• Title, Summary, Keyword: MEMS

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Low Pull-in Voltage MEMS Switches for Wireless Applications (저전압구동 무선통신용 MEMS 스위치)

  • Shim, Dong-Ha;Lee, Moon-Chul;Lee, Eun-Sung;Park, Sun-Hee;Kim, Young-Il;Song, In-Sang
    • Proceedings of the KIEE Conference
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    • pp.1969-1971
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    • 2002
  • This paper presents the design and performance of low pull-in voltage MEMS switches for commercial cellular/PCS applications. The switches have all-metal (3 ${\mu}m$ thick Au) movable plates over CPW(Coplanar Waveguide) transmission line. The stress gradient in a movable plate is considered in mechanical design to obtain an accurate pull-in voltage. Series metal-to-metal contact switches are fabricated and evaluated. Those switches exhibit the low loss(<0.2 dB @1.9 GHz) with good isolation(55 dB @1.9 GHz).

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Recent Trends of MEMS Packaging and Bonding Technology (MEMS 패키징 및 접합 기술의 최근 기술 동향)

  • Choa, Sung-Hoon;Ko, Byoung Ho;Lee, Haeng-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.4
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    • pp.9-17
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    • 2017
  • In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.

Analysis on Effects of Design Variable Uncertainty on the Performance of MEMS Gyroscope Based on Sample Statistics (샘플 통계에 근거한 MEMS 자이로스코프의 설계변수 불확정성이 성능에 미치는 영향 분석 방법)

  • Kim, Yong-Woo;Yoo, Hong-Hee
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • pp.119-123
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    • 2009
  • Recently, a MEMS gyroscope has been broadly fabricated and used due to development of a micromachining. However, there is a difference between the modeling design and the actual product and this difference can lead to the performance variation of a MEMS gyroscope. A classical design method does not exactly estimate the performance of a MEMS gyroscope. Therefore a design process considering the design variable uncertainty has to be employed to design MEMS gyroscope model. In this paper, the equation of motion of a MEMS gyroscope model is obtained to analyze the performance of a MEMS gyroscope and the effects of the design variables on the MEMS gyroscope performance are investigated. Finally the performance of MEMS gyroscope is estimated through a statistical analysis based on sample statistics.

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Deformation Behavior of MEMS Gyroscope Package Subjected to Temperature Change (온도변화에 따른 MEMS 자이로스코프 패키지의 미소변형 측정)

  • Joo Jin-Won;Choi Yong-seo;Choa Sung-Hoon;Kim Jong-Seok;Jeong Byung-Gil
    • Journal of the Microelectronics and Packaging Society
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    • v.11 no.4
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    • pp.13-22
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    • 2004
  • In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temperature change is investigated using high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compound and the PCB. Detailed global and local deformations of the package by temperature change are investigated, concerning the variation of natural frequency of MEMS gyro chip.

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MEMS TUNING ELEMENTS FOR MICRO/MILLIMETER-WAVE POWER AMPLIFIERS (마이크로/밀리미터파 대역에서 전력증폭기의 효율향상을 위한 MEMS 튜닝회로)

  • Kim, Jae-Heung
    • Proceedings of the Korea Electromagnetic Engineering Society Conference
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    • pp.118-121
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    • 2003
  • A new approach, using MEMS, for improving the performance of high efficiency amplifiers is proposed in this paper. The MEMS tuning element is described as a variable-length shorted CPW stub. Class-E amplifiers can be optimally tuned by these MEMS tuning elements because their operation varies with the impedance of the output tuning circuit. A MEMS tuning element was simulated using full-wave EM simulators to obtain its S-parameters. A Class-E amplifier with the MEMS was designed at 8GHz. The non-linear operation of this amplifier was simulated to explore the effect of the MEMS tuning. Comparing the initially designed amplifier without MEMS, the Power Added Efficiency (PAE) of the amplifier with MEMS is improved from 46.3% to 66.9%. For the amplifier with MEMS, the nonlinear simulation results are PAE = 66.90%, $\eta$(drain efficiency) = 75.89%, and $P_{out}$ = 23.37 dBm at 8 GHz. In this paper, the concept of the MEMS tuning element is successfully applied to the Class E amplifier designed with transmission lines.

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An Availability of Low Cost Sensors for Machine Fault Diagnosis

  • SON, JONG-DUK
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • pp.394-399
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    • 2012
  • In recent years, MEMS sensors show huge attraction in machine condition monitoring, which have advantages in power, size, cost, mobility and flexibility. They can integrate with smart sensors and MEMS sensors are batch product. So the prices are cheap. And the suitability of it for condition monitoring is researched by experimental study. This paper presents a comparative study and performance test of classification of MEMS sensors in target machine fault classification by 3 intelligent classifiers. We attempt to signal validation of MEMS sensor accuracy and reliability and performance comparisons of classifiers are conducted. MEMS accelerometer and MEMS current sensors are employed for experiment test. In addition, a simple feature extraction and cross validation methods were applied to make sure MEMS sensors availabilities. The result of application is good for using fault classification.

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Development of Design Software for MEMS integrating Commercial Codes: DS/MEMS (상용코드 통합을 통한 미소기전집적시스템의 설계 소프트웨어 개발:DS/MEMS)

  • 허재성;이상훈;곽병만
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.11
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    • pp.180-187
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    • 2003
  • A CAD-based seamless design system for MEMS named DS/MEMS was developed which performs coupled-field analysis, optimal and robust design. DS/MEMS has been developed by means of integrating commercial codes and inhouse code-SolidWorks, FEMAP, ANSYS and CA/MEMS. This strategy results in versatility that means to include various analysis model, corresponding analyses and approximated design sensitivity analysis and user friendliness that design variables are taken to be selectable directly from a CAD model, that the problem is formulated under a window environment and that the manual job during optimization process is almost eliminated. DS/MEMS works on a parametric CAD platform, integrating CAD modeling, analysis, and optimization. Nonlinear programming algorithms, the Taguchi method, and response surface method are made available for optimization. One application problem is taken to illustrate the proposed methodology and show the feasibility of DS/MEMS as a practical tool.