• Title, Summary, Keyword: 후판복합재료평판

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Cure simulation and Consolidation for a Thick Glass/Epoxy Laminate (유리섬유/에폭시 후판 복합재료의 경화공정 및 압밀해석)

  • O, Je-Hun;Lee, Dae-Gil
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.24 no.11
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    • pp.2853-2865
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    • 2000
  • During the curing process of thick glass/epoxy laminates, a substantial amount of temperature lag and overshoot at the center of the laminates is usually experienced due to the large thickness and low thermal conductivity of the glass/epoxy composites. Also, it takes a longer time for full and uniform consolidation. In this work, temperature, degree of cure and consolidation of a 20 mm thick unidirectional glass/epoxy laminate were investigated using an experiment and a 3-dimentional numerical analysis. From the experimental and numerical results, it was found that the experimentally obtained temperature profile agreed well with the numerical one, and the cure cycle recommended by the prepreg manufacturer should be modified to prevent a temperature overshoot and to obtain full consolidation.