• Title, Summary, Keyword: Surface mount system

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A study on friction and stress analysis of wedge mount leveler in Semi-Conductor Sub-Fab (반도체 Sub-Fab 용 웨지 마운트 레벨러(Wdge Mount Leveler)의 마찰과 응력에 관한 연구)

  • Min, Kyung-Ho;Song, Ki-Hyeok;Hong, Kwang-Pyo
    • Journal of the Korea Society of Die & Mold Engineering
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    • v.11 no.2
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    • pp.25-28
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    • 2017
  • Semiconductor equipment manufacturers desire to enhance efficiency of Sub Fab to increase semiconductor productivity. For this reason, Sub Fab equipment manufacturers are developing Integrated System that combined modules with multiple facilities. Integrated System is required to apply Mount Leveler of Wedge Type in compliance with weight increase compared with existing single equipment and product shape change. This thesis analyzes main design variables of components of Wedge Mount Leveler and carries out structure analysis using ANSYS, finite element analysis program Analysis shows that main design variables of components of Wedge Mount Leveler has self-locking condition by friction force of Wedge and adjusting bolt. Each friction force hinges upon Wedge angle and Friction Coefficient of contact surface and upon the thread angle and Friction Coefficient of contact surface. Also, as a result of carrying out structure analysis of Wedge Mount Leveler, deflection and stress appears in different depending on the height of the level.

The surface mounting technology to prevent improper fine chip insertions by using fiber sensors (Fiber sensor를 이용한 미소칩 미삽 방지 표면실장기술)

  • Kim, Young-Min;Kim, Hyun-Jong;Um, Sun-Chon;Kong, Heon-Tag;Kim, Chi-Su
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.12 no.9
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    • pp.4138-4146
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    • 2011
  • In surface mount technology, with cellular phones and flat panel displays shrinking in size, the electric goods for making these things are getting smaller as well. Therefore, the technology of mounting components such as 0402 and 0603 Chip is on the rise. The chip mount manufacturing companies have studied the mount technology to prevent the missing insertions or improper insertion. This study suggests arranging the mechanical structure by using fiber sensors to eliminate missing insertions or improper insertions and developing the technology for upgrading system algorithms.

An inertia-type hybrid mount combining a rubber mount and a piezostack actuator for naval shipboard equipment

  • Moon, Seok-Jun;Choi, Sang-Min;Nguyen, Vien-Quoc;Oh, Jong-Seok;Choi, Seung-Bok;Chung, Jung-Hoon;Kwon, Jung-Il;Jung, Woo-Jin
    • International Journal of Naval Architecture and Ocean Engineering
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    • v.5 no.1
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    • pp.62-80
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    • 2013
  • This paper has been focused on developing a new hybrid mount for shipboard equipment used in naval surface ships and submarines. While the hybrid mount studied in our previous research was 100 kg-class series-type mount, the new hybrid mount has been designed as an inertia-type mount capable of supporting a static of 500 kg. The proposed mount consists of a commercial rubber resilient mount, a piezostack actuator and an inertial mass. The piezostack actuator connected with the inertial mass generates actively the control force. The performances of the proposed mount with a newly designed specific controller have been evaluated in accordance with US military specifications and compared with the passive mount. An isolation system consisting of four proposed mounts and auxiliary devices has been also tested. Through a series of experimental tests, it has been confirmed that the proposed mount provides better performance than the US Navy's standard passive mounts.

Isolation Mount Design for the Combat Computer Console Installed in Surface Ship (함정용 전술 컴퓨터 콘솔의 방진)

  • Kwon, Byung-Hyun;Kim, Joon;Kim, Jin-Cheon;Seo, Song-Hoo
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • pp.1772-1777
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    • 2000
  • The Combat Computer Consoles installed in surface ships should endure harsh environment such as vibration from engine or propeller and shock from underwater explosion. Generally, commercial isolation mounts are selected and used for anti-vibration and anti-shock design. In this research, the environment of the Combat Computer Console was analyzed first. Selected proper mount was modeled and computer simulation was performed to emulate the environment test. The real environment test was conducted with a manufactured Combat Computer Console. The test results were same as the simulation and satisfied the performance requirements. The computer simulation proved to be a useful design tool to predict the performance before the final environment test.

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Performance analysis and quality control of serial production lines

  • Han, Man-Soo;Lim, Jong-Tae
    • 제어로봇시스템학회:학술대회논문집
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    • pp.259-262
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    • 1995
  • In this paper, a model of an asymptotically reliable serial production line with quailty control devices is introduced and analyzed. By an asymptotic technique and Taylor series expansion, its average production rate is approximated in a closed form. The results are applied to a case study of a surface mount system.

