• Title, Summary, Keyword: cure kinetics

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Cure Kinetics of amine-cured tetraglycidyl-4,4'-diaminodiphenylmethane epoxy blends with a new polyetherimide (반응성 열가소성 수지로 개질된 TGDDM/DDS 시스템의 Cure Kinetics)

  • Hwang Seungchul;Lee JungHoon;Kim Donghyon;Kim Woho;Kim Minyoung
    • Proceedings of the Korean Society For Composite Materials Conference
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    • pp.214-217
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    • 2004
  • The cure kinetics of blends of epoxy(tetraglycidyl-4,4'-diaminodiphenylmethane ; TGDDM)/curing agent(diaminodiphenyl sulfone ; DDS) resin with amine terminated polyetherimide-CTBN-amine terminated polyetherimide triblock copolymer(ABA) were studied using differential scanning calorimetry under isothermal conditions to determine the reaction parameters such as activation energy and reaction constants. By increasing the amount of ABA in the blends, the final cure conversion was decreased. Lower values of the final cure conversions in the epoxy/ABA blends indicated that ABA hinders the cure reaction between the epoxy and curing agents. 1be value of the reaction order, m, for the initial autocatlytic reaction was not affected by blending ABA with epoxy resin, and the value was approximately 1.0. The value of n for the nth order component in the autocatalytic analysis was increased by increasing the amount of ABA in the blends, and the value increased from 2.0-3.4. A diffusion controlled reaction was observed as the cure conversion increased and the rate equation was successfully analyzed by incorporating the diffusion control term for the epoxy/DDS/ABA blends.

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Cure Characteristics of Naphthalene Type Epoxy Resins for SEMC (Sheet Epoxy Molding Compound) for WLP (Wafer Level Package) Application (WLP(Wafer Level Package)적용을 위한 SEMC(Sheet Epoxy Molding Compounds)용 Naphthalene Type Epoxy 수지의 경화특성연구)

  • Kim, Whan Gun
    • Journal of the Semiconductor & Display Technology
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    • v.19 no.1
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    • pp.29-35
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    • 2020
  • The cure characteristics of three kinds of naphthalene type epoxy resins(NET-OH, NET-MA, NET-Epoxy) with a 2-methyl imidazole(2MI) catalyst were investigated for preparing sheet epoxy molding compound(SEMC) for wafer level package(WLP) applications, comparing with diglycidyl ether of bisphenol-A(DGEBA) and 1,6-naphthalenediol diglycidyl ether(NE-16) epoxy resin. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The NET-OH epoxy resin represented an n-th order cure mechanism as like NE-16 and DGEBA epoxy resins, however, the NET-MA and NET-Epoxy resins showed an autocatalytic cure mechanism. The NET-OH and NET-Epoxy resins showed higher cure conversion rates than DGEBA and NE-16 epoxy resins, however, the lowest cure conversion rates can be seen in the NET-MA epoxy resin. Although the NETEpoxy and NET-MA epoxy resins represented higher cure reaction conversions comparing with DGEBA and NE-16 resins, the NET-OH showed the lowest cure reaction conversions. It can be figured out by kinetic parameter analysis that the lowest cure conversion rates of the NET-MA epoxy resin are caused by lower collision frequency factor, and the lowest cure reaction conversions of the NET-OH are due to the earlier network structures formation according to lowest critical cure conversion.

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Cure Characteristics of Ethoxysilyl Bisphenol A Type Epoxy Resin Systems for Next Generation Semiconductor Packaging Materials (새로운 반도체 Packaging용 Ethoxysilyl Bisphenol A Type Epoxy Resin System의 경화특성 연구)

