• Title, Summary, Keyword: epoxy resin

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Measurement of Flash Points of Epoxy Resin Solutions by Using Additives (첨가제 사용에 의한 Epoxy Resin 용액의 인화점 측정)

  • Ha, Dong-Myeong
    • Journal of the Korean Society of Safety
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    • v.22 no.3
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    • pp.22-27
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    • 2007
  • The knowledge of the flash point of the various liquid substances is required because of process safety and control in industrial fire protection. The epoxy resin is one of versatile resins that has wide selection of using curing agents and additives to achieve various applications such as coatings, adhesives, interior materials, reinforced plastics and electrical insulation. In this study, the lower flash points for p-xylene+epoxy resin, o-xylene+epoxy resin and n-butanol+epoxy resin systems were measured by using Pensky-Martens closed cup tester. The lower flash points for p-xylene+epoxy resin, o-xylene+epoxy resin and n-butanol+epoxy resin systems rapidly increased 80wt%, 90wt% and 95wt% of epoxy resin concentration, respectively. This results serve as a guide to estimate flash point of any epoxy resin solution.

Cure Characteristics of Ethoxysilyl Bisphenol A Type Epoxy Resin Systems for Next Generation Semiconductor Packaging Materials (새로운 반도체 Packaging용 Ethoxysilyl Bisphenol A Type Epoxy Resin System의 경화특성 연구)

  • Kim, Whan Gun
    • Journal of the Semiconductor & Display Technology
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    • v.16 no.2
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    • pp.19-26
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    • 2017
  • The cure properties of ethoxysilyl bisphenol A type epoxy resin (Ethoxysilyl-DGEBA) systems with different hardeners were investigated, comparing with DGEBA and Diallyl-DGEBA epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The Ethoxysilyl-DGEBA epoxy resin system showed lower cure conversion rates than DGEBA and Diallyl-DGEBA epoxy resin systems. The conversion rates of these epoxy resin systems with DDM hardener are lower than those with HF-1M hardener. It can be considered that the optimum hardener for Ethoxysilyl-DGEBA epoxy resin system is Phenol Novolac type. These lower cure conversion rates in the Ethoxysilyl-DGEBA epoxy resin systems could be explained by the retardation of reaction molecule movements according to the formation of organic-inorganic hybrid network structure by epoxy and ethoxysilyl group in Ethoxysilyl- DGEBA epoxy resin system.

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Curing Behavior and Thermal Properties of DGEBA/phenol Novolac Epoxy Resin (DGEBA/phenol Novolac 에폭시 수지의 경화거동 및 열적 특성)

  • Jeong, Jin Wook;Won, Jong Sung;Jo, Won Gi;Cho, Ho Hyeon;Kim, Eui Hwa;Lee, Seung Goo
    • Textile Science and Engineering
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    • v.55 no.1
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    • pp.41-47
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    • 2018
  • To enhance the viscosity and thermal resistance of DGEBA epoxy resin, a phenol novolac-type epoxy resin was added to a hot melt-type epoxy prepreg. The mixtures of DGEBA solid and liquid epoxy resin, and phenol novolac epoxy resin were prepared with different mixing ratios. The effect of the mixing ratio on the curing behavior, thermal stability and viscosity of the blended epoxy resin was investigated. The curing behavior did not vary significantly with the mixing ratio. The activation energy increased as the content of phenol novolac-type epoxy resin was increased up to 40 wt%. The thermal resistance and viscosity of the mixed epoxy resin increased significantly when the phenol novolac-type epoxy resin and solid epoxy resin occupied more than 20 wt%.

Cure Properties of Isocyanurate Type Epoxy Resin Systems for FO-WLP (Fan Out-Wafer Level Package) Next Generation Semiconductor Packaging Materials (FO-WLP (Fan Out-Wafer Level Package) 차세대 반도체 Packaging용 Isocyanurate Type Epoxy Resin System의 경화특성연구)

  • Kim, Whan Gun
    • Journal of the Semiconductor & Display Technology
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    • v.18 no.1
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    • pp.65-69
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    • 2019
  • The cure properties of ethoxysilyl diglycidyl isocyanurate(Ethoxysilyl-DGIC) and ethylsilyl diglycidyl isocyanurate (Ethylsilyl-DGIC) epoxy resin systems with a phenol novolac hardener were investigated for anticipating fan out-wafer level package(FO-WLP) applications, comparing with ethoxysilyl diglycidyl ether of bisphenol-A(Ethoxysilyl-DGEBA) epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The isocyanurate type epoxy resin systems represented the higher cure conversion rates comparing with bisphenol-A type epoxy resin systems. The Ethoxysilyl-DGIC epoxy resin system showed the highest cure conversion rates than Ethylsilyl-DGIC and Ethoxysilyl-DGEBA epoxy resin systems. It can be figured out by kinetic parameter analysis that the highest conversion rates of Ethoxysilyl-DGIC epoxy resin system are caused by higher collision frequency factor. However, the cure conversion rate increases of the Ethylsilyl-DGEBA comparing with Ethoxysilyl-DGEBA are due to the lower activation energy of Ethylsilyl-DGIC. These higher cure conversion rates in the isocyanurate type epoxy resin systems could be explained by the improvements of reaction molecule movements according to the compact structure of isocyanurate epoxy resin.

