• Title, Summary, Keyword: BGA

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A study on the Measurement Algorithm for the Ball Height of BGA Device Using Stereo Vision (스테레오 비젼을 이용한 BGA 소자의 볼 높이 측정 알고리즘에 관한 연구)

  • Kim, Joon-Seek;Park, Young-Soon
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.20 no.6
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    • pp.26-34
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    • 2006
  • In this paper, We proposed he algorithm for defect extraction and a study of the stereo image modeling o inspect defect for the ball height of BGA(ball grid way) device using 2-dimensional images captured by the BGA device of using the high resolution CCD cameras. This paper propose the package/ball area extraction of BGA device part, the FOV(field of view) calibration part, the top point matching part, and ball height measurement method. Each BGA device propose extraction method by defect, Through the experiment, we verified the result.

3-Dimensional Shape Inspection for Micro BGA by LED Reflection Image (LED 반사영상을 이용한 마이크로 BGA 3차원형상검사)

  • Kim, Jee Hong
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.2
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    • pp.55-59
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    • 2017
  • An optical method to inspect the 3-D shape of surface of Micro BGA is proposed, where spatially arranged LED light sources and specular reflection are considered. The reflected image captured by a vision system was analyzed to calculate the relative displacements of LED's in the image. Also, the statistics for all BGA's contained in a captured image are used together to find out the criteria for the detection of existing defects, and the usefulness of the proposed method is shown via experiments.

Development of an Accuracy-improved Vision Inspection System for BGA Solder Ball (정확도를 향상시킨 BGA 솔더볼 외관검사 기법 개발)

  • Huh, Kyung-Moo
    • Journal of the Institute of Electronics Engineers of Korea SC
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    • v.47 no.6
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    • pp.80-85
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    • 2010
  • BGA 409 chip currently the most as a visual inspection of the exterior inspection is conducted. Human depending on visual inspection of the exterior inspection of the current state of testers, depending on how the test results because the change is difficult to expect reliable results. Therefore, the challenges of visual inspection of BGA solder balls to improve the visual inspection technique was developed. However, BGA solder ball size of the microstructure and the characteristics of the distinction between hard test the accuracy of the fall orientation error has a problem. In this paper BGA solder balls exterior inspection of the accuracy to improve the edge detection algorithm, the complement of features and only the comparison proposed a pattern-matching techniques, based on the characteristics of spatial configuration of the area by improving the standard error of the orientation proposed improvements.

Research on the Effect of BGA Education Program on Brain Development -for kids- (BGA 교육 프로그램이 뇌 발달에 미치는 효과성 연구 -유아대상-)

  • Hong, Yang-Pyo;Bak, Ki-Ja
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.12 no.8
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    • pp.3497-3502
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    • 2011
  • This study was to examine the effectiveness of BGA education program by observing the pre and post brainwave measurement results of about W, S city kindergarten kids 200 (experimental group 100. comparative group 100) subjects who have shown brain quotient, in between the months of Jul. 2010 and Dec. 2010. As the brainwaves are adjusted by timeseries linear analysis, the result confirmed the differences of both brain quotient. The result of the study suggest BGA education program possibility in positively affecting the subjects' brain development.

Radio Frequency Circuit Module BGA(Ball Grid Array) (Radio Frequency 회로 모듈 BGA(Ball Grid Array) 패키지)

  • Kim, Dong-Young;Jung, Tae-Ho;Choi, Soon-Shin;Jee, Yong
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.37 no.1
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    • pp.8-18
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    • 2000
  • We presented a BGA(Ball Grid Array) package for RF circuit modules and extracted its electrical parameters. As the frequency of RF system devices increases, the effect of its electrical parasitics in the wireless communication system requires new structure of RF circuit modules because of its needs to be considered of electrical performance for minimization and module mobility. RF circuit modules with BGA packages can provide some advantages such as minimization, shorter circuit routing, and noise improvement by reducing electrical noise affected to analog and digital mixed circuits, etc. We constructed a BGA package of ITS(Intelligent Transportation System) RF module and measured electrical parameters with a TDR(Time Domain Reflectometry) equipment and compared its electrical parasitic parameters with PCB RF circuits. With a BGA substrate of 3${\times}$3 input and output terminals, we have found that self capacitance of BGA solder ball is 68.6fF, and self inductance 146pH, whose values were reduced to 34% and 47% of the value of QFP package structure. S11 parameter measurement with a HP4396B Network Analyzer showed the resonance frequency of 1.55GHz and the loss of 0.26dB. Routing length of the substrate was reduced to 39.8mm. Thus, we may improve electrical performance when we use BGA package structures in the design of RF circuit modules.

