• Title, Summary, Keyword: SU-8 Photoresist

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Fabrication of $100{\mu}m$ thick mold and electroplating using thick photoresist (후막 감광제를 이용한 $100{\mu}m$ 두께 몰드 제작과 전해도금)

  • Jung, Hyoung-Kyoon;Ahn, Si-Hong;Kim, Yong-Kweon
    • Proceedings of the KIEE Conference
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    • pp.2008-2010
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    • 2002
  • Process conditions of a novel negative thick photoresist, JSR THB-$430N^{(R)}$, are established in this paper. Although SU-8 obtains uniform and high-aspect-ratio structures, it is hard to remove the SU-8 mold after electroplating. The JSR THB-$430N^{(R)}$ can be more easily removed than the SU-8 and has a low internal stress. Introducing two step strip processes using acetone and the jSR THB-$S1^{(R)}$, the JSR THB-$430N^{(R)}$ electroplating mold was removed completely and a JSR THB-$430N^{(R)}$ film stress is compressive less than 2 MPa. In this paper, we obatined $200{\mu}m$ thick PR structure and $100{\mu}m$ thick electroplated nickel structure using the JSR THB-$430N^{(R)}$ photoresist.

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Characterization of Low-temperature SU-8 Negative Photoresist Processing for MEMS Applications

  • May Gary S.;Han, Seung-Soo;Hong, Sang-Jeen
    • Transactions on Electrical and Electronic Materials
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    • v.6 no.4
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    • pp.135-139
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    • 2005
  • In this paper, negative SU-8 photoresist processed at low temperature is characterized in terms of delamination. Based on a $3^3$ factorial designed experiment, 27 samples are fabricated, and the degree of delamination is measured for each. In addition, nine samples are fabricated for the purpose of verification. Employing the. neural network modeling technique, a process model is established, and response surfaces are generated to investigate degree of delamination associated with three process parameters: post exposure bake (PEB) temperature, PEB time, and exposure energy. From the response surfaces generated, two significant parameters associated with delamination are identified, and their effects on delamination are analyzed. Higher PEB temperature at a fixed PEB time results in a greater degree of delamination. In addition, a higher dose of exposure energy lowers the temperature at which the delamination begins and also results in a larger degree of delamination. These results identify acceptable ranges of the three process variables to avoid delamination of SU-8 film, which in turn might lead to potential defects in MEMS device fabrication.

Fabrication of Glass Etching Mask using Various Polymers and Metals and Test of it in Glass Micromaching (폴리머와 금속을 이용한 유리 식각 마스크의 저작 및 이를 이용한 유리 가공)

  • Jeon, Do-Han;Sim, Woo-Young;Yang, Sang-Sik
    • Proceedings of the KIEE Conference
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    • pp.268-270
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    • 2004
  • This paper reports a novel masking method with various mask materials for wet etching of glass. Various mask materials such as Cr/Au, Ti/Au, Polyimide and thick SU-8 photoresist were investigated for borosilicate glass (Borofloat33) etching in concentrated hydrofluoric acid (48% HF). Polyimide and thick SU-8 photoresist are not suitable as masking material due to its poor adhesion to glass surfaces. Titanium has good adhesion is suitable as the first layer to make multi-protective layers. The best protection was obtained with a combination of Ti/Au, polyimide and Ti/Au as masking material with etch depth of $350{\mu}m$ achieved.

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Fabrication of 3-D Structures by Inclined and Rear-side Exposures (선택적 경사 노광과 후면 노광에 의한 3차원 구조물의 제작)

  • 이준섭;신현준;문성욱;송석호;김태엽
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.53 no.1
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    • pp.47-52
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    • 2004
  • 3D microstructures with different side-wall angles and different scales are fabricated by both methods of inclined exposure and rear-side exposure at each of selected areas on a same substrate. Conventional methods of inclined exposure are used to make side-walls with a same inclined angle on one substrate and to get a scale error due to front-side exposure through thick photoresist layer, But, by using the proposed method, we are able to fabricate 3D microstructures on a same substrate with various side-wall angles and accurate dimensions as the original design. In the rear-side exposure, UV exposure light reflects from the chromium mask pattern after passing through the thick photoresist layer, resulting in fabrication of well-defined, inclined 3D structures inside the thick photoresist layer.

