• Title, Summary, Keyword: Photoresist

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A Study on Micro-patterning used the UV-Curable Resin (UV경화성 수지를 이용한 미세패턴 형성에 관한 연구)

  • 남수용
    • Journal of the Korean Printing Society
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    • v.19 no.2
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    • pp.68-78
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    • 2001
  • UV-curable resin has the properties of quick-drying, thigh productivity at low temperature, energy savint, space saving, solventless, non-polluting and low-stinking, and thus, UV-curing system has been widely used in the fields of printing inks, adhesives, paints and coating agents. This study has been executed to micro-patterning used UV-curable resin, The micro-patterning properties of this photoresist were investigated under irradiation of UV light low pressure mercury lamp. When the exposed photoresist film was developed by pure water developer, the resolution of this photoresist was about 50$\mu\textrm{m}$.

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Formation of Black Matrix Pattern by using Black Photoresist

  • Cho, Yoon-Lae;Kim, Tae-Yong;Kim, Jin-Mog;Song, Jeong-Mok;Koh, Nam-Je
    • 한국정보디스플레이학회:학술대회논문집
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    • pp.1047-1050
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    • 2002
  • Generally, the Black Matrix of CRT is formed by the application of photoresist and black material separately. We have developed the simple process for black matrix of CRT. We used the black photoresist, It made it possible that the formation of Black Matrix by application of the light exposure and development only once.

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Synthesis of Imide Monomers for Application to Organic Photosensitive Interdielectric Layer

  • Kwon, Hyeok-Yong;Vu, Quang Hung;Lee, Yun-Soo;Park, Lee-Soon
    • 한국정보디스플레이학회:학술대회논문집
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    • pp.816-819
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    • 2008
  • A negative photoresist formulation was developed utilizing synthesized UV monomers containing imide linkage, photoinitiator, UV oligomer, and alkali developable polymer matrix. It was found that via-holes with good resolution, high transmittance and thermal resistance could be obtained by photolithographic process utilizing the negative-type photoresist formulations.

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Image Reversal Photoresist for the Single Isolation Structure of OLEDs (오엘이디의 단열 소자분리 구조를 위한 이미지 라버셜 감광제)

  • Lee, Seung-Jun;Sin, Yun-Su;Chae, Gyeol-Yeo;Im, Dae-U;Choe, Gyeong-Hui
    • Proceedings of the Optical Society of Korea Conference
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    • pp.541-542
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    • 2009
  • We have developed an image reversal photoresist with high thermal stability and electric insulating properties for the single isolation structure of OLEDs. The thermal stability and electric insulating properties are investigated and compared with those of conventional insulator and cathode separator materials. The single isolation structure using the image reversal photoresist reduces the fabrication process steps and cuts down the manufacturing cost.

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A Study of Measuring a sophisticated Photoresist dispense (PR(Photoresist) 분사량 측정에 관한 연구)

  • Shin, Dong-Won;Lee, Sung-Young;Kim, Sang-Sik;Lee, Joong-Hyeon;Han, Min-Suk
    • Proceedings of the IEEK Conference
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    • pp.385-386
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    • 2008
  • Reducing the PR(Photoresist) dispense Rate is one of the important issues in Photolithography. It is a main concern that variation in PR dispense rate and existance of microbubble. so we need to measure the photoresist dispense rate more precisely. This paper presented a noble sensor of measuring the PR dispense and detecting the microbubble.

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The Method and Apparatus for Photoresist Spray Coating with High Temperature Rotational Chuck (고온 회전 척을 구비한 포토레지스트 Spray Coating 방법 및 장치)

  • Park, Tae-Gyu;Kim, Jun-Tae;Kim, Kook-Jin;Suk, Chang-Gil
    • Proceedings of the KIEE Conference
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    • pp.42-44
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    • 2003
  • The paper presents the method and apparatus for conformal photoresist spray coating on the 3D structured substrate. The system consists of a high-temperature-rotational chuck, ultrasonic spray nozzle module, angle control module and nozzle moving module. The coating uniformity is acquired by controlling the moving speed of the ultrasonic spray nozzle across the substrate which is rotated constantly. To coat the photoresist conformally the spray angle of the nozzle and the temperature of the substrate are controlled during spray coating. The rotational chuck can be heated up by hot air or $N_2$. The photoresist (AZ1512) has been coated on the 3D structured wafer by spray coating system and the characteristics have been evaluated.