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Development of Atmospheric Pressure Plasma Equipment and It's Application to Flip Chip BGA Manufacturing Process (대기압 플라즈마 설비 개발 및 Flip Chip BGA 제조공정 적용)

  • Lee, Ki-Seok;Ryu, Sun-Joong
    • Journal of the Semiconductor & Display Technology
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    • v.8 no.2
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    • pp.15-21
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    • 2009
  • Atmospheric pressure plasma equipment was successfully applied to the flip chip BGA manufacturing process to improve the uniformity of flux printing process. The problem was characterized as shrinkage of the printed flux layer due to insufficient surface energy of the flip chip BGA substrate. To improve the hydrophilic characteristics of the flip chip BGA substrate, remote DBD type atmospheric pressure plasma equipment was developed and adapted to the flux print process. The equipment enhanced the surface energy of the substrate to reasonable level and made the flux be distributed over the entire flip chip BGA substrate uniformly. This research was the first adaptation of the atmospheric pressure plasma equipment to the flip chip BGA manufacturing process and a lot of possible applications are supposed to be extended to other PCB manufacturing processes such as organic cleaning, etc.

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Effect of Underfill on $\mu$BGA Reliability ($\mu$BGA 장기신뢰성에 미치는 언더필영향)

  • 고영욱;신영의;김종민
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • pp.138-141
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    • 2002
  • There are continuous efforts in the electronics industry to a reduced electronic package size. Reducing the size of electronic packages can be achieved by a variety of means, and for ball grid array(BGA) packages an effective method is to decrease the pitch between the individual balls. Chip scale package(CSP) and BGA are now one of the major package types. However, a reduced package size has the negative effect of reducing board-level reliability. The reliability concern is for the different thermal expansion rates of the two-substrate materials and how that coefficient CTE mismatch creates added stress to the BGA solder joint when thermal cycled. The point of thermal fatigue in a solder joint is an important factor of BGA packages and knowing at how many thermal cycles can be ran before failure in the solder BGA joint is a must for designing a reliable BGA package. Reliability of the package was one of main issues and underfill was required to improve board-level reliability. By filling between die and substrate, the underfill could enhance the reliability of the device. The effect of underfill on various thermomechanical reliability issues in $\mu$BGA packages is studied in this paper.

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A Study on Alignment and Inspection of BGA(Ball Grid Array) (BGA(Ball Grid Array)의 정렬 및 검사에 관한 연구)

  • Cho, Tai-Hoon;Choi, Young-Kyu
    • Proceedings of the Korea Information Processing Society Conference
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    • pp.1237-1240
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    • 2001
  • 최근 제품의 초소화와 반도체의 고집적화로, 작은 크기로 많은 리드를 제공하기 위해, 부품 밑면에 격자형태로 볼이 배열되어 있는 BGA나 CSP부품들이 최근 많이 이용되고 있다. 하지만, BGA는 한번 PCB에 장착되면, 볼 외관검사가 원천적으로 불가능하므로, 부품을 장착하기 전에 볼 품질의 검사와 부품의 정밀한 위치 및 각도의 측정이 요구된다. 본 논문에서는 BGA부품의 위치 및 각도를 추출하기 위한 방법과 볼을 검사하기 위한 알고리즘을 소개한다.

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Ultra-precision Singulation of Micro BGA using Multi Blade (멀티블레이드를 이용한 Micro BGA의 초정밀 싱귤레이션)

  • 김성철;이은상;이해동
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • pp.861-864
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    • 1997
  • Singulation is a process that cutting for separating a chip individually after finishing packaging process(micro BGA etc.). For shortening the process of singulation, we proposed the singulation using multi-blade. This paper introduced a method of multi-blade singulation and investigated a result of application and problems. The efficiency of singulation process was improved five times better than the single-blade by the singulation using Multi-blade.

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${\mu}$BGA and ${\mu}$Spring Packages for Rambus DRAM Applications and Their Electrical Characteristics (Rambus DRAM실장용 ${mu}!$BGA (Ball Grid Array) 및 ${mu}!$Spring 패키지와 전기적 특성)

  • Kim, Jin-Seong;Yu, Yeong-Gap
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.38 no.4
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    • pp.243-250
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    • 2001
  • This paper presents the structure of a $\mu$Spring package, its fabrication process and an analysis of its electrical characteristics compared to that of a $\mu$BGA. It was found that both $\mu$BGA and $\mu$Spring packages provide with outstanding high speed signal transmission characteristics due to their lower inductance of package interconnection lines, smaller than half of inductance of TSOP package lines. Even the worst case substrate trace of a Rambus DRAM $\mu$Spring package yields the line inductance of 2.9nH, which provides with 25% margin compared to the Rambus DRAM specification of 4nH. The fabrication cost of $\mu$Spring package is lower than that of $\mu$BGA by 50%, passes 1000 thermal cycles, meets JEDEC Level 1 specification whereas $\mu$BGA does not, and thereby yields high reliability and strong competing power.

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