• Title, Summary, Keyword: Copper Sulfate

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Experimental Determination of Equilibrium Constants of Copper Complexes in Aqueous Environment

  • Cho, Young-Il
    • Journal of Environmental Science International
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    • v.21 no.5
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    • pp.555-562
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    • 2012
  • The experimental determination of equilibrium constants is required to estimate concentrations of reagents and/or products in environmental chemical reactions. For an example, the choice of copper (Cu) complexation reactions was motivated by their fast kinetics and the ease of measurement of Cu by an ion-sensitive electrode. Each individual titrant of sulfate ($SO{_4}^{2-}$) and oxalate ($C_2O{_4}^{2-}$) was expected to have its own unique characteristics, depending on the bonding in Culigands connected to the aqueous species. The complexation reaction of Cu with $SO{_4}^{2-}$ somewhat fast reached equilibrium status compared with $C_2O{_4}^{2-}$. The experimental equilibrium constants ($K_{eq}$) of copper sulfate ($CuSO_4$) and copper oxalate ($CuC_2O_4$) were determined $10^{2.2}$ and $10^{3{\sim}4.3}$, respectively.

Influence of counter anions on metal separation and water transport in electrodialysis treating plating wastewater

  • Oh, Eunjoo;Kim, Joohyeong;Ryu, Jun Hee;Min, Kyung Jin;Shin, Hyun-Gon;Park, Ki Young
    • Membrane Water Treatment
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    • v.11 no.3
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    • pp.201-206
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    • 2020
  • Electrodialysis (ED) is used in wastewater treatment, during the processing and recovery of beneficial materials, to produce usable water. In this study, sulfate and chlorine ions, which are the anions majorly used for electroplating, were studied as factors affecting the recovery of copper, nickel and water from wastewater by electrodialysis. Although the removal rates of copper and nickel ions were slightly higher with the use of chlorine ions than of sulfate ions, the removal efficiencies were above 99.9% under all experimental conditions. The metal ions of the plating wastewater flowed through the ion exchange membrane of the diluate tank and the concentrate tank while all the water moved together due to electro-osmosis. The migration of water from the diluate tank to the concentrate tank was higher in the presence of a monovalent chloride ion compared to that of a divalent sulfate ion. When sulfate was the anion used, the recoveries of copper and nickel increased by about 25% and 30%, respectively, as compared to the chloride ion. Therefore, when divalent ions such as sulfate are present in the electrodialysis, it is possible to reduce the movement amount of water and highly concentrate the copper and nickel in the plating wastewater.

An Investigation on the Patination of Copper in Acidic Copper Sulfate Solution (산성황산동 용액 내에서 동판위에 녹청 형성에 관한 기초적 조사)

  • 윤승열
    • Journal of the Korean institute of surface engineering
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    • v.5 no.3
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    • pp.77-85
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    • 1972
  • A method of preparation of synthetic ignorgaic coating on copper (patina) has been presented . An Eh--pH diagram was constructed for the present Cu-H2O-SO$_4$ system using the most recently available thermodynamic data. In the path of the patination at room temperature the general behaviour of copper in acidic copper sulfate solutions with potassium chlorate as an oxidizing agent appeared to follow those predictable in this Eh-pH diagram. In the presence 0.05 molar cupric sulfate at a temperature of about 28$^{\circ}C$ a green brochantite (CuSO$_4$$.$3Cu(OH)$_2$) layer was formed on copper sheet in 20 days. In a solution having an initial pH of 3.5 the development of a brochantite coating has been observed to take place in two stages. In the first, a layer of cuprous oxide formed on the copper at a relatively rapid rate. In the ensuing step the outer layer of cuptrite was oxidized at much slower rate to form brochantite. The syntetic coatings appeared to consist of crystal-lites of brochanitite growing perpendicular to the cuprose oxide surface. The outer tips of the -crystallites were reasily broken off and gave to the layer a rather chalky character. Underneath, at the brochantite Cu$_2$O interface, however, the green layers were firmely attached. The effect of reagent concentration , solution agitation , and moderate temperature increase were investigated to improve the quality of coating. So also in a qualitative way were the effect of light.

