• Title, Summary, Keyword: Photoresist

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Modeling and Simulation of Electron-beam Lithography Process for Nano-pattern Designs using ZEP520 Photoresist (ZEP520 포토리지스트를 이용한 나노 패턴 형성을 위한 전자빔 리소그래피 공정 모델링 및 시뮬레이션)

  • Son, Myung-Sik
    • Journal of the Semiconductor & Display Technology
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    • v.6 no.3
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    • pp.25-33
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    • 2007
  • A computationally efficient and accurate Monte Carlo (MC) simulator of electron beam lithography process, which is named SCNU-EBL, has been developed for semiconductor nanometer pattern design and fabrication. The simulator is composed of a MC simulation model of electron trajectory into solid targets, an Gaussian-beam exposure simulation model, and a development simulation model of photoresist using a string model. Especially for the trajectories of incident electrons into the solid targets, the inner-shell electron scattering of an target atom and its discrete energy loss with an incident electron is efficiently modeled for multi-layer resists and heterogeneous multi-layer targets. The simulator was newly applied to the development profile simulation of ZEP520 positive photoresist for NGL(Next-Generation Lithography). The simulation of ZEP520 for electron-beam nanolithography gave a reasonable agreement with the SEM experiments of ZEP520 photoresist.

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Development of the DIW-$O_3$ Cleaning Technology Substituted for the Semiconductor Photoresist Strip Process using the SPM (SPM을 이용한 반도체 포토레지스트 제거 공정 대체를 위한 DIW-$O_3$ 방식 세정기술 개발)

  • Son, Yeong-Su;Ham, Sang-Yong
    • 연구논문집
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    • pp.99-109
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    • 2003
  • Recently the utilization of the ozone dissolved de-ionized water(DIW-$O_3$) in semiconductor wet cleaning process and photoresist stripping process to replace the conventional sulfuric acid and hydro peroxide mixture(SPM) method has been studied. In this paper, we propose the water-electrode type ozone generator which has the characteristics of the high concentration and purity to produce the high concentration DIW-$O_3$ for the photoresist strip process in the semiconductor fabrication. The proposed ozone generator has the dual dielectric tube structure of silent discharge type and the water is both used to electrode and cooling water. Through this study, we obtained the results of the 10.3 wt% of ozone gas concentration at the oxygen gas of 0.5 [liter/min.] and the DIW-$O_3$ concentration of 79.5 ppm.. Through the photoresist stripping test using the produced DIW-$O_3$, we confirmed that the photoresist coated on the silicon wafer was removed effectively in the 12 minutes.

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Preparation and Properties of Water-Soluble Photosensitive Polymer with Azido Group (Azido기를 함유한 수용성 포토레지스트 제조 및 감광 특성)

  • Yoon, Keun-Byoung;Lee, Joon-Tae;Han, Jeong-Yeop;Lee, Dong-Ho
    • Polymer Korea
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    • v.31 no.5
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    • pp.374-378
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    • 2007
  • Water-soluble terpolymer of acrylamide, diacetone acrylamide, and acrylic acid was prepared by redox initiators in aqueous medium. One component photoresist was synthesized by reaction of terpolymer with 4-azidoaniline. By blending the aqueous acrylamide/diacetone acrylamide copolymer solution with bisazide, 4,4'-diazidostilbene -2,2'-disulfuric acid sodium salt, two component photoresist was prepared. The photosensitivity per azido group unit mole of one component photoresist was 4 times higher than that of two component photoresist. The dot-type pattern was successfully achieved with one component photoresist at low exposure energy, which is prospective to be used as black matrix negative photoresist.

Shape Error and Its Compensation in the Fabrication of Microlens Array Using Photoresist Thermal Reflow Method (Photoresist thermal reflow 방법을 이용하여 제작한 마이크로렌즈 어레이의 형상 관련 오차 및 이에 대한 보정)

  • Kim, Sin Hyeong;Hong, Seok Kwan;Lee, Kang Hee;Cho, Young Hak
    • Journal of the Microelectronics and Packaging Society
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    • v.20 no.2
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    • pp.23-28
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    • 2013
  • Microlens array as basic element of the optical system have been fabricated with various focal length (mainly with long focal length) depending on the purpose of application. In this paper, the microlens arrays were fabricated for observing fluorescent images within sol-gel. Though the fluorescent signal is very low, the microlens array can help obtaining clear images through extracting the fluorescent light from sol-gel. We fabricated microlens arrays with short focal length, which can extract the light using photoresist thermal reflow method. In the experiment, the diameter of microlens decreased after thermal reflow because the solvent within the photoresist was vaporized. Therefore, to compensate the shape error by this reduction, microlens diameter in photomask was altered and spin-coat recipe of photoresist were modified.

