• Title, Summary, Keyword: Spin-coating

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A theoritical study on spin coating technique

  • Tyona, M.D.
    • Advances in materials Research
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    • v.2 no.4
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    • pp.195-208
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    • 2013
  • A comprehensive theory of the spin coating technique has been reviewed and the basic principles and parameters controlling the process are clearly highlighted, which include spin speed, spin time, acceleration and fume exhaust. The process generally involves four stages: a dispense stage, substrate acceleration stage, a stage of substrate spinning at a constant rate and fluid viscous forces dominate fluid thinning behaviour and a stage of substrate spinning at a constant rate and solvent evaporation dominates the coating thinning behaviour. The study also considered some common thin film defects associated with this technique, which include comet, striation, chucks marks environmental sensitivity and edge effect and possible remedies.

A Numerical Study on Combined Solution and Evaporation during Spin Coating Process (Wafer Spin Coating 공정에서 증발과 용액이 박막 형성에 미치는 영향에 관한 연구)

  • 노영미;임익태;김광선
    • Journal of the Semiconductor & Display Technology
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    • v.2 no.1
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    • pp.25-29
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    • 2003
  • The fluid flow, mass transfer, heat transfer and film thickness variation during the spin coating process are numerically studied. The model is said to be I-dimensional because radial variations in film thickness, concentration and temperature are ignored. The finite difference method is employed to solve the equations that are simplified using the similarity transformation. In early time, the film thinning is due to the radial convective outflow. However that slows during the first seconds of spinning so the film thinning due to evaporation of solvent becomes sole. The time varing film thickness is analyzed according to the wafer spin speed, the various solvent fraction in the coating liquid, and the various solvent vapor fraction in the bulk of the overlying gas during the spin coating is estimated.

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A comprehensive study of spin coating as a thin film deposition technique and spin coating equipment

  • Tyona, M.D.
    • Advances in materials Research
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    • v.2 no.4
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    • pp.181-193
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    • 2013
  • Description and theory of spin coating technique has been elaborately outlined and a spin coating machine designed and fabricated using affordable components. The system was easily built with interdisciplinary knowledge of mechanics, fluid mechanics and electronics. This equipment employs majorly three basic components and two circuit units in its operation. These include a high speed dc motor, a proximity sensor mounted at a distance of about 15 mm from a reflective metal attached to the spindle of the motor to detect every passage of the reflective metal at its front and generate pulses. The pulses are transmitted to a micro-controller which process them into rotational speed (revolution per minute) and displays it on a lead crystal display (LCD) which is also a component of the micro-controller. The circuit units are a dc power supply unit and a PWM motor speed controlling unit. The various components and circuit units of this equipment are housed in a metal casing made of an 18 gauge black metal sheet designed with a total area of 1, $529.2cm^2$. To illustrate the use of the spin-coating system, ZnO sol-gel films were prepared and characterized using SEM, XRD, UV-vis, FT-IR and RBS and the result agrees well with that obtained from standard equipment and a speed of up to 9000 RPM has been achieved.

Fabrication and Properties of $VF_2$-TrFE/Si(100) Structure by using Spin Coating Method (Spin Coating 법을 이용한 $VF_2$-TrFE/Si(100) 구조의 제작 및 특성)

  • Lee, Woo-Seok;Jeong, Sang-Hyun;Kwak, No-Won;Kim, Ga-Ram;Yun, Hyeong-Sun;Kim, Kwang-Ho
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • pp.115-116
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    • 2008
  • The ferroelectric vinylidene fluoride-trifluoroethylene ($VF_2$-TrFE) and $Al_2O_3$ passivation layer for the Metal/Insulator/Ferroelectric/Semiconductor (MIFS) structure were deposited using spin coating and remote plasma atomic layer deposition (RPALD), respectively. A 2.5 ~ 3 wt % diluted solution of purified vinylidene fluoride-trifluoroethylene ($VF_2$: TrFE=70:30) in a DMF solution were prepared and deposited on silicon wafer at a optimized spin speed. After annealing in a vacuum ambient at 150 ~ $200^{\circ}C$ for 60 min, upper insulator layer were deposited at temperature ranging from 100 ~ $150^{\circ}C$ by RPALD. We described electrical and structural properties of MIFS fabricated by spin coating and RPALD methods.

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Modelling and Sensitivity Analysis for the Performance Improvement of a Spin Coater (스핀 코너 성능향상을 위한 모델링 및 민감도 해석)

  • 권태종;채호철;한창수;정진태;안강호
    • Journal of The Korean Society of Manufacturing Technology Engineers
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    • v.9 no.6
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    • pp.96-102
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    • 2000
  • Spinning mechanism is generally used in coasting process on grass plates. Rebounding PR(Photo Resist) which leads to occur inferiority of coating process is caused by vibrational energy of whole coating system. In this study, the sensitivity analysis is performed to analyze and reduce vibrational terms in the spin coating system. The sensitivity analysis is bared on the numerical expression of this system. By the bond graph method. power flow of each system is represented by some basic bond graph elements. Any energy domain system is modeled using the unified elements. The modelled spin coater system is verified with power spectrum data measured by FFT analyzer. As the results of verifying model parameters and sensitivity analysis, principal factors causing vibration phenomenon are mentioned. A study on vibration method in the spin coating system is discussed.