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Effect of Additives on the Hardness of Copper Electrodeposits in Acidic Sulfate Electrolyte (황산구리 전착에서의 첨가제가 구리전착층의 경도에 미치는 영향)

  • Min, Sung-Ki;Lee, Jeong-Ja;Hwang, Woon-Suk
    • Corrosion Science and Technology
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    • v.10 no.4
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    • pp.143-150
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    • 2011
  • Copper electroplating has been applied to various fields such as decorative plating and through-hole plating. Technical realization of high strength copper preplating for wear-resistant tools and molds in addition to these applications is the aim of this work. Brighters and levelers, such as MPSA, Gelatin, Thiourea, PEG and JGB, were added in copper sulfate electrolyte, and the effects of these organic additives on the hardness were evaluated. All additives in this work were effective in increasing the hardness of copper electrodeposits. Thiourea increased the hardness up to 350 VHN, and was the most effective accelarator in sulfate electrolyte. It was shown from the X-ray diffraction analysis that preferred orientation changed from (200) to (111) with increasing concentration of organic additives. Crystallite size decreased with increasing concentration of additive. Hardness was increased with decreasing crystallite size, and this result is consistent with Hall-Petch relationship, and it was apparent that the hardening of copper electrodeposits results from the grain refining effect.

Studies on Utilization of Chitosan for Fixation of Copper Compound in Wood Preservative Treatment (목재방부리(木材防腐理)에 있어서 구리화합물(化合物) 정착제(定着濟)로서 키토산 이용(利用)에 관한 연구(硏究))

  • Lee, Jong-Shin
    • Journal of the Korean Wood Science and Technology
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    • v.25 no.4
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    • pp.92-98
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    • 1997
  • To make good use of chitosan forming complex with heavy metals in wood preservative treatment, woods impregnated with chitosan and copper sulfate were prepared. Amounts of leached copper, decay resistance, anti-mold efficacy, iron corrosion rates, moisture regain rates and degradation pattern in chitosan pre-treated and untreated wood were compared. After leaching test, amounts of leached copper from chitosan pre-treated wood had a much smaller than chitosan untreated wood, and good decay resistance was retained even after leaching test. From these results, it was proved that chitosan-copper complex formed in wood played and important role for decay durability. In chitosan pre-treated wood, damage values by test molds became remarkably smaller, but the growth of test molds was not perfectly inhibited. Distinct differences in iron corrosion rates between chitosan pre-treated and untreated woods was not recognized but chitosan pre-treated wood showed the lower moisture regain rates than chitosan untreated wood because of water insoluble chitosan membrane formed in wood. After leaching test, the tracheid walls in the wood treated with 2.0% copper sulfate only were eroded by the fungal attacks, but those in the wood pre-treated with chitosan remained almost intact.

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Fabrication & Evaluation of electroplated Copper Foils for Printed Circuit Board Applications (인쇄 배선용 전해동박의 제조에 관한 연구)

  • Yoon, Y. K.;Lee, J. H.
    • Journal of the Korean institute of surface engineering
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    • v.5 no.1
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    • pp.1-7
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    • 1972
  • Copper -clad laminate(CCL) was fabricated and evaluated by bonding 35${\pm}$5${\mu}$ thick electroplated copper foils with a suitable adhesive to an insulating base such as phenolic resin laminate. In this study, electroplating methods and conditions were studied to produced good quality copper foils for printed circuit board applications. The electroplating bath solutions used were a copper-sulfate solution and a concentrated copper fluoborate solution. A surface roughening treatment that improved the adhesive strength of copper foils with an insulating laminate was also developed . A conventional copper sulfate solution containing sulfuric acid was used for the roughening treatment.

