• Title, Summary, Keyword: cure kinetics

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The effect of hexamethylenetetramine contents and cure properties on friction characteristics of phenolic resin (페놀수지의 마찰특성에 미치는 HEXA의 함량 및 경화도의 영향)

  • Kim, Dae-Kyeun;Jang, Ho;Yoon, Ho-Gyu
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • pp.49-56
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    • 1999
  • A material was formulated with Phenol novolac and HEXA only. The cure kinetics and thermal characteristics of phenol novolac with various HEXA contents were peformed by differential scanning calorimetry and thermal gravimetric analysis. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction goes through an autocatalytic kinetic mechanism. The friction and wear characteristics of this material were determined using friction material testing machine. The friction coefficient of phenol novolac with various HEXA contents was determined using the PV(pressure & velocity) factor. The most stable and highest friction coefficient with a various pressure and velocity condition was found at HEXA 10 wt.% material. The specific wear rate per unit sliding distance with a various HEXA contents was reported.

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Cure Kinetics of DGEBA/MBA/MN and DGEBA/MDA/MN/HQ Systems by Kissinger Equation and Fractional Life Method (Kissinger Equation과 Fractional Life법에 의한 DGEBA/MDA/MN계와 DGEBA/MDA/MN/HQ계의 경화반응 속도론)

  • Lee, Jae-Young;Shim, Mi-Ja;Kim, Sang-Wook
    • Applied Chemistry for Engineering
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    • v.5 no.4
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    • pp.731-736
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    • 1994
  • Cure kinetics of DGEBA/MDA/MN system with and without HQ were studied by Fractional life method and Kissinger equation. And the effect of HQ as a catalyst was studied. As cure temperature increased, the reaction rate increased and reaction order was almost constant. The activation energy of the system with HQ was lower about 13% and the reaction rate was higher than that of the system without HQ. It was because hydroxyl group of HQ formed a transition state with epoxide group and amine group and opened the epoxide ring easily and rapidly.

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Rheological Properties and Cure Kinetics of Cycloaliphatic/DGEBA Epoxy Blend System Initiated by Cationic Latent Curing Agent (잠재성 경화제를 이용한 Cycloaliphatic/DGEBA계 에폭시 블렌드 시스템의 유변학적 특성 및 경화 동력학)

  • 곽근호;박수진;이재락;김영근
    • The Korean Journal of Rheology
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    • v.10 no.4
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    • pp.227-233
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    • 1998
  • The effects of 1 mol% N-benzylpyrazinium hexafluoroantimonate(BPH) as a thermal latent initiator and blend compositions composed of cycloaliphatic and DGEBA epoxies were investigated in the rheological properties and cure kinetics. Latent properties were performed by measurement of the conversion as a function of reaction time using isothermal DSC at $150^{\circ}C$ and $50^{\circ}C$ Rheological properties of the blend systems were investigated in terms of isothermal experiments using a rheometer. The gelation time was obtained from the evaluation of storage modulus (G'), loss modulus (G") and damping factor (tan$\delta$)). Cross-linking activation energy ($E_c$) was also determined from the Arrhenius equation based on gel time and curing temperature. As a result, the gel time and cross-linking activation energy increased with increasing DGEBA composition. The cure activation energies ($E_a$) were obtained by Kissinger method using dynamic DSC thermograms. In this work, the cure activation energy decreased with increasing CAE concentration, which might be resulted from the short repeat units, simple side-groups and viscosity of reaction media.edia.

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Curing Kinetics of the No-Flow Underfill Encapsulant

  • Jung, Hye-Wook;Han, Sang-Gyun;Kim, Min-Young;Kim, Won-Ho
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • pp.134-137
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    • 2001
  • The cure kinetics of a cycloalipatic epoxy / anhydride / Co(II) system for a no-flow underfill encapsulant, has been studied by using a differential scanning calorimetry(DSC) under isothermal and dynamic conditions over the temperature range of $160^{\circ}C ~220^{\circ}C$. The kinetic analysis was carried out by fitting dynamic/isothermal heating experimental data to the kinetic expressions to determine the reaction parameters, such as order of reaction and reaction constants. Diffusion-controlled reaction has been observed as the cure conversion increases and successfully analyzed by incorporating the diffusion control term into the rate equation. The prediction of reaction rates by the model equation corresponded well to experimental data at all temperature.

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Cure Kinetics of Epoxy/Diamine System Modified with Malononitrile by Barrett Method and Integral Method (Malononitrile에 의해 개질된 Epoxy/Diamine계의 경화반응 속도론: Barrett Method와 Integral Method)

  • Cheon, In-Suk;Don, Yun-Seung;Sim, Mi-Ja;Kim, Sang-Uk
    • Korean Journal of Materials Research
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    • v.4 no.5
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    • pp.574-580
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    • 1994
  • This study is about cure kinetics of DGEBA/MDA/MN(malononitrile) system by Barrett method and Integral method using DSC dynamic run. Curing behavior was shown through DSC and the heat change involved in a reaction could be measured directly with DSC. The kinetic parameters such as activation energy, pre-exponential factor and reaction order were given by Barrett method and Integral method obtained in an assumption that the area of DSC enthalpic analysis curve was propotional to the enthalpic change.

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Cure Characteristics of Metal Particle Filled DGEBA/MDA/SN/ zeolite Composite System for EMI Shielding

  • Cho, Young-Shin;Lee, Hong-Ki;Shim, Mi-Ja;Kim, Sang-Wook
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • pp.548-551
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    • 1999
  • The cure characteristics of metal particle filled DGEBA/MDA/SN/ zeolite epoxy resin composite system for EMI shielding were investigated by dynamic DSC run method and FT-lR spectroscopy. As the heating rate increased, the peak temperature on dynamic DSC curve increased because of the rapid cure reaction. From the straight line of the Kissinger plot, the curing reaction activation energy and pre-exponential factor could be obtained. As the post-curing time at 15$0^{\circ}C$ increased, the glass increased the glass transition temperature or the thermal stability increased. When the post curing time is too long, the system filled with metallic Al particle can be thermally oxidized by the catalytic reaction of metal filler and the thermal stability of the composite for the EMI shielding application may be decreased.

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Curing Kinetics of Amine Terminated Polyetherimide/Epoxy Resin Blends and Its Application on the High Toughness Composites (Amine terminated polyetherimide/Epoxy 블렌드의 경화공정과 고강인성 복합재료에의 응용)

  • 김민영;김성호;이광기;김원호;안병현
    • Proceedings of the Korean Society For Composite Materials Conference
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    • pp.49-52
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    • 2001
  • The investigation of cure kinetics, morphology, and fracture toughness studies on epoxy resin/amine terminated PEI/Anhydride system were performed by differential scanning calorimetry and scanning electron microscopy. Modified autocatalystic kinetics model was applied by isothermal scan test. The fracture toughness for the neat epoxy resin was 2.15 MPa m0.5 and the fracture toughness was improved 45% as neat epoxy resin system. The generation of secondary phase of AT-PEI was observed and its size was grown up by increasing contents of PEI.

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