• Title, Summary, Keyword: UV-LIGA

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Fabrication of high aspect ratio metallic structures for optical devices using UV-LIGA Process (광소자 응용을 위한 UV-LIGA 공정 기반의 MEMS 소자 제작)

  • Kang, H.K.;Chae, K.S.;Moon, S.O.;Oh, M.H.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • pp.1050-1053
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    • 2002
  • This paper presents metal structure that is fabricated using UV-LIGA process with PMER N-CA3000. In order to fabricate metal structure with high aspect ratio, the systematic optimization method was adopted and then the structure of $36{\mu}m$ thick mold with aspect ratio 7:1 (trench) and $32{\mu}m$ thick nickel structure was obtained. This structure is applied to the fabrication of optical switch.

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SU-8 Mold Fabrication with Low Internal Stress and High Aspect Ratio for UV LIGA Process (고 형상비 UV LIGA 공정을 위한 낮은 내부응력의 SU-8 도금틀 제작)

  • Jang, Hyeon-Gi;Kim, Yong-Gwon
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.48 no.8
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    • pp.598-604
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    • 1999
  • This paper describes the research to minimize the film stress and maximize the aspect ratio of photoresist structure, especially about SU-8 for electroplating mold. UV LIGA process using SU-8 allows fabricating high aspect ratio polymer structures. However, it is hard to get fine patterns in the high aspect ratio structures because of high internal stress and difficulty of removing SU-8. The purpose of this paper is to setup the process condition for the obtainment of both low film stress and high aspect ratio and to find design rules that make the pattern be less dependent on stress problem. Firstly, the process of heat treatment and exposure of SU-8 are proposed. These two conditions control the amount of cross-linkage in polymer structure, which is the most important parameter of both pattern generation and remaining stress. Heat treatment is dealed with soft bake and post-exposure-bake. Temperature and time duration of each step are varied with heat treatment condition. Some test patterns are fabricated to evaluate the proposed process. Nickel electroplating is performed with the mold fabricated through the proposed process to confirm the SU-8 as a good electroplating mold.

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A HIGH-ASPECT-RADIO COME ACTUATOR USING UV-LIGA SURFACE MICROMACHINING AND (110) SILICON BULK MICORMACHINING (UV-LIGA 표면 미세 가공 기술과 (110) 실리콘 몸체 미세 가공 기술을 이용한 큰 종횡비의 빗모양 구동기 제작에 관한 연구)

  • Kim, Seong-Hyeok;Lee, Sang-Hun;Kim, Yong-Gwon
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.49 no.2
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    • pp.132-139
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    • 2000
  • This paper reports a novel micromachining process based on UV-LIGA process and (110) silicon anisotropic etching for fabrication of a high-aspect-ratio comb actuator. The comb electrodes are fabricated by (110) SILICON comb structure considering the etch-rate-ratio between (110) and (111) planes and lateral etch rate of a beam-type structure. The fabricated structure was$ 400\mum \; thick\; and\; 18\mum$ wide comb electrodes separated by $7\mim$ so that the height-gap ratio was about 57. Also considering resonant frequency of the comb actuator and the frequency-matching between sensing and driving mode for gyroscope application, we designed the number, width, height and length of the spring structures. Electroplated gold springs on both sides of the seismic mass were $15\mum\; wide,\; 14\mum\; thick\; and \; 500\mum$ long. The fabricated comb actuator had resonant frequency ay 1430Hz, which was calculated to be 1441Hz. The proposed fabrication process can be applicable to the fabrication of a high-aspect-ratio comb actuator for a large displacement actuator and precision sensors. Moreover, this combined process enables to fabricate a more complex structure which cannot be fabricate only by surface or bulk micromachining.

