• Title, Summary, Keyword: Small circular hole defect

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The Influence of the Small Circular Hole Defect on the Fatigue Crack Propagation Behavior in Aluminum Alloys (알루미늄 합금재의 피로크랙 전파거동에 미치는 미소원공결함)

  • Kim, G.H.;Lee, H.Y.
    • Journal of Advanced Marine Engineering and Technology
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    • v.32 no.6
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    • pp.834-840
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    • 2008
  • We carried out fatigue testing with materials of aluminum alloyC7075-T6, 2024-T4) by rotary bending fatigue tester. We investigated fatigue limit, fatigue crack initiation, fatigue crack propagation behavior and possibility of fatigue life prediction to the different small circular hole defect. The summarized result are as follows; Fatigue limit of the smooth specimens were related tensile strength and yield strength. In case of more large applied stress and small circular hole crack defect, the fatigue crack was grown rapidly. The fatigue crack propagation behavior proceed at according to inclusion. Fatigue crack propagation ratio appeared instability and retardation phenomenon in the first half of fatigue life but appeared stability and replied in the latter half. On other hand, this experimental data of the materials are appeared fatigue life predictability.

Punching of Micro-Hole Array (미세 홀 어레이 펀칭 가공)

  • Son Y. K.;Oh S. I.;Rhim S. H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • pp.193-197
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    • 2005
  • This paper presents a method by which multiple holes of ultra small size can be punched simultaneously. Silicon wafers were used to fabricate punching die. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of $1.5{\mu}m$ in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The diameter of holes ranges from $2-10{\mu}m$. The process set-up is similar to that of the flexible rubber pad forming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions, surface qualities, and potential defect. The effects of the die hole dimension on ultra small size hole formation of the thin foil were discussed. The optimum process condition such as proper die shape and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole array in a one step operation.

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Atmospheric Pressure Plasma Etching Technology for Forming Circular Holes in Perovskite Semiconductor Materials (페로브스카이트 반도체 물질에 원형 패턴을 형성하기 위한 상압플라즈마 식각 기술)

  • Kim, Moojin
    • Journal of Convergence for Information Technology
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    • v.11 no.2
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    • pp.10-15
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    • 2021
  • In this paper, we formed perovskite (CH3NH3PbI3) thin films on glass with wet coating methods, and used various analytical techniques to discuss film thickness, surface roughness, crystallinity, composition, and optical property. The coated semiconductor material has no defects and is uniform, the surface roughness value is very small, and a high absorption rate has been observed in the visible light area. Next, in order to implement the hole shape in the organic-inorganic layer, Samples in the order of a metal mask with holes at regular intervals, a glass coated with a perovskite material, and a magnet were etched with atmospheric pressure plasma equipment. The shape of the hole formed in the perovskite material was analyzed by changing the time. It can be seen that more etching is performed as the time increases. The sample with the longest processing time was examined in more detail, and it was classified into 7 regions by the difference according to the location of the plasma.