Solubility Comparison by Yield Method of Residual of Photoresist for Printing Plate (인쇄 제판용 Photoresist의 잔막수율법에 의한 용해도 비교)

  • Yoon, Cheol-Hun;Hwang, Sung-Kwy;Oh, Se-Young;Chio, Sung-Yong;Lee, Ki-Chang
    • Journal of the Korean Applied Science and Technology
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    • v.15 no.1
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    • pp.25-33
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    • 1998
  • Photoresist is defined as substance that makes chemical changes in its solubility, colouring and hardening by light energy. In this study, photosensitive photoresists of the positive type for a printing plate were studied. PF, o-, m-, p-CF resins as a matrix resin were synthesized at an identical condition. Photoresists were prepared by mixing NDS derivatives with a matrix resin at various mixing ratios. Characteristics of photoresists were studied by yield method of residual using solubility and Optical microscope was also analyzed. Prepared photoresist using NDS derivatives shows excellent photosensitivity and solubility compared with commercial product. The mixing ratio of 1:4(by mass) of NDS derivative[III] and m-CF resin shows the highest dissoultion rate among others. In addition, photoresist was obtained at this condition resulted in the superior sensitivity and contrast.

A Development on the Non-Photomask Plate Making Technology for Screen Printing (II) (포토마스크가 필요 없는 스크린 제판 기술 개발(II))

  • Park, Kyoung-Jin;Kang, Hyo-Jin;Kim, Sung-Bin;Nam, Su-Yong;Ahn, Byung-Hyun
    • Journal of the Korean Printing Society
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    • v.26 no.2
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    • pp.45-54
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    • 2008
  • We have manufactured a photoresist which has excellent dispersity and good applying property due to 330 cps of viscosity for environment-friendly and economical maskless screen plate making. And the photoresist applied on the screen stretched was exposed with mask by UV-LED light source so we could manufacture the photoresist which proper for the UV light source. And it was developed by air spray with $1.7\;kgf/cm^2$ of injection pressure. Because of the excellence of power and resolution of the UV-LED light sourse, the pencil hardness and solvent resistance of curing photoresist film were excellent as those of conventional photoresist film. Moreover the $100{\mu}m$-width stripe image which has sharp edges was formed. So we confirmed a possibility of dry development process by air spray method.

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Study on the FPCS for Photoresist Coating of Semiconductor Manufacturing Process (반도체 생산공정의 감광액 도포를 위한 FPCS에 관한 연구)

  • Park, Hyoung-Keun
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.14 no.9
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    • pp.4467-4471
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    • 2013
  • In this research, developed full-scan photoresist coating system(FPCS) can improve the efficiency of the photoresist coating system essential for spinner equipment in nano semiconductor manufacturing process. The devices developed in this research, which can be swiftly replaced in case abnormal state element changes or wafer manufacturing defect occurs, are anticipated to improve module yield as well as real-time monitoring on the state element in order to prevent the complex process defect due to the photoresist miss coating.

Constructing a Three-Dimensional Endothelial Cell Layer in a Circular PDMS Microchannel

  • Choi, Jong Seob;Piao, Yunxian;Kim, Kyung Hoon;Seo, Tae Seok
    • Proceedings of the Korean Vacuum Society Conference
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    • pp.274.2-274.2
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    • 2013
  • We described a simple and efficient fabrication method for generating microfluidic channels with a circular-cross sectional geometry by exploiting the reflow phenomenon of a thick positive photoresist. Initial rectangular shaped positive photoresist micropatterns on a silicon wafer, which were fabricated by a conventional photolithography process, were converted into a half-circular shape by tuning the temperature to around $105^{\circ}C$. Through optimization of the reflow conditions, we could obtain a perfect circular micropattern of the positive photoresist, and control the diameter in a range from 100 to 400 ${\mu}m$. The resultant convex half-circular photoresist was used as a template for fabricating a concave polydimethylsiloxane (PDMS) through a replica molding process, and a circular PDMS microchannel was produced by bonding two half-circular PDMS layers. A variety of channel dimensions and patterns can be easily prepared, including straight, S-curve, X-, Y-, and T-shapes to mimic an in vivo vascular network. To inform an endothelial cell layer, we cultured primary human umbilical vein endothelial cells (HUVECs) inside circular PDMS microchannels, and demonstrated successful cell adhesion, proliferation, and alignment along the channel.

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Deep UV Photoresists;Dissolution Inhibitor

  • Shim, Sang-Yeon;Crivello, James V.
    • Journal of the Korean Applied Science and Technology
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    • v.17 no.3
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    • pp.188-191
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    • 2000
  • A new class of deep UV Photoresist based on the principles of chemical amplification was developed. This photoresist consists of three basic elements: a copolymer, blocked tetrabromobisphenol-A as a dissolution inhibitor and a photosensitive onium salt as a photoacid generator. On irradiation followed by a post exposure bake, tert-butoxycarbonyloxy phenyl group is converted to phenol group. Thus the initially base insoluble resin is converted under UV irradiation to a base soluble resin which may be preferentially removed by dissolution. This new photoresist display high sensitivity, 10 $mJ/cm^{2}$.