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Development of fabrication process for toroidal inductors using electroplating method (도금 공정을 이용한 토로이드형 마이크로 인덕터의 제작 공정 개발)

  • Noh, Il-Ho;Jang, Suk-Won;Kim, Chang-Kyo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • pp.408-411
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    • 2003
  • 최근 활발하게 연구가 진행되고 있는 마이크로 인덕터는 자기 데이터 저장을 위한 헤드, 자기장 센서, 마이크로 변압기와 휴대폰의 수동 소자와 같은 다양한 분야에 이용되고 있다. 마이크로 인덕터를 제작하기 위해 UV-LIGA 공정을 개발하였다. 도금 공정을 이용하여 마이크로 인덕터의 철심과 구리선 제작하였다. 도금 공정을 위해 필요한 마이크로 몰드는 여러 종류의 thick photoresist를 이용하여 저응력 공정으로 제작하였다. 도금 공정을 이용하여 toroid형 마이크로 인덕터를 제작하였다. 도금 공정에서 발생 할 수 있는 응력을 최소화할 수 있는 공정을 개발하였다.

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Polymer magnetic separator for biosensor applications (바이오센서 응용을 위한 자기 분리장치)

  • Kang, Moon-Sik;Kim, Yun-Ho;Yu, Geum-Pyo;Min, Nam-Gi;Hong, Suk-In
    • Proceedings of the KIEE Conference
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    • pp.2117-2120
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    • 2004
  • 본 논문은 UV-LIGA 공정, 후막공정을 이용한 바이오센서용 magnetic bead 분리 장치의 제작 기술개발에 관한 것이다. 최근 MEMS(microelectromechanical system) 기술을 이용한 바이오센서에 대한 연구가 활발하게 이루어지고 있다. 이러한 바이오센서 분야 중 혈액이나 다른 원하지 않는 물질을 분리해 주는 분리장치는 MEMS 기술을 이용해 구현이 매우 어려운 부분 중에 하나이다. 기존의 UV-LIGA 공정과 도금법을 이용한 마이크로 전자석 제작하여 분리장치를 제작하는 경우 제작 공정이 매우 복잡하며 매우 많은 공정비용을 요구한다. 이러한 단점을 해결하기 위해 본 논문에서는 Sr 계연의 고분자 자석과 3차원 PDMS(poly-dimethylsiloxane) 마이크로 채널 공정을 이용해 분리장치를 제작하였다. 제작된 분리장치는 $0{\sim}30{\mu}{\ell}$/min 의 속도에서 유체를 흘렸을 90% 이상의 분리 효율을 나타냈다. 개발된 분리 장치는 연재질의 PDMS 로 제작되어 일회용 바이오센서에 적용이 가능하다.

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A study on the fabrication technology of 3 dimensional micro inductor (3차원 마이크로 인덕터의 제작기술에 관한 연구)

  • Lee, Eui-Sik;Lee, Joo-Hun;Lee, Byoung-Wook;Kim, Chang-Kyo
    • Proceedings of the KIEE Conference
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    • pp.2380-2382
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    • 2005
  • UV-LIGA 공정을 이용하여 3차원 마이크로 인덕터 제작 기술에 관하여 연구하였다. 마이크로 인덕터의 코일, 비아(via), 코어(core)의 Multi-layer 제작을 위해 UV-LIGA 공정을 이용하였으며, 전해도금(electro plating)을 위한 씨올기(seed layer)로서는 e-beam evaporator를 이용하여 금속을 증착하였다. 3차원 마이크로 인덕터의 도금 방법으로는 전해도금을 사용하였으며, 코일과 비아 부분은 구리(Cu) 전해도금, 코어 부분은 니켈(Ni)과 철(Fe)의 합금인 퍼멀로이(Ni/Fe) 전해도금을 하였다. 3차원 마이크로 인덕터의 샘플크기로는 코어의 폭은 $300{\mu}m$, 전체 길이는 9.2mm, 두께는 $20{\mu}m$의 구조로 제작되었으며, 코일 부분은 폭이 $40{\mu}m$, 두께는 $30{\mu}m$이며, 코일턴 수는 70회의 구조로 제작하였다.