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Transfer of Cupric Sulfate across Rat Small Intestine, in Vitro and Effect of Chelating Agents on It's Transfer

  • Kim, Chong-Kil;Choi, Seung-Gi;Rho, Young-Soo
    • Archives of Pharmacal Research
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    • v.11 no.2
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    • pp.81-86
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    • 1988
  • The transfer of cupric sulfate across the rat small intestine in vitro was studied by perfusion method using the segments of everted rat small intestine. Copper transport was approximately propotional to the metal concentration in the mucosal solution and no difference was observed in the metal transport among rat duodenum, jejunum and ileum. It was suggested from these results that copper transport across the rat small intestine would occur by passive diffusion. The effect of various chelating agents on copper transport across the rat small intestine n vitro and its uptake by the intestine were also studied. Copper transport was greatly enhanced in the presence of EDTA and NTA. Copper uptake decreased to a greater extent in the presence of EPTA and NTA.

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Effects of copper sulfate poisoning on the fine structure of rat liver (유산동(硫酸銅) 중독(中毒)이 랫트 간장(肝臟)의 미세구조(微細構造)에 미치는 영향(影響))

  • Yoon, Hwa-joong;Lee, Sang-mog;Jang, Byoung-joon
    • Korean Journal of Veterinary Research
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    • v.30 no.1
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    • pp.85-91
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    • 1990
  • This study was designed in order to investigate the effect of copper sulfate to the ultrastructural changes of the hepatocytes in Sprague Dawley rats. The animals were administered with copper sulfate (10mg/kg B.W.), which was dissolved in normal saline. The solution was injected into abdominal cavity every day. The animals were sacrificed at the 6th, 12th, and 24th day from the beginning of administration. The specimens obtained from the liver were observed with electron microscope and significant changes were as follows. 1. A prominent dilatation and disruption of the cisternae of rough endoplasmic reticulum were recognized. Also, the detachment of membrane bound ribosomes was shown. 2. The proliferation of smooth endoplasmic reticulum and the depletion of glycogen particles were noted. 3. The increase of primary lysosomes and autophagic vacuoles was obserbed. 4. The dilatation of mitochondrial cristae was obserbed. And it was irregulary scattered in the stroma of mitochondria. 5. The atrophy of microvilli in the bile canaliculi and space of Disse was prominent. 6. Membrane of hepatocytes was damaged and significant hydrophic degeneration was obserbed in the perisinusoidal regions. 7. The damage of Fat-storing cells was more significant than that of hepatocytes.

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Antibacterial efficacy and safety of copper sulfate pentahydrate to cultured fish (양식 어류에 있어서 황산동(copper sulfate pentahydrate)의 안전성과 살균효과에 대한 연구)

  • Heo, Gang-joon
    • Korean Journal of Veterinary Research
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    • v.37 no.1
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    • pp.203-212
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    • 1997
  • Antibacterial efficacy and safety of copper sulfate pentahydrate (5% solution) was evaluated in laboratory and field studies for disinfection of some fish bacterial pathogens in cultured fish, flounder(Paralichthys olivaceus), mirror carp(Cyprinus carpio), gold fish(Carrassius auratus) and eel(Anguilla japonica). Dipping of fishes for acute toxicity was performed for a period of 48h, and the TLm value(median tolerance limit) were 4.0ppm in mirror carp and flounder, 4.4ppm in rainbow trout, and 10.0ppm in gold fish. After exposure below than TLm value for 1 month, no side effects and histopathological changes were observed. The test drug were shown high antibacterial activities against most bacterial pathogens by exposure in the laboratory and field trials. However, Aeromonas salmonicida showed a resistance to the dosage. We can prevent outbreaks of bacterial diseases of fish by the dosage of 1ppm for 6hr and the test drug is thought to be used effectively and widely as a disinfectant against most bacterial fish pathogens.

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