• Title, Summary, Keyword: Multi-Chip Microsystems

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Fabrication of Multi-layered Macroscopic Hydrogel Scaffold Composed of Multiple Components by Precise Control of UV Energy

  • Roh, Donghyeon;Choi, Woongsun;Kim, Junbeom;Yu, Hyun-Yong;Choi, Nakwon;Cho, Il-Joo
    • BioChip Journal
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    • v.12 no.4
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    • pp.280-286
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    • 2018
  • Hydrogel scaffolds composed of multiple components are promising platform in tissue engineering as a transplantation materials or artificial organs. Here, we present a new fabrication method for implementing multi-layered macroscopic hydrogel scaffold composed of multiple components by controlling height of hydrogel layer through precise control of ultraviolet (UV) energy density. Through the repetition of the photolithography process with energy control, we can form several layers of hydrogel with different height. We characterized UV energy-dependent profiles with single-layered PEGDA posts photocrosslinked by the modular methodology and examined the optical effect on the fabrication of multi-layered, macroscopic hydrogel structure. Finally, we successfully demonstrated the potential applicability of our approach by fabricating various macroscopic hydrogel constructs composed of multiple hydrogel layers.

Microfabrication of Microwave Transceivers for On-Chip Near-Field Electromagnetic Shielding Characterization of Electroplated Copper Layers (극소형 전자기파 송수신기의 제작 및 전기도금된 구리박막의 칩단위 근접 전자기장 차폐효과 분석)

  • Gang, Tae-Gu;Jo, Yeong-Ho
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.25 no.6
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    • pp.959-964
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    • 2001
  • An experimental investigation on the near-field electromagnetic loss of thin copper layers has been presented using microfabricated microwave transceivers for applications to multi-chip microsystems. Copper layers in the thickness range of 0.2$\mu$m∼200$\mu$m have been electroplated on the Pyrex glass substrates. Microwave transceivers have been fabricated using the 3.5mm$\times$3.5mm nickel microloop antennas, electroformed on the silicon substrates. Electromagnetic radiation loss of the copper layers placed between the microloop transceivers has been measured as 10dB∼40dB for the wave frequency range of 100MHz∼1GHz. The 0.2$\mu$m-thick copper layer provides a shield loss of 20dB at the frequencies higher than 300MHz, whereas showing a predominant decreases of shield loss to 10dB at lower frequencies. No substantial increase of the shield effectiveness has been found for the copper shield layers thicker that 2 $\mu$m.