Development on the High Concentration Ozone Generator System for the Semiconductor Photoresist Strip Process (반도체 감광막 제거공정 적용을 위한 고농도 오존발생장치 개발)

  • Son, Young-Su;Ham, Sang-Yong
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.55 no.12
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    • pp.591-596
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    • 2006
  • we have been developed on the ultra high concentration ozone generator system which is the core technology in the realization of the semiconductor photoresist strip process using the ozone-vapor chemistry. The proposed ozone generator system has the structure of the surface discharge type which adopt the high purity ceramic dielectric tube. We investigate the performance of the proposed ozone generator system experimentally and the results show that the system has very high ozone concentration characteristics of $19.7[wt%/O_2]$ at the flow rate of $0.3[{\ell}/min]$ of each discharge cell. As a result of the silicon wafer photoresist strip test, we obtained the strip rate of about 400[nm/min] at the ozone concentration of $16[wt%/O_2]$ and flow rate of $8[{\ell}/min]$. So, we confirmed that it's possible to use the proposed high concentration ozone generator system for the ozone-vapor photoresist strip process in the semiconductor and FPD industry.

Fabrication of 3D Microstructures with Single uv Lithography Step

  • Han, Man-Hee;Lee, Woon-Seob;Lee, Sung-Keun;Lee, Seung S.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.2 no.4
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    • pp.268-272
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    • 2002
  • This paper presents a novel microfabrication technology of 3D microstructures with inclined/rotated UV lithography using negative photoresist, SU-8. In some cases, reflected UV as well as incident UV is used to form microstructures. Various 3D microstructures are simply fabricated such as embedded channels, bridges, V-grooves, truncated cones, and so on.

Effect of Pressure on Edge Delamination in Chemical Mechanical Polishing of SU-8 Film on Silicon Wafer

  • Park, Sunjoon;Im, Seokyeon;Lee, Hyunseop
    • Tribology and Lubricants
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    • v.33 no.6
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    • pp.282-287
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    • 2017
  • SU-8 is an epoxy-type photoresist widely used for the fabrication of high-aspect-ratio (HAR) micro-structures in micro-electro-mechanical systems (MEMS). To fabricate highly integrated structures, chemical mechanical polishing (CMP) has emerged as the preferred manufacturing process for planarizing the MEMS structure. In SU-8 CMP, an oxidizer decomposes organic impurities and particles in the CMP slurry remove the chemically reacted surface of SU-8. To fabricate HAR microstructures using the CMP process, the adhesion between SU-8 and substrate material is important to avoid the delamination of the SU-8 film caused by the mechanical-dominant material removal characteristic. In this study, the friction force during the CMP process is measured with a CMP monitoring system to detect the delamination phenomenon and investigate the delamination of the SU-8 film from the silicon substrate under various pressure conditions. The increase in applied pressure causes an increase in the frictional force and wafer-edge stress concentration. The frictional force measurement shows that the friction force changes according to the delamination phenomenon of the SU-8 film, and that it is possible to monitor the delamination phenomenon during the SU-8 CMP process. The delamination at a high applied pressure is explained by the effect of stress distribution and pad deformation. Consequently, it is necessary to control the pressure of polishing, which can avoid the delamination in SU-8 CMP.

Characteristics of Photoresist-derived Carbon Nanofibers for Li-ion Full Cell Electrode

  • Kim, Hwan-Jun;Joo, Young-Hee;Lee, Sang-Min;Kim, Chang-Il
    • Transactions on Electrical and Electronic Materials
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    • v.15 no.5
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    • pp.265-269
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    • 2014
  • Carbon nanofiber electrode has been fabricated for energy storage systems by the electrospinning of SU-8 precursor and subsequent pyrolysis. Various parameters including the applied voltage, the distance between syringe tip and target collector and the flow rate of the polymer affect the diameter of SU-8 electrospun nanofibers. Shrinkage during pyrolysis decreases the fiber diameter. As the pyrolysis temperature increases, the resistivity decreases dramatically. Low resistivity is one of the important characteristics of the electrodes of an energy storage device. Given the advantages of carbon nanofibers having high external surface area, electrical conductivity, and lithium intercalation ability, SU-8 derived carbon nanofibers were applied to the anode of a full lithium ion cell. In this paper, we studied the physical properties of carbon fiber electrode by scanning transmission microscopy, thermal gravimetric analysis, and four-point probe. The electrochemical characteristics of the electrode were investigated by cyclic voltammogram and electrochemical impedance spectroscopy plots.