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A study on patterning of photosensitive polyimide LB film (감광성 polyimide LB막의 pattern형성에 관한 연구)

  • 김현종;채규호;김태성
    • Electrical & Electronic Materials
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    • v.9 no.1
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    • pp.59-66
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    • 1996
  • Polyimides containing cyclobutane ring in main chain is known to be thermally stable and able to be developed in organic solvents after photolysis with 254 nm UV light. This type of polyimides can be used as promising positive photoresist in VLSI fabrication process. In the current VLSI process, photoresist films are formed by spin coating. The film thickness is more than several hundred nano meters. It seems that there is room for improvement of film coating process by introducing Langmuir Blodgett technique. Thereby ultra thin film photoresist can be formed, and higher density of integration in VLSI be achieved. In the present work, depositing procedure of LB films of this polyimide was investigated. LB film thickness was measured by ellipsometry to evaluate deposited film status. Chemical imidization procedure was studied to avoid several problems in thermal imidization. The pattern of submicron dimension has successfully formed on LB film of 8nm thick, which found showing good contrast.

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A Study on the Maskless Plate Making Technology for Screen Printing(I) (Maskless용 스크린 제판 기술 연구(I))

  • Lee, Mi-Young;Park, Kyoung-Jin;Nam, Su-Yong
    • Journal of the Korean Printing Society
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    • v.26 no.1
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    • pp.73-85
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    • 2008
  • We have manufactured a photoresist which has excellent dispersity and good applying property due to 330cps of viscosity for environment-friendly and economical maskless screen plate making. And the photoresist applied on the screen stretched was exposed without mask by beam projector with CRT light source. Then it was developed by air spray with $1.7kgf/cm^2$ of injection pressure. The pencil hardness and solvent resistance of curing photoresist film were worse than those of conventional photoresist film and the maximum resolution of line image formed by maskless screen plate making was 0.5 mm since the exposure system for maskless plate making has weak light intensity and the diffusion of light. But we could obtain maskless screen plate which has sharp edges of line image and confirm a possibility of dry development process by air spray method.

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Photoresist strip 성능 향상을 위한 플라즈마 약액 활성화 방법 연구

  • Kim, Su-In;Lee, Chang-U
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • pp.242-242
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    • 2008
  • 반도체 공정에서 일정한 패턴을 만들기 위하여 Photoresist (PR)를 이용한 식각 공정을 사용하게 된다. 이러한 식각 공정은 반도체 직접도가 증가되면서 더욱 많은 단계의 공정을 요구하게 되었다. 그러나 식각 공정의 증가는 반도체 소자 생산을 위한 더 많은 시간과 비용을 요구하게 된다. 이를 해결하기 위하여 Photoresist를 사용하지 않은 공정으로 공정 단계를 간소화하기 위한 연구를 진행하고 있지만 아직 명확한 대한은 없다. 본 연구에서 는 PR의 strip 시간을 최대한 단축시키고 PR strip 잔여물의 빠른 제거를 위하여 기존 공정에서 사용 중인 strip 약 액을 플라즈마에 의하여 활성화하는 방법으로 PR strip 시간을 최대한 줄이는 방법에 대한 연구를 진행하였으며, 활성화된 strip용액이 더욱 빠른 strip율을 나타내는 것을 확인하였다. 또한 약액 활성화 방법으로 활성화된 strip 용액으로 PR을 일부 제거한 후 PR 표면의 물리적 특성 변화를 분석하여 약액 활성화된 strip 용액으로 인한 PR의 특성을 물리적 방법으로 접근하여 연구를 진행하였다.

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An Ellipsometry Study of Water Absorption in the 193 nm photoresist (Ellipsometry를 이용한 193 nm photoresist에서의 물의 흡수 연구)

  • Lee, Hyoung-Joo;Lee, Jung-Hwan;Seo, Ju-Bin;Kyoung, Jai-Sun;An, Il-Sin
    • Journal of the Semiconductor & Display Technology
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    • v.5 no.2
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    • pp.37-39
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    • 2006
  • We employed in-situ spectroscopic ellipsometry(SE) and imaging ellipsometry(IE) to study the interaction of water and photoresist(PR) in 193 immersion lithography. Real time measurement of SE showed thickness increase when PR was immerged in water indicating swelling effect. From the temporal evolution we could observe its reaction-limited behavior. Meanwhile, IE could identify the modification of PR surface by contact of water even for a short period of a second.

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