  • Kim, Whan Gun
    • Journal of the Semiconductor & Display Technology
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    • v.16 no.2
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    • pp.19-26
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    • 2017
  • The cure properties of ethoxysilyl bisphenol A type epoxy resin (Ethoxysilyl-DGEBA) systems with different hardeners were investigated, comparing with DGEBA and Diallyl-DGEBA epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The Ethoxysilyl-DGEBA epoxy resin system showed lower cure conversion rates than DGEBA and Diallyl-DGEBA epoxy resin systems. The conversion rates of these epoxy resin systems with DDM hardener are lower than those with HF-1M hardener. It can be considered that the optimum hardener for Ethoxysilyl-DGEBA epoxy resin system is Phenol Novolac type. These lower cure conversion rates in the Ethoxysilyl-DGEBA epoxy resin systems could be explained by the retardation of reaction molecule movements according to the formation of organic-inorganic hybrid network structure by epoxy and ethoxysilyl group in Ethoxysilyl- DGEBA epoxy resin system.

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Cure Kinetics of Cycloaliphatic Epoxy/Silica System for Electrical Insulation Materials in Outdoor Applications

  • Lee, Jae-Young;Park, Jae-Jun;Kim, Jae-Seol;Shin, Seong-Sik;Yoon, Chan-Young;Cheong, Jong-Hoon;Kim, Young-Woo;Kang, Geun-Bae
    • Transactions on Electrical and Electronic Materials
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    • v.16 no.2
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    • pp.74-77
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    • 2015
  • The cure kinetics of a neat epoxy system and epoxy/silica composite were investigated by DSC analysis. A cycloaliphatic type epoxy resin was diglycidyl 1,2-cyclohexanedicarboxylate and curing agent was anhydride type. To estimate kinetic parameters, the Kissinger equation was used. The activation energy of the neat epoxy system was 88.9 kJ/mol and pre-exponential factor was 2.64×1012 min−1, while the activation energy and pre-exponential factor for epoxy/silica composite were 97.4 kJ/mol and 9.21×1012 min−1, respectively. These values showed that the silica particles have effects on the cure kinetics of the neat epoxy matrix.

Studies on Cure Behavior, Thermal Stability, and Rheological properties of Tetrafunctional Epoxy/Biodegradable MAP Blends (4관능성 에폭시/생분해성 MAP 블렌드의 열적 특성 경화거동 및 유변학적 특성에 관한 연구)

  • 박수진;신유식;김봉섭;박병기
    • Textile Science and Engineering
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    • v.38 no.4
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    • pp.164-173
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    • 2001
  • The effect of biodegradable modified aliphatic polyester (MAP) on neat tetrafunctional epoxy (4EP) was investigated in terms of cure kinetics, thermal stabilities, and rheological properties. The 4,4'-diamino diphenyl methane (DDM) was used as a curing agent for the blend system and the content of 4EP/MAP was varied with the in the 100:0, 90:10, 80:20, 70:30, and 60:40 wt%. As a result, the cure activiation energies ($E_{a}$) for the cure kinetics obtained by dynamic DSC method using Kissinger equation, were increased in 10 and 20 wt% of MAP compared with neat 4EP, due to the increasing intermolecular interaction between 4EP and MAP. And the decomposition activation energies ($E_{t}$) for thermal stability derived fromthe integral method of Horowitz-Metzger equation, were increased within the 10∼30 wt% composition range of MAP, resulting from increased crosslinking density in the blend system. The cross-linking activation energies ($E_{c}$) for rheological properties determined from the Arrhenius equation based on gel time and curing temperature, exhibited similar behavior to those of integral method which could be explained by the miscibility between 4EP and MAP.

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Cure Kinetics for the Acid Anhydride-cured Epoxy System Using a Near-infrared Reflection Spectroscopy (근적외선 분광분석을 통한 산무수물경화 에폭시 시스템의 경화 동력학)

  • 곽근호;박수진;이재락
    • Polymer Korea
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    • v.24 no.1
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    • pp.65-71
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    • 2000
  • The latent properties and cure kinetics of an acid anhydride-cured epoxy resin have been investigated by a near-infrared (NIR) reflection spectroscopy. The assignments of the latent properties and cure behaviors were performed by the measurements of the NIR reflectance for epoxide and hydroxyl groups at different temperatures. A comprehensive analysis of the origin, location, and shifts during reaction of all major NIR absorption peaks in the spectral range from 4000 to 7100 $cm^{-1}$ / was provided. The extent of reaction was determined from NIR absorption band at the 4530 $cm^{-1}$ / depending on epoxide concentration and cure temperature.

