• Title, Summary, Keyword: Wire Bonding

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A New Technique for Fabrication of Bonded Linqual Retainer (Bonded Linqual Retainer의 최신 제작기술)

  • Yu, Chin-Ho
    • The Journal of Korean Academy of Dental Technology
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    • v.20 no.1
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    • pp.91-98
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    • 1998
  • Bonded lingual retained are divided into two common types; preformed retainers with attached mash pads, and those that are custom fabricated from standard round ir multi-standed wire. The clinician may encounter problems in the bonding process of both types of retainers because of an inability to accurtely place and temporarily stability the wire in the same position as it was adapted an a guide model. Because of these problems, a new fabrication technique of bonded lingual retainers which increase their accuracy and ease of placement and also increased their tretention was suggested by the author. Using a current model as a guide, this bonded lingual retainer was fabricated from $.028"{\sim}.032"$ standard round wire. The wire was formed with pliers for idel adapation to the lingual surfaces of the involved teeth. Right angle bends were placed in the retainer wire ends and custom "composite" bonding pads were added to the ends of the retainer wire. This bonded lingual retainer with custom "composite" bonding pads is easir to place because of the increased stability and the accuracy of placement is greatly increased. The increased insure that the retainer comforms ideally to the lingual surface of the teeth being retained.

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A Study on the Aluminum Wire Bondingby Using Ultrasonic Vibrator (초음파 진동자를 이용한 알루미늄 와이어 용접에 관한 연구)

  • 김희수;이건복
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • pp.571-576
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    • 1994
  • In recent years, ultrasonic has been widely applied in measurement and industrial fields and its application range has been expanded as a result of continuous research and development. Wire Bonding Machine, an instrument fabricating semi-conductor, makes use of ultrasonic bonding method. In order to improve the currently used wire bonding machine using ultrasonic energy, technical accumulation is needed steadily through development of exciting device of ultrasonic composed of piezoelectic vibrator and horn. This study investigates the design conditions affecting the dynamic characteristics through the theoretical and experimental analysis of piezoelectric vibrator and horn, The study conducts separately the system identification of piezoelectric vibrator in time domain and the modal analysis of horn in frequency domain. In theoretical model, the integrated modeling is conducted via a combination of dynamic identification of piezoelectric vibrator and theoretical analysis of horn. Hence comparison is made for theoretical and experimental results of the dynamic characteristics of the ultrasonic transducer composed of piezoelectric vibrator and horn. Form the results of this study we develop the design technique of ultrasonic transducer using dynamic characteristic analysis and propose the possibility of ultrasonic welding considering the optimal condition of the natural frequency and vibration mode of horn.

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A Semi-MMIC Hair-pin Resonator Oscillator for K-Band Application (K-Band용 SEmi-MMIC Hair-pin 공진발진기)

  • 이현태
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.25 no.9B
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    • pp.1635-1640
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    • 2000
  • In this paper, a 18 GHz oscillator is designed with the push-push method an fabricated by semi-MMIC process, in which the second harmonic is the main output signal with the suppressed fundamental mode. In semi-MMIC process, passive components with microstrip transmission line are implemented using MMIC process on semi-insulating GaAs substrate. Then, chip types of P-HEMT, resistors, and capacitors are connected through Au wire-bonding. Also, the ground plane is inserted around the circuit and connected each other with the back-side of substrate through Au wire-bonding instead of via-hole. The semi-MMIC push-push oscillator shows the output powder of -10.5 dBm, the fundamental frequency suppression of -17.3 dBc/Hz, and the phase noise of -97.9 dBc/Hz at the offset frequency of 100 kHz.

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Enhancement of Cu Wire Bondability by Increasing the Surface Roughness of Capillary (표면 요철이 발달된 캐필러리 적용에 따른 Cu 와이어의 본딩 특성)

  • Lee, Jong-Hyun;Kim, Ju-Hyung;Kang, Hong-Jeon;Kim, Hak-Bum;Moon, Jung-Tak;Riu, Doh-Hyung
    • Korean Journal of Metals and Materials
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    • v.50 no.12
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    • pp.913-920
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    • 2012
  • In spite of some problems in processability and bondability, Au wires in the microelectronics industry are gradually being replaced by copper wires to reduce the cost of raw material. In this article, the effects of surface roughness enhanced capillaries on thermosonic Cu wire bonding were evaluated. The roughness-enhanced zirconia toughened alumina (ZTA) capillaries were fabricated via a thermal grooving technique. As a result, the shear bond strength of first bonds (ball bonds) bonded using the roughness-enhanced capillary was enhanced by 15% as compared with that of normal bonds due to more effective plastic deformation and flow of a Cu ball. In the pull-out test of second bonds (stitch bonds), processed at two limit conditions on combinations of process parameters, the bond strength of bonds formed using the roughness-enhanced capillary also resulted in values higher by 55.5% than that of normal bonds because of the increase in the bonding area, indicating the expansion of a processing window for Cu wire bonding. These results suggest that the adoption of roughness-enhanced capillaries is a promising approach for enhancing processability and bondability in Cu wire bonding.

Development of Packaging Technology for CdTe Multi-Energy X-ray Image Sensor (CdTe 멀티에너지 엑스선 영상센서 패키징 기술 개발)

  • Kwon, Youngman;Kim, Youngjo;Ryu, Cheolwoo;Son, Hyunhwa;Kim, Byoungwook;Kim, YoungJu;Choi, ByoungJung;Lee, YoungChoon
    • Journal of the Korean Society of Radiology
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    • v.8 no.7
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    • pp.371-376
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    • 2014
  • The process of flip-chip bump bonding, Au wire bonding and encapsulation were sucessfully developed and modularized. The CdTe sensor and ROIC were optimally jointed together at $150^{\circ}C$ and $270^{\circ}C$ respectively under24.5 N for 30s. To make SnAg bump on ROIC easy to be bonded, the higher bonding temperature was established than CdTe sensor's. In addition, the bonding pressure was lowered minimally because CdTe Sensor is easier to break than Si Sensor. CdTe multi-energy sensor module observed were no electrical failures in the joints using developed flip chip bump bonding and Au wire bonding process. As a result of measurement, shearing force was $2.45kgf/mm^2$ and, it is enough bonding force against threshold force, $2kgf/mm^2s$.