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Anode-supported Solid Oxide Fuel Cells Prepared by Spin-coating (Spin-coating 공정에 의해 제조된 음극 지지형 고체산화물 연료전지)

  • Yu, Ji-Haeng;Lee, Hee-Lak;Woo, Sang-Kuk
    • Journal of the Korean Ceramic Society
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    • v.44 no.12
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    • pp.733-739
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    • 2007
  • NiO-YSZ anode-supported single cell was prepared by spin-coating YSZ and LSM slurries as electrolyte and cathode, respectively. Dense YSZ electrolyte film was successfully prepared on the porous NiO-YSZ anode substrate by tuning pre-sintering temperature of NiO-YSZ and co-firing temperature. The thickness of YSZ film was controlled by the solid content of slurry and coating cycles. The experimental conditions affecting on the thickness of YSZ film was discussed. Single cells with the active electrode area ${\sim}0.8\;cm^2$ were prepared by spin-coating the cathode layers of LSM-YSZ mixture and LSM consequently as well. The effects of the pre-sintering temperature and thus the microstructure of NiO-YSZ substrate on the current-voltage characteristics of co-fired cell were investigated.

Fabrication of Ti/Ir-Ru electrode by spin coating method for electrochemical removal of copper

  • Kim, Joohyun;Bae, Sungjun
    • Environmental Engineering Research
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    • v.24 no.4
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    • pp.646-653
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    • 2019
  • Recovery of valuable metals in the industrial wastewater and sludge has attracted an attention owing to limited metallic resources in the earth. In this study, we firstly fabricated Ti/Ir-Ru electrodes by spin coating technique for effective recovery of Cu in electrowinning process. Two different Ti/Ir-Ru electrodes were fabricated using 100 and 500 mM of precursors (i.e., Ir-Ru). SEM-EDX and AFM revealed that Ir and Ru were homogenously distributed on the surface of Ti plate by the spin coating, in particular the electrode prepared by 500 mM showed distinct boundary line between Ir-Ru layer and Ti substrate. XRD, XPS, and cyclic voltammetry also revealed that characteristics of IrO2, RuO2, and TiO2 and its electrocatalytic property increased as the concentration of coating precursor increased. Finally, we carried out Cu recovery experiments using two Ti/Ir-Ru as anodes in electrowinning process, showing that both anodes showed a complete removal of Cu (1 and 10 g/L) within 6 h reaction, but much higher kinetic rate constant was obtained by the anode prepared by 500 mM. The findings in this study can provide a fundamental knowledge for surface characteristics of Ti/Ir-Ru electrode prepared by spin coating method and its potential feasibility for effective electrowinning process.

A Numerical Study on the Combined Flow and Evaporation During Spin Coating Process (증발을 고려한 회전코팅 공정에 대한 수치해석적 연구)

  • Im, Ik-Tae;Kim, Kwang-Sun
    • Proceedings of the KSME Conference
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    • pp.59-64
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    • 2001
  • The fluid flow, mass transfer and film thickness variation during a wafer spin coating process are numerically studied. Governing equations for the cylindrical coordinates are simplified using the similarity transformation and solved efficiently using the finite difference method. Concentration dependent viscosity and the binary diffusivity of the coating liquid are used in the analysis. The time variational velocity components of the coating liquid and the film thickness are analyzed according to the various spin speed. When the evaporation is considered, the flow decease in the early times due to the increase of the viscosity and the resultant flow resistance. Effects of the two film thinning mechanism, the flow-out and evaporation are also considered in the analysis.

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Properties Characterization of the Hydrophilic Inorganic Film as Function of Coating Thickness (코팅 두께에 따른 친수성 무기 필름의 특성 분석)

  • Joung, Yeunho;Choi, Won Seok;Shin, Yongtak;Lee, Minji;Kim, Heekon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.6
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    • pp.425-428
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    • 2013
  • In this paper, we present a novel hydrophilic coating material (Wellture Finetech, Korea) which can be utilized as a coating layer for anti-contamination for electrical and electronic system. The coating material was deposited on 4 inch silicon wafer with several different film thickness. The film thickness was controlled by spin coating speed. After curing of the film, we have scratched by permanent marker to check self-cleaning property of the film. Also we have executed several mechanical tests of the films. As the spin coating speed is increased, the film thickness was thinned from 230 nm to 125 nm. Contact angle of the film was lowered from $30^{\circ}$ to $12^{\circ}$ as the spin coating speed is increased from 700 to 2,500 rpm. On permanent marker scratched film surface coated at 1,000 rpm, we have poured regular city water to investigate self cleaning property of the film. The scratches were gradually separated from the film surface due to super-hydrophilicity of the film. Hardness of spin coated film was 9H measured by ASTM D3363 method. and adhesion of all film was 5B tested by ASTM D3359 method. Also, to get exact hardness value of the film, we have utilized a nano-indenter. As spin speed is increased, the hardness of film was increased from 3 GPa to 5 GPa.

Study in Minimum of Edge Bump using the Chamfer Angle in Blu-ray Disc Cover layer Spin Coating Process (블루레이 디스크의 커버 레이어 스핀코팅 시 챔퍼각을 이용한 끝단 범프 최소화 연구)

  • Lee, H.G.;Son, S.K.;Cho, K.C.;Shin, H.G.;Kim, B.H.
    • Transactions of the Society of Information Storage Systems
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    • v.2 no.3
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    • pp.178-183
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    • 2006
  • A Blu-ray disc, which has a more than 25GB optical capacity, has been known as a promising next-generation optical disc format. It commonly has a 1.1 mm thick substrate and a 0.1 mm thick cover layer for beam transmitting and the protection of the reflecting surface. The cover layer is generally formed by the spin coating process. However, in conventional spin coating, small bumps are formed along the rim of the disc, which results in the fatal reading error. Numerical simulation of the thin film flow behaviors during spin coating with the commercial solver and optimal spinning conditions was obtained. Thickness distribution of the cover layer according to the variation of substrate's edge shape could be calculated as well. By modifying the shape of the substrate edge shape, the bumps along the disc rim could be minimized, and it was proved that the chamfered edge, around $5{\sim}10$ degree, is the simplest and most effective way to minimize the bumps.

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