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Cure simulation in LED silicone lense using dynamic reaction kinetics method (승온 반응속도식을 이용한 LED용 실리콘 렌즈의 경화공정해석)

  • Song, Min-Jae;Hong, Seok-Kwan;Park, Jeong-Yeon;Lee, Jeong-Won;Kim, Heung-Kyu
    • Journal of the Korea Society of Die & Mold Engineering
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    • v.8 no.2
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    • pp.46-49
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    • 2014
  • Silicone is recently used for LED chip lense due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for curing process during silicone molding. For analysis of curing process, a dynamic cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the slow cure reduced abrupt reaction heat and it was predicted decrease of the residual stress.

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Diffusion-controlled Cure Kinetics of High Performance Epoxy/Carbon Fiber Composite Systems (확산속도에 따라 한계경화도를 갖는 에폭시/탄소섬유 복합재료의 경화반응 속도 연구)

  • 박인경;금성우;이두성;김영준;남재도
    • Polymer Korea
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    • v.24 no.1
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    • pp.105-112
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    • 2000
  • Using a commercial epoxy/carbon fiber composite prepreg (DMS 2224) as a model system, the cure kinetics of vitrifying thermoset system were analyzed by isothermal and dynamic-heating experiments. Focusing on the processing condition of high performance composite systems, a phenomenological kinetic model was developed by using differential scanning calorimetry (DSC) and reaction kinetics theories. The model system exhibited a limited degree of cure as a function of isothermal temperature seemingly due to the diffusion-controlled reaction rates. The diffusion-controlled cure reaction was incorporated in the development of the kinetic model, and the model parameters were determined from isothermal experiments. The first order reaction was confirmed from the characteristic shape of isothermal cure thermograms, and the activation energy wes 78.43 kJ/mol. Finally, the proposed model was used to predict a complex autoclave thermal condition, which was composed of several isothermal and dynamic-heating stages.

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Cure Properties of Isocyanurate Type Epoxy Resin Systems for FO-WLP (Fan Out-Wafer Level Package) Next Generation Semiconductor Packaging Materials (FO-WLP (Fan Out-Wafer Level Package) 차세대 반도체 Packaging용 Isocyanurate Type Epoxy Resin System의 경화특성연구)

  • Kim, Whan Gun
    • Journal of the Semiconductor & Display Technology
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    • v.18 no.1
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    • pp.65-69
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    • 2019
  • The cure properties of ethoxysilyl diglycidyl isocyanurate(Ethoxysilyl-DGIC) and ethylsilyl diglycidyl isocyanurate (Ethylsilyl-DGIC) epoxy resin systems with a phenol novolac hardener were investigated for anticipating fan out-wafer level package(FO-WLP) applications, comparing with ethoxysilyl diglycidyl ether of bisphenol-A(Ethoxysilyl-DGEBA) epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The isocyanurate type epoxy resin systems represented the higher cure conversion rates comparing with bisphenol-A type epoxy resin systems. The Ethoxysilyl-DGIC epoxy resin system showed the highest cure conversion rates than Ethylsilyl-DGIC and Ethoxysilyl-DGEBA epoxy resin systems. It can be figured out by kinetic parameter analysis that the highest conversion rates of Ethoxysilyl-DGIC epoxy resin system are caused by higher collision frequency factor. However, the cure conversion rate increases of the Ethylsilyl-DGEBA comparing with Ethoxysilyl-DGEBA are due to the lower activation energy of Ethylsilyl-DGIC. These higher cure conversion rates in the isocyanurate type epoxy resin systems could be explained by the improvements of reaction molecule movements according to the compact structure of isocyanurate epoxy resin.

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