• Title, Summary, Keyword: LTCC

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Packaging technology using LTCC (Low Temperature Cofired Ceramic)/LTCC-M (Low Temperature Cofired Ceramic on Metal) technologies (LTCC/LTCC-M 기술을 이용한 packaging technology)

  • 문제도
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • pp.3-6
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    • 2002
  • 본 논문에서는 LTCC 및 LTCC-M 기술에 관한 소개 및 그 기술을 이용한 응용 module 제작과 패키징 기술에 관하여 소개한다. 현재 microelectro-packaging 분야에서 연구가 활발히 진행되고 있는 SOP (System-On-a-Package) 패키징 기술을 구현하기위한 수동소자의 내부 실장과 LTCC/LTCC-M 기술을 이용한 패키징이나 소자 제작시 고려되어야 항목들에 대하여 언급하고 LTCC 기술의 응용 모듈 및 LTCC-M 기술의 응용 분야의 하나인 PDP 격벽 제조 기술에 관하여 소개한다.

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A Very Compact 60 GHz LTCC Power Amplifier Module (초소형 60 GHz LTCC 전력 증폭기 모듈)

  • Lee, Young-Chul
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.17 no.11
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    • pp.1105-1111
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    • 2006
  • In this paper, using low-temperature co-fired ceramic(LTCC) based system-in-package(SiP) technology, a very compact power amplifier LTCC module was designed, fabricated, and then characterized for 60 GHz wireless transmitter applications. In order to reduce the interconnection loss between a LTCC board and power amplifier monolithic microwave integrated circuits(MMIC), bond-wire transitions were optimized and high-isolated module structure was proposed to integrate the power amplifier MMIC into LTCC board. In the case of wire-bonding transition, a matching circuit was designed on the LTCC substrate and interconnection space between wires was optimized in terms of their angle. In addition, the wire-bonding structure of coplanar waveguide type was used to reduce radiation of EM-fields due to interconnection discontinuity. For high-isolated module structure, DC bias lines were fully embedded into the LTCC substrate and shielded with vias. Using 5-layer LTCC dielectrics, the power amplifier LTCC module was fabricated and its size is $4.6{\times}4.9{\times}0.5mm^3$. The fabricated module shows the gain of 10 dB and the output power of 11 dBm at P1dB compression point from 60 to 65 GHz.

LTCC/LTCC-M Technologies for Packaging and Module Fabrication

  • Moon, Je-Do
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • pp.33-49
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    • 2002
  • $\Box$ LTCC/LTCC-M technologies are a cost-effective SOP technology $\Box$ LTCC/LTCC-M materials have good RF characteristics and the materials can be used as excellent substrates for high band width applications $\Box$ Reliability of LTCC/LTCC-M package or module can be greatly improved by embedded passive technology and CTE control of the substrates $\Box$ To expand the application area, more development is needed in realization of embedded passives with tight tolerance

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Influence of WIP conditions on dimensional change of LTCC sheet (온간 정수압 공정 조건에 따른 LTCC sheet의 수축률)

  • Jeong, M.S.;Yoon, Y.H.;Rhim, S.H.;Yoon, S.M.;Oh, S.I.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • pp.507-511
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    • 2008
  • LTCC (Low Temperature Co-fired Ceramic) has been successfully applied to ceramic substrates for circuits and micro-fluidic systems and has proven its superior performance in a variety of applications. The prediction of shrinkage in LTCC process is an important for dimensional control of micro LTCC products which has influences on electronic characteristics. For avoiding the unpredictable shrinkage of LTCC during the sintering which makes accurate placement of the circuit devices difficult, pre-processes such as WIP (Warm Isostatic Pressing) and lamination must be modified. The objective of the present investigation is to establish a proper WIP conditions for near net shape fabrication of LTCC products. This paper discusses the influence of WIP conditions on the dimensional change of LTCC sheet. In the investigation, it is shown that the shrinkage values of sheets depend on WIP conditions and sheet directions. This work is a quantitative evaluation of the effect of WIP pressure on shrinkage of LTCC sheet. Additionally, the results show anisotropic shrinkage behaviour of sheet during LTCC process.

