• Title, Summary, Keyword: Convergence and Integration

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The Empirical Evidence on Government Bond Market Integration in East Asia

  • Liu, Lian
    • East Asian Economic Review
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    • v.20 no.1
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    • pp.37-65
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    • 2016
  • This research intends to investigate the progress made in East Asian bond market integration thus far. Price-based measures (AAD indicator and beta-convergence measure), quantity-based measures and econometric techniques (co-integration test, error correction model based Granger causality test) are employed in the analysis. Even though East Asian government bond markets have become more integrated since 2001, the differentials among the markets still remain significantly high. The bond market integration process seems slow. The convergence of bond markets sped up in 2003 and after the 2008 world financial crisis, implying the important role of government policies in integrating the regional bond markets. East Asian bond market integration may need more government-directed measures.

Antecedents of Employees' Knowledge Integration Capability and Its Effects on Knowledge Creation: Focused on Convergence-Oriented Organizations (조직구성원의 지식통합 역량에 대한 선행 요인과 지식창출 효과에 관한 연구: 융합 지향 조직을 중심으로)

  • Hong, Jinwon;Suh, Woojong
    • Knowledge Management Research
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    • v.15 no.4
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    • pp.105-126
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    • 2014
  • Knowledge integration is becoming a primary function of improving organizational capabilities and performance in today's convergence paradigm. The knowledge integration capability of employees has increasingly been regarded as a critical source for developing new products and services. This study investigates the influential factors of employees' knowledge integration capability and its effects. A theoretical research model was developed based on the socio-technical perspective and information processing theory. The model includes teamwork quality, expertise, IT support, and knowledge complexity as the primary influential factors of employees' knowledge integration capability. A large-scale survey was conducted for gathering data (a total of 316 samples from 141 organizations) to test the proposed model. The test results of the hypotheses show that expertise and knowledge complexity are the significant influential factors of employees' knowledge integration capability, and also the capability has a positive effect on the knowledge creation performance of employees. Our findings contribute to the development of initiatives for promoting employees' knowledge integration capability, especially in knowledge intensive organizations focusing on convergence products and services.

A Mobile Application Plan of The Construction CALS (건설사업정보시스템의 모바일 기술 적용 방안)

  • Ok, Hyun;Kim, Young-Jin;Yang, Sung-Hoon;Kim, Jin-Uk
    • Proceedings of the Korean Society of Computer Information Conference
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    • pp.415-416
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    • 2014
  • 본 연구에서는 ICT 기술특성을 건설 전 생애주기에 걸쳐 활용하여 미래 건설 환경 변화에 신속하게 대응하고, 시간과 장소에 구애 받지 않고 실시간 현장 업무를 지원할 수 있도록 건설사업정보시스템(CALS)의 하위 업무시스템인 건설사업관리시스템, 시설물유지관리시스템, 건설인허가시스템, 용지보상시스템에 모바일 기술을 적용하는 스마트화 방안을 제시하였다.

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Novel Bumping and Underfill Technologies for 3D IC Integration

  • Sung, Ki-Jun;Choi, Kwang-Seong;Bae, Hyun-Cheol;Kwon, Yong-Hwan;Eom, Yong-Sung
    • ETRI Journal
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    • v.34 no.5
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    • pp.706-712
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    • 2012
  • In previous work, novel maskless bumping and no-flow underfill technologies for three-dimensional (3D) integrated circuit (IC) integration were developed. The bumping material, solder bump maker (SBM) composed of resin and solder powder, is designed to form low-volume solder bumps on a through silicon via (TSV) chip for the 3D IC integration through the conventional reflow process. To obtain the optimized volume of solder bumps using the SBM, the effect of the volumetric mixing ratio of resin and solder powder is studied in this paper. A no-flow underfill material named "fluxing underfill" is proposed for a simplified stacking process for the 3D IC integration. It can remove the oxide layer on solder bumps like flux and play a role of an underfill after the stacking process. The bumping process and the stacking process using the SBM and the fluxing underfill, respectively, for the TSV chips are carefully designed so that two-tier stacked TSV chips are sucessfully stacked.