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Mechanical Characteristics of CF Laminated Prepreg with UV-thermal Dual Curable Epoxy Resin (광·열경화형 수지를 이용한 탄소섬유 프리프레그의 물리적 특성)

  • Sim, Ji-hyun;Kim, Ji-hye;Park, Sung-min;Koo, Kwang-hoe;Jang, Key-wook;Bae, Jin-seok
    • Textile Coloration and Finishing
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    • v.29 no.1
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    • pp.37-44
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    • 2017
  • An issue of major concern in the utilization of laminated composites based epoxy resin is associated with the occurrence of delaminations or interlaminar cracks, which may be related to manufacturing defects or are induced in service by low-velocity impacts. A strong interfacial filament/brittle epoxy resin bonding can, however, be combined with the high fracture toughness of weak interfacial bonding, when the filaments are arranged to have alternate sections of shear stress. To improve this drawback of the epoxy resin, UV-thermal dual curable resin were developed. This paper presents UV-thermal dual curable resin which were prepared using epoxy acrylate oligomer, photoinitiators, a thermal-curing agent and thermoset epoxy resin. The UV curing behaviors and characteristics of UV-thermal dual curable epoxy resin were investigated using Photo-DSC, DMA and FTIR-ATR spectroscopy. The mechanical properties of UV-thermal dual curable epoxy resin impregnated CF prepreg by UV curable resin content were measured with Tensile, Flextural, ILSS and Sharpy impact test. The obtained results showed that UV curable resin content improves the epoxy toughness.

Effect of nanofillers on the dielectric properties of epoxy nanocomposites

  • Wang, Q.;Chen, G.
    • Advances in materials Research
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    • v.1 no.1
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    • pp.93-107
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    • 2012
  • Epoxy resin is widely used in high voltage apparatus as insulation. Fillers are often added to epoxy resin to enhance its mechanical, thermal and chemical properties. The addition of fillers can deteriorate electrical performance. With the new development in nanotechnology, it has been widely anticipated that the combination of nanoparticles with traditional resin systems may create nanocomposite materials with enhanced electrical, thermal and mechanical properties. In the present paper we have carried out a comparative study on dielectric properties, space charge and dielectric breakdown behavior of epoxy resin/nanocomposites with nano-fillers of $SiO_2$ and $Al_2O_3$. The epoxy resin (LY556), commonly used in power apparatus was used to investigate the dielectric behavior of epoxy resin/nanocomposites with different filler concentrations. The epoxy resin/nanocomposite thin film samples were prepared and tests were carried out to measure their dielectric permittivity and tan delta value in a frequency range of 1 Hz - 1 MHz. The space charge behaviors were also observed by using the pulse electroacoustic (PEA) technique. In addition, traditional epoxy resin/microcomposites were also prepared and tested and the test results were compared with those obtained from epoxy resin/nanocomposites.

The Study of Water Stability of MDF Cement Composite by Addition of Epoxy Resin and Manufacturing Process (Epoxy Resin 첨가 및 제조공정에 따른 MDF 시멘트 복합재료의 수분안정성 연구)

  • 노준석;김태진;박춘근;최상홀
    • Journal of the Korean Ceramic Society
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    • v.35 no.4
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    • pp.371-377
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    • 1998
  • The effect of epoxy resin on the water stability of HAC/PVA based MDF cement composite were stu-died through the three different forming methods calendering extruding and warm pressing. In prexing step the epoxy resin was added in 5-15wt% of cement weight. The 3-point flexural strength of each dry and wet specimen which were immersed in water during 3. 7, 14 days was estmated and the mi-crostructural change of epoxy resin-added MDF cement composite due to water immersion was charac-terized by scanning electron microscopy. As the addition amount of epoxy resin the im-provement of water stability of MDF cement composite was achieved in most case. Especially through the warm press forming method the effectiveness of epoxy resin addition to the water stability was enhanced. When the epoxy resin was added by 5wt% to 7wt% the optimum flexural strength and water stability

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The Effect of Thermal Decomposition of Epoxy Resin for a Variation of Hardener (에폭시수지의 경화제 변화량에 따르는 열분해 영향)

  • Park, Keun-Ho;Lee, Yong-Sook;Song, Ju-Yeong;Lee, Soo;Kim, Sung-Il
    • Journal of the Korean Applied Science and Technology
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    • v.24 no.4
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    • pp.393-398
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    • 2007
  • We investigated heat stability of epoxy resin products and epoxy resin according to the influence hardener. The heat flow which shows the degree of thermal decomposition of the epoxy resin product and epoxy resin measured by using the differential scanning calorimeter (DSC). As a result, we found that in the case of heat stability for epoxy resin as hardener was added, the ratio of one to one (epoxy resin : hardener) was the most suitable in air condition and nitrogen atmosphere.

Study on Properties of Waterborne Polyurethane-Epoxy Hybrid Resin for Leather Garment Coationgs (의상 