Plasma Cleaning Effect for Improvement of Package Delamination (패키지 박리 개선을 위한 플라즈마 세정 효과)

  • Koo Kyung-Wan;Kim Do-Woo;Wang Jin-Suk
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.54 no.7
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    • pp.315-318
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    • 2005
  • The effect of plasma cleaning was examined on package delamination phenomena in the integrated circuit (IC) packaging process. Without plasma cleaning, delamination was observed for all three experimental treatments applied after the packaging step, which include bake of If, reflow, and bake of If followed by reflow However, no delamination was observed when the plasma cleaning was performed before and after the wire bonding step. Plasma cleaning was found to be a critical step to improve the reliability of the package by reducing the possibility of contact failure between die pad and bonding wire.

Design of Ultrasonic Tool Horn for Wire Wedge Bonding (와이어 본딩용 초음파 공구혼 설계에 관한 연구)

  • Lee, Bong-Gu;Oh, Myung-Seok;Ma, Jeong-Beom
    • Journal of The Korean Society of Manufacturing Technology Engineers
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    • v.22 no.4
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    • pp.717-722
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    • 2013
  • In this study, we investigated the design of a wire wedge bonding ultrasonic tool horn using finite element method (FEM) simulations. The proposed method is based on an initial design estimate obtained by FEM analysis. An ultrasonic excitation causes various vibrations of a transducer horn and capillary. A simulated ultrasonic transducer horn and resonator are then built and characterized experimentally using a laser interferometer and electrical impedance analyzer. The vibration characteristics and resonance frequencies close to the exciting frequency are identified using ANSYS. FEM analysis is developed to predict the resonance frequency of the ultrasonic horn and use it in the optimal design of an ultrasonic horn mode shape.

Comparison of the Power Consumption between the Ceramic and Wire Bonding Packaging Methods for Solid State Electrochemical Carbon dioxide Sensors

  • Kim, Tae Wan;Park, Chong-Ook
    • Journal of Sensor Science and Technology
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    • v.25 no.3
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    • pp.173-177
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    • 2016
  • Tape casting ceramics technology has been adopted for the fabrication of solid state electrochemical $CO_2$ sensors and the packaging substrates. The fabricated $CO_2$ sensors exhibit a fast response and a good recovery with the almost theoretical sensitivity of 37 mV/decade, corresponding to a sensor operating temperature of 373 K. The two packaging methods, the wire bonding package and the surface- mounted on the ceramic package, were compared with respect to their power consumption and mass production feasibility. In terms of the ease of fabrication, the surface mount packaging technology is superior to the wire bonding technology but its power consumption is approximately twice that of the wired package.

Effect of Combining Wood Particles and Wire Net on the Physical Properties of Board (목재(木材)파티클과 철강결체(鐵鋼結締)가 보오드의 물리적(物理的) 성질(性質)에 미치는 영향(影響))

  • Lee, Phil-Woo
    • Journal of the Korean Wood Science and Technology
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    • v.13 no.3
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    • pp.3-26
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    • 1985
  • The object of this study was to investigate the effects on physical and mechanical properties of wood particle and sawdust board combined with wire net. Conventional forming, press-lam, and veneer comply boards combining one to four wire net sheets were made from wood particle and sawdust with different spacings (8, 10, 12, and 18 Mok) and different wire diameters (0.35, 0.50, and 0.80mm) composing wire net. They were compared and analyzed statistically with specific gravity, thickness swelling, length swelling, bending properties (modulus of rupture, modulus of elasticity, work to proportional limit, and total work), internal bonding strength, and screw holding strength between wood particle and sawdust boards. The results obtained at this study as cording to the discussions might be concluded as follows; 1. In specific gravity, both particle and sawdust boards by press-lam method were higher than by conventional forming and veneer comply method, and the boards containing more wire net sheets also showed higher value. But the wire net spacings(Mok) had no influence on specific gravity. In general, particle board showed higher specific gravity than sawdust board. Veneer comply board showed lowest specific gravity values. 2. Both particle and sawdust boards by press-lam method was slightly lower than by conventional forming and veneer comply method in thickness swelling. The sawdust board containing 8, 12. and 18 Mok wire net showed lower thickness swelling than the corresponding particle board, but both sawdust and particle boards containing the T8 and 10 Mok wire net showed higher and similar thickness swelling. 3. Both particle and sawdust boards containing wire net showed no difference in MOR and MOE of bending. Comply board was the highest and particle board showed slightly higher than sawdust board in MOR and MOE values. 4. In work to proportional limit and total work in bending, both particle and sawdust boards containing thicker wire diameter and more wire net sheets showed higher value. From these facts, it is conceivable that boards with thicker wire diameter and more wire net sheets show increasing resistance against external force. But there was no significant difference between particle and sawdust borads. 5. In resistance against delamination (internal bonding strength), both sawdust and particle boards containing wire net showed lower value than control, and also showed decreasing tendency with more number of wire net sheet composed. Particle board showed higher resistance against delamination than sawdust board. 6. In screw holding strength, sawdust board containing thicker wire diameter and more wire net sheets showed higher value, but particle board by press-lam method was higher than by conventional forming and veneer comply method. Screw holding strength of particle board was higher than that of sawdust board.

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