Operational Properties of Ridge Waveguide Lasers with Laterally Tapered Waveguides for Monolithic Integration

  • Kwon, Oh-Kee;Kim, Ki-Soo;Sim, Jae-Sik;Baek, Yong-Soon
    • ETRI Journal
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    • v.29 no.6
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    • pp.811-813
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    • 2007
  • We report on a ridge waveguide laser diode with laterally tapered waveguides fabricated in a single growing step using a double patterning method. In this structure, nearly constant output power is obtained with the change of the lower tapered waveguide width, and the facet power ratio of 1.4 to 1.5 is observed over the current range. The asymmetric facet power property is also investigated.

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Quantitative Tests for Income Level Convergence in Asian Countries

  • Tejero, Wilma Milo;Hwang, Jinyoung
    • Asia-Pacific Journal of Business
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    • v.10 no.1
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    • pp.1-11
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    • 2019
  • Asian countries have been striving for economic integration for decades. This effort may lead to the convergence of income level through externalities across countries. This paper investigates whether the convergence phenomenon holds for income levels in Asian countries for the periods between 1975-2015 applying the traditional methodology of ${\sigma}-$ and ${\beta}-convergence$. Although the absolute ${\beta}-convergence$ of income levels in Asian and ASEAN+3 countries do hold, ${\sigma}-convergence$ and conditional ${\beta}-convergence$ of income level generally do not exist. This suggests that the benefits of economic integration in Asian countries were not yet realized to be significant. A plausible explanation is that the economies of Asian countries are largely based on low trade openness and a high level of informal economy.

A Study on integration methodology for linking between the Owners' system and KONEPS in Public Construction Project (공공건설사업에서 발주청 내부시스템과 국가종합전자조달시스템간의 연계 방안 연구)

  • Kim, Seong-Jin;Kim, Nam-Gon
    • Proceedings of the Korea Information Processing Society Conference
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    • pp.1352-1353
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    • 2012
  • 본 연구는 지방국토관리청의 시설공사의 계약 체결과 기성 준공금 지급 업무를 대상으로 발주청 내부시스템과 국가종합전자조달시스템간의 연계를 위한 업무절차 개선방안을 마련하고 관련 기능을 개발함으로서 건설사의 계약 및 기성 업무처리의 효율성을 제고하고자 한다.

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Application Method of Big-Data for Improvement for Construction Project Management System (빅 데이터 기반 건설사업정보시스템 기능 개선 방안 연구)

  • Kim, Jin-Uk;Kim, Young-Jin;Ok, Hyun;Yang, Sung-Hoon
    • Proceedings of the Korean Society of Computer Information Conference
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    • pp.301-303
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    • 2015
  • 국내 건설행정 투명화 및 경쟁력 향상 목적으로 개발된 건설사업정보시스템에 정부와 운영주체는 다양한 기능개선 방안과 관련 연구를 수행하며 시스템 성능을 개선시켜왔다. 그러나 기 추진된 성능향상 방안이 공공업무 처리에 중점 되어 대국민 사용자를 위한 콘텐츠 및 기능 등의 서비스가 미흡한 상황이다. 이에 본 논문에서는 건설사업정보 건설인허가시스템의 도로점용장소별 허가현황 기능을 중심으로 빅 데이터를 이용한 허가현황 정보 제공 방안을 제안하였다. 제안한 기능개선 방안은 기 구축된 비정형 데이터를 빅 데이터 기반으로 재분석하여 구글 맵에 가시화함으로써 공공업무 데이터 처리 뿐만 아니라 대국민 서비스를 위한 콘텐츠 제공이 가능하도록 하였다. 뿐만 아니라 그동안 축적된 15TB이상의 건설관련 데이터의 재활용 가능성을 시사함으로써 시스템 활용성 증대 및 개편 방향에 도움이 될 것으로 판단된다.

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