• Title/Summary/Keyword: Weibull distribution equation

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Evaluation of Insulating Reliability in Epoxy Composites using Dielectric Breakdown Data (절연 파괴 데이터를 이용한 에폭시 복합체의 절연 신뢰도 평가)

  • Park, Geon-Ho
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.05b
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    • pp.114-118
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    • 2005
  • In this study, the DC dielectric breakdown of epoxy composites used for molding material was experimented and then its data were simulated by Weibull distribution equation. From the analysis of Weibull distribution, it was confirmed that as the allowed breakdown probability was given by 0.1[%], the applied field value needed to be under 21.5[kV/mm].

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Insulating Reliability according to additives in Epoxy Composites for PCB Material (인쇄 회로 기판용 에폭시 복합체의 첨가제에 따른 절연 신뢰도)

  • Yang, Jeong-Yun;Park, Young-Chull;Park, Geon-Ho
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.05b
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    • pp.159-163
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    • 2003
  • In this study, the DC dielectric breakdown of epoxy composites used for PCB material was experimented and then its data were simulated by Weibull distribution equation. The more hardener increased the stronger breakdown strength at low temperature because of cross-linked density by the virtue of ester radical, and the breakdown strength of specimens with filler was lower than it of non-filler specimens because it is believed that the adding filler forms interface and charge is accumulated in it, therefore the molecular motility is raised, the electric field is concentrated, and the acceleration of electron and the growth of electron avalanche are early accomplished. From the analysis of Weibull distribution, it was confirmed that as the allowed breakdown probability was given by 0.1[%], the applied field value needed to be under 21.5[kV/mm].

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An Analysis of Insulating Reliability in Epoxy Composites for Molding Materials of PT

  • Yang, Jeong-Yun;Park, Geon-Ho
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.09a
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    • pp.43-46
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    • 2001
  • The DC dielectric breakdown of epoxy composites used for transformer was experimented and then its data were simulated by Weibull distribution equation in this study. The more hardener increased the stronger breakdown strength at low temperature because of cross-linked density by the virtue of ester radical, and the breakdown strength of specimens with filler was lower than it of non-filler specimens because it was believed that the adding filler formed interface, charges were accumulated in it, the molecular mobility was raised, the electric field was concentrated, electrons were accelerated and then electron avalanche was early accomplished. From the analysis of Wei bull distribution equation, it was confirmed that as the allowed breakdown probability was· given by 0.1[%], the value of 'applied field was needed to be under 17.20[kV/mm].

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An Estimation of Life Time in Epoxy composites using Weibull Distribution Equation (와이블 분포식을 이용한 에폭시 복합체의 수명 시간 예측)

  • 신철기;김진사;정일형;임장섭;김태성;이준웅
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.3
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    • pp.167-173
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    • 1998
  • In order to estimate the life time of epoxy composites used for modeling material of transformer, the AC breakdown experiments of it were experimented and then the AC breakdown data were also simulated by Weibull distribution equation in this study. The life time of H100F65 specimen was the shortest and it of SH100F65 specimen was the longest, and as the AC voltage was applied to specimen for 50[min], the breakdown probability of each specimen was 31.2[%], 17.00[%], 84.36[%] and 12.35[%], respectively.

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Data Analysis of Insulating Reliability Properties in Polymer for PCB (PCB용 고분자의 절연 신뢰도 특성 데이터 분석)

  • Park, Geon-Ho
    • Proceedings of the Korean Society of Computer Information Conference
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    • 2015.01a
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    • pp.289-290
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    • 2015
  • 본 연구에서는 인쇄회로기판(PCB)용 재료로 널리 사용되는 고분자에 대해서 와이블 분포 방정식의 시뮬레이션을 수행하여 절연 신뢰도 특성 데이터를 분석하였다. 와이블 분포에 대한 분석 시뮬레이션을 통하여 일반적으로 허용 절연 파괴 확률을 0.1[%] 이하라고 설정하였을 때, 첨가제 배합비를 5종으로 구분한 각 시편에 대해서 인가 전계의 허용치를 각각 계산할 수 있었다.

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Analysis of Insulating Reliability in Epoxy Composites using Weibull Distribution Equation (와이블 분포식을 이용한 에폭시 복합체의 절연 신뢰도 분석)

  • Park, No-Bong;Lim, Jung-Kwan;Park, Yong-Pil
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2003.05a
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    • pp.813-816
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    • 2003
  • The dielectric breakdown of epoxy composites used for transformers was experimented and then its data were applied to Weibull distribution probability. First of all, speaking of dielectric breakdown properties, the more hardener increased, the stronger breakdown strength became at low temperature because of cross-linked density by the virtue of ester radical. The breakdown strength of specimens with filler was lower than it of non-filler specimens because it is believed that the adding filler forms interface and charge is accumulated in it, therefore the molecular motility is raised and the electric field is concentrated. In the case of filled specimens with treating silane, the breakdown strength become much higher. Finally, according to Weibull distribution analysis, reducing breakdown probability of equipment insulation lower than 0.1 % level requires the allowable field intensity values to be kept under 21.5 MV/cm.

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Analysis of Insulating Reliability in Epoxy Composites Using Weibull Distribution Equation (와이블 분포식을 이용한 Epoxy 복합체의 절연 신뢰도 해석)

  • 임중관;박용필;이준웅
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.14 no.8
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    • pp.647-651
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    • 2001
  • The dielectric breakdown of epoxy composites used for transformers was experimented and then its data were applied to Weibull distribution probability. First of all, speaking of dielectric breakdown properties, the more hardener increased, the stronger breakdown strength became at low temperature because of cross-linked density by the virtue of ester radical. The breakdown strength of specimens with filler was lower than it of non-filler specimens because it is believed that the adding filler forms interface and charge is accumulated in it, therefore the molecular motility is raised and the electric filed is concentrated. In the case of filled specimens with treating silane, the breakdown strength become much higher. Finally, from the analysis of weibull distribution, it was confirmed that to low allowed breakdown probability under 0,.1%, the applied field value needed to be under 21.5MV/cm.

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