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A Manufacturing Process Model of Internet of Things Devices Using a PCB-mounted RFID Tag Chip (PCB 부착형 RFID 태그 칩을 이용한 사물인터넷 디바이스 생산 공정에 대한 모델)

  • Park, Yungi;Seo, Jeongwook
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • pp.674-675
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    • 2016
  • In this paper, we propose a manufacturing process model of Internet of Things devices using a Printed Circuit Board (PCB)-mounted RFID tag chip for reducing electronic wastes. Electrical and electronic products require a PCB surface mount and many examination. Also, conventional barcode systems cannot provide traceability management in PCB manufacturing before finishing Surface Mount Technology (SMT) process. The proposed process model does not require workers' attaching and detaching process unlike barcode systems. Also, RFID tag chip can record all the data in manufacturing steps. Thus, the number of connections to a database management system (DBMS) can be reduced.

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A Machine Vision System for Inspecting Tape-Feeder Operation

  • Cho Tai-Hoon
    • International Journal of Fuzzy Logic and Intelligent Systems
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    • v.6 no.2
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    • pp.95-99
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    • 2006
  • A tape feeder of a SMD(Surface Mount Device) mounter is a device that sequentially feeds electronic components on a tape reel to the pick-up system of the mounter. As components are getting much smaller, feeding accuracy of a feeder becomes one of the most important factors for successful component pick-up. Therefore, it is critical to keep the feeding accuracy to a specified level in the assembly and production of tape feeders. This paper describes a tape feeder inspection system that was developed to automatically measure and to inspect feeding accuracy using machine vision. It consists of a feeder base, an image acquisition system, and a personal computer. The image acquisition system is composed of CCD cameras with lens, LED illumination systems, and a frame grabber inside the PC. This system loads up to six feeders at a time and inspects them automatically and sequentially. The inspection software was implemented using Visual C++ on Windows with easily usable GUI. Using this system, we can automatically measure and inspect the quality of ail feeders in production process by analyzing the measurement results statistically.

Detector Mount Design for IGRINS

  • Oh, Jae Sok;Park, Chan;Cha, Sang-Mok;Yuk, In-Soo;Park, Kwijong;Kim, Kang-Min;Chun, Moo-Young;Ko, Kyeongyeon;Oh, Heeyoung;Jeong, Ueejeong;Nah, Jakyoung;Lee, Hanshin;Jaffe, Daniel T.
    • Journal of Astronomy and Space Sciences
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    • v.31 no.2
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    • pp.177-186
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    • 2014
  • The Immersion Grating Infrared Spectrometer (IGRINS) is a near-infrared wide-band high-resolution spectrograph jointly developed by the Korea Astronomy and Space Science Institute and the University of Texas at Austin. IGRINS employs three HAWAII-2RG Focal Plane Array (H2RG FPA) detectors. We present the design and fabrication of the detector mount for the H2RG detector. The detector mount consists of a detector housing, an ASIC housing, a Field Flattener Lens (FFL) mount, and a support base frame. The detector and the ASIC housing should be kept at 65 K and the support base frame at 130 K. Therefore they are thermally isolated by the support made of GFRP material. The detector mount is designed so that it has features of fine adjusting the position of the detector surface in the optical axis and of fine adjusting yaw and pitch angles in order to utilize as an optical system alignment compensator. We optimized the structural stability and thermal characteristics of the mount design using computer-aided 3D modeling and finite element analysis. Based on the structural and thermal analysis, the designed detector mount meets an optical stability tolerance and system thermal requirements. Actual detector mount fabricated based on the design has been installed into the IGRINS cryostat and successfully passed a vacuum test and a cold test.

Dynamic characteristic analysis of SMT mounter system (SMT 마운터의 동특성 분석)

  • Rim, Kyung-Hwa;Jung, Jin-Ho;Beom, Hee-Rak
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • pp.440-445
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    • 2011
  • Dynamic characteristic analysis is required in developing SMT mounter system with high installation speed and position precision, because of vibration source occurred by positioning head. This paper presents the method of improving dynamic characteristic of SMT(Surface Mount Technology) mounter with finite element method and modal test. The design direction is that natural frequencies of SMT mounter must be higher than the vibration source. In addition, the effect of input shaping on residual vibration reduction is investigated by simulating the response of a first-order system.

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Effects on PCB Transmission Characteristics by SMD Pad Alignment (SMD의 패드 정렬이 PCB 전송 특성에 미치는 영향)

  • Kim, Chang-Gyun;Lee, Seongsoo
    • Journal of IKEEE
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    • v.22 no.3
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    • pp.874-877
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    • 2018
  • Many SMDs (surface mount device) are mounted and mutually connected on a PCB (printed circuit board). System performance degrades when their transmission characteristics are bad. Pads connecting a PCB and SMDs affects PCB transmission characteristics significantly, so pad should be properly aligned to optimize impedance matching. In this paper, effects on PCB transmission characteristics are simulated by pad alignment. When frequency is relatively low, pad alignment seldom affect PCB transmission characteristics, but it affects more and more when frequency or pad size becomes larger. Therefore, pad alignment should be carefully chosen based on target frequency and pad size. Especially, the proposed edge-aligned pad is generally more advantageous over the conventional centered-aligned pad in 12~16 GHz Ku-band frequency.