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LTCC 적층 필터 동향

  • 황희용
    • The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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    • v.14 no.3
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    • pp.50-57
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    • 2003
  • 현재의 LTCC 필터는 주파수 대역이나 서비스의 종류에 따라서 다르지만 대개 LPF, BPF, x-plexer 등 단품에서 Balun, Antenna, Coupler, RF-lC Chip, Matching회로 등과의 복합부품화, 복합모듈화의 형태로 진행되고 있다. LTCC기술을 간단히 요약하고 LTCC 필터 설계의 주요 측면을 살펴본 후, 휴대 단말기 분야뿐 아니라 최근의 2.4 GHz, 5.2 GHz, 5.8 GHz의 WLAN의 LTCC 필터, Waveguide형 LTCC 필터, Module화 등의 예를 보인다. 최신의 시장 예측기관의 조사 자료도 같이 살펴보고 향후 전망을 해 본다.

Effects of ZnO Composition on the Thermal Emission Properties for LTCC Type of High Power LED Package (고전력 LED용 적층형 LTCC 패키징의 ZnO 조성 변화가 방열 특성에 미치는 영향)

  • Kim, Woojeong;Kim, Hyung Soo;Shin, Daegyu;Lee, Hee Chul
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.4
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    • pp.79-83
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    • 2012
  • LTCC (Low temperature co-fired ceramic) package have been paid much attention due its good reliability, miniaturization, and application of silver paste with complex wiring and printing. Therefore, LTCC package has been expected to replace vulnerable plastic package in the field of high power LED device. Currently, LTCC ceramic package is mainly made up of aluminum oxide powder. In this study, zinc oxide powder is added or replaced for the fabrication of LTCC ceramic body. By adding small amount of ZnO, thermal conductivity of the LTCC ceramic body could be remarkably increased by 25% leading to the extension of LED life time. The LTCC package structure with composition including ZnO has an increased thermal flux by 56% as a result of ANSYS simulation. Actually, the fabricated LED package with the addition of ZnO exhibits a decreased thermal resistivity by 14.9%.

Warpage of Co-fired High K/Low K LTCC Substrate (고유전율/저유전율 LTCC 동시소성 기판의 휨 현상)

  • Cho, Hyun-Min;Kim, Hyeong-Joon;Lee, Chung-Seok;Bang, Kyu-Seok;Kang, Nam-Kee
    • Journal of the Microelectronics and Packaging Society
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    • v.11 no.3
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    • pp.77-82
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    • 2004
  • In this paper, warpages of heterogeneous LTCC substrates comprised of high K/low K hi-layered structure were investigated. The effect of glass content in high K LTCC layer on the warpage of substrate during co-firing process was examined. Shrinkage and dielectric properties of high K and low K green sheets were measured. In-situ camber observation by hot stage microscopy showed different camber development of heterogeneous LTCC substrates according to glass content in high K green sheet. High K green sheet containing $50\%$ glass was matched to low K green sheet in the shrinkage. Therefore, LTCC substrate of Low K/High K+$50\%$ glass structure showed flat surface after sintering.

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Design and Implementation of Miniature VCO using LTCC Technique (LTCC 기법을 이용한 초소형 VCO 설계 및 구현)

  • 김태현;권원현;이영훈
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.14 no.11
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    • pp.1176-1183
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    • 2003
  • In this paper, miniature voltage-controlled oscillator(VCO) for 1.6 ㎓ PCS band is designed and implemented using the LTCC technique. Circuit level design using commercial components is performed, and passive L, C elements embedded in LTCC substrate is optimized by simulation tools. Embedded passive components are modeled into equivalent circuits and their circuit parameters are extracted for circuit simulation. Utilizing the designed embedded passive elements and 21 layers LTCC substrate, VCO with 4.0${\times}$4.0${\times}$1.6 ㎣ dimensions is designed and fabricated. Developed VCO operates in 2.7 V with 8.5 ㎃ current consumption. The phase noise performance of VCO is below -112.61 ㏈c/㎐ at 100 ㎑ offset and harmonic suppression characteristics is measured above -30 ㏈.

A Study on the Thermal Behaviour of Via Design in the Ceramic Package (세라믹 패키지 내에서 비아에 따른 열적 거동에 관한 연구)

  • 이우성;고영우;유찬세;김경철;박종철
    • Journal of the Microelectronics and Packaging Society
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    • v.10 no.1
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    • pp.39-43
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    • 2003
  • Thermal management is very important for the success of high density circuit design in LTCC. In this paper, LTCC substrates containing thermal via and pad were fabricated in order to study the influence of the thermal dissipation. To realize the accurate thermal analysis for structure design, a series of simple thermal conductivity measurement by laser flash method and parametric numerical analysis have been carried out. The LTCC substrate including via and Ag pad has good thermal conductivity over 103 W/mK which is 44% value of pure Ag material. Thermal behaviors with via arrays, size and density in the LTCC substrate were studied by numerical method.

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