여 기판 표면의 극성을 변경시켜 주었다. 아민-PDMS 링커는 PC (polycarbonate), PET (polyethylene terephthalate), PVC (polyvinyl chloride) 및 PI (polyimide)와 같은 다양한 열가소성 플라스틱의 표면 소수성을 현저히 증가시키며 화학적, 열적 안정성이 뛰어나다. 아민-PDMS 링커는 PMMA의 카보닐 그룹과 반응할 수 있는 아민 사이드 그룹을 포함하는 PDMS 백본으로 구성되며 처리된 대상표면을 소수성으로 만든다. 아민-PDMS 링커 처리 이후 채널은 소수성으로 변화되었으며 이는 접촉각(contact angle)의 증가로 확인되었다. 코팅된 채널을 에탄올로 30분간 80도에서 처리하여도 소수성은 그대로 유지되어 마이크로 채널의 선택적인 소수성 코팅이 성공적으로 수행되었다.

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High-Quality Bondwire Integrated Transformer (고품질 본드와이어 집적형 트랜스포머)

  • Song, Byeong-Uk;Lee, Hae-Yeong
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.39 no.2
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    • pp.81-91
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    • 2002
  • In this paper, a high-quality integrated transformer using bondwires is proposed and fabricated. The bondwire transformer inherently has low conductor loss due to wide cross-section and small parasitic capacitance because the vertical placement of the bondwire loop separates from substrate and effectively reduces the substrate effects. It can be fabricated easily by used of the modern automatic wirebonding technology. The electrical characteristics of the fabricated transformers are compared with those of the spiral transformer It is expected that the bondwire transformer can improve the performance for RFIC and MMIC applied to a variety of application, for example, Mixer, Balanced Amplifier, VCO, and LNA.

Package Optimization for Maximizing the Modulation Performance of 10 Gbps MQW Modulator (10 Gbps용 MQW 광변조기의 변조 성능 극대화를 위한 최적 패키지에 관한 연구)

  • 김병남;이해영
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.35D no.10
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    • pp.91-97
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    • 1998
  • The modulation performance of 10 Gbps electro-absorption InGaAsP/InGaAsP strain compensated MQW (Multiple Quantum Well) modulator module depends on the modulator as well as the package parasitics. The high frequency package parasitics resulting from various structural discontinuities, limit the modulation bandwidth and increase the chirp-parameter. Therefore, we propose the double bondwires embedded in dielectric materials to minimize the bondwire parasitics. Using the proposed structure with 50 $\Omega$ terminating resistor, the modulation bandwidth is greatly increased by 125 % than the bare chip and the chirp-parameter is also reduced. This technique can be used in optimizing the package of high speed external modulators.

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Design of Dumbbell-type CPW Transmission Lines in Optoelectric Circuit PCBs for Improving Return Loss (광전회로 PCB에서 반사특성 개선을 위한 덤벨 형태의 CPW 전송선 설계)

  • Lee, Jong-Hyuk;Kim, Hwe-Kyung;Im, Young-Min;Jang, Seung-Ho;Kim, Chang-Woo
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.35 no.4A
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    • pp.408-416
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    • 2010
  • A dumbbell-type CPW transmission-line structure has been proposed to improve the return loss of the transmission line between a driver IC and flip-chip-bonding VCSEL(Vertical Cavity Surface Emitting Laser) in a hybrid opto-electric circuit board(OECB). The proposed structure used a pair of dummy ground solder balls on the ground lines for flip-chip bonding of the VCSEL and designed the dumbbell-type CPW transmission line to improve reflection characteristics. The simulated results revealed that the return loss of the dumbbell-type CPW transmission line was 13-dB lower than the conventional CPW transmission line. A 4-dB improvement in the return loss was obtained using the dummy ground solder balls on the ground lines. The variation rate of the reflection characteristic with the variation of terminal impedances of the transmission line (at the output terminal of the driver IC and the input terminal of the VCSEL) is about ${\pm}2.5\;dB$.

The Implementation of Power LNA Using GaAs p-HEMT (GaAs p-HEMT를 이용한 Power LNA의 설계)

  • Cho, Sam-Uel;Kim, Sang-Woo;Park, Dong-Jin;Kim, Young;Kim, Bok-Ki
    • Proceedings of the Korea Electromagnetic Engineering Society Conference
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    • pp.29-33
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    • 2002
  • 본 논문은 자기 바이어스(self bias)를 이용한 PCS 대역용 하이브리드 전력 저잡음 증폭기(power LNA) 모듈에 관한 것으로 GaAs p-HEMT 칩을 세라믹 기판에 실장하여 와이어 본딩과 주변 매칭을 통해 고주파 손실을 줄이고 온도 변화에 대한 안정성과 1.2㏈의 저잡음, 21~23㏈m의 P$_1$㏈를 실현하였다. 10mm$\times$10mm 크기로 표면 실장이 되도록 단자를 cut-line 형태로 모듈화 하여 안정성과 신뢰성을 향상시켰고 또한 저가격화를 실현하였다.

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On Atmospheres for Firing the Thick Film Coper Conductors (Thick Film Copper Conductor 의 소결과 소성 분위기)

  • Lee, Joon
    • Applied Chemistry for Engineering
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    • v.2 no.3
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    • pp.193-198
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    • 1991
  • Thick film copper conductors are of considerable interest in thick film industries because of both the potential cost saving compared to the noble metal conductors and the favorable properties in electrical conductivity, solderability, solder leach resistance and wire bondability, However, formation of the excellent copper thick film is a lot complicated due to easily oxidizing property of copper at high temperature. In order to get favorable thick film copper conductor, hybrid microcircuit industry utilizes majorly three kinds of firing atmosphere, such as nitrogen atmosphere, reactive atmosphere and air atmosphere. The processes and the three atmospheres for firing thick film copper conductor were extensively reviewed in this article.

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Development of 750MHz CATV amplifier module using PHEMTs (PHEMT를 이용한 750MHz CATV증폭 모듈 개발)

  • 유주형;구경헌;조삼열
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.22 no.1
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    • pp.72-80
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    • 1997
  • A 750 MHz CATV amplifier module has been designed and fabricated using PHEMT chips on alumina board. Developed 2-stage push-pull amplifier using wire bounded PHEMT chips shows 19dB gain, 15dB return loss and 4. 2dB noise figure over 50-750MHz frequency range. These results are superior to the characteristics of the commer-cially abailable 750MHz amplifier module. In this paper, brief background of the amplifier design, the circuit diagram and the test result have been presented.

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