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Fabrication of the multi-layer structure and Nickel mold with electroforming using KMPR (KMPR을 이용한 다층구조물 제작 및 전해도금을 이용한 니켈몰드 제작)

  • Hwang Sung-Jin;Jung Phill-Gu;Ko Jeung-Sang;Ko Jong-Soo;Jeong Im-Deok;Kim In-Gon
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • pp.143-144
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    • 2006
  • In this paper, we proposed XP KMPR-1050 negative tone resist to replace SU-8 resist for multi-layer micro-structures and thick plating mold fabrication using UV-LIGA process. XP KMPR resist proposed in this paper can be easily striped using a common stripping solution such as NMP without damage of micro-structure. The conditions for the fabrication of XP KMPR micro-structure were optimized by adjustment of exposure and post-exposure bake(PEB). The $140{\mu}m$ -thick and an aspect ratio at least 10 micro-structure and multi-layer structures were successfully fabricated through the process conditions. Through-mold electroplating and PR striping of XP KMPR has been successfully demonstrated.

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Characteristics of Micro-stereolithography Apparatus Using UV Lamp as Light Source (UV램프 광원 마이크로 광 조형장치의 성능평가)

  • Lee I.H.;Choi J.S.;Lee S.P.;Ko T.J.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • pp.161-162
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    • 2006
  • Micro-stereolithography technology is used for fabricating of 3-dimensional micro-structures. In some cases, this technology is more economical and simpler than MEMS and LIGA technologies based on semiconductor process. In this research, the micro-sterolithography apparatus that is more economical and simpler than current micro-stereolithography apparatus was developed. This apparatus uses UV lamp and optical fiber as a light source and tight delivery system, respectively.

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A development of fabrication processes of microstructure using SU-8 PR (SU-8 PR을 이용한 마이크로 구조물 제작 공정 개발)

  • 김창교;장석원;노일호
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.13 no.2
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    • pp.68-72
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    • 2003
  • In this paper, we developed a new thick photoresist fabrication technology for 3-dimensional microstructures. In general, like as AZ photoresist was coated with thin film thickness about 1 $\mu\textrm{m}$ to 30 $\mu\textrm{m}$, but photoresist like SU-8 has thickness of several tens $\mu\textrm{m}$ or more and high aspect ratio. When we fabricate a microstructure using the thick photoresist like SU-8, cracks on the SU-8 thick photoresist are appeared by stress which was caused by sudden cooling down during bake of the thick photoresist spun on wafer. Thus, it was hard to fabricate the microstructure using the thick photoresist for electroplating. In this paper, we developed a new process to produce a 3-dimensional microstructure without the crack by stress through a suitable thick photoresist coating, time control of cool down and time control of PEB (Post Expose Bake).

Display 특성 향상을 위한 MLA 광소자 개발 연구

  • Jeong, Han-Uk;Kim, Gwang-Yeol;Lee, Gong-Su;Sin, Seong-Uk;Park, Hong-Jin;Choe, Byeong-Deok
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • pp.199-199
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    • 2009
  • Recently, polymeric microlens arrays have become important elements in many applications. Microlens arrays have been used to enhance luminance efficiency and luminance power efficiency of light-emitting diodes (LEDs) and organic LEDs. Many processes for fabrication of microlens array are studied. Though the MLA has been fabricated by electroformed mold, LIGA process and reflow method, these methods were required masks, multiple process steps and post processing. In this paper, we proposed rapid and direct UV laser direct fabrication process using colorless liquid photopolymer, NOA60 for polarization activated microlens. The microlens arrays are formed on the NOA60 on glass, after the focused laser energy was irradiated to the material. The diameter of MLA was varied from 42 to 88 ${\mu}m$, and the height from 0.9 to 1.6 ${\mu}m$. The MLA fabricated using NOA60 shows more then 85% transmittance as well as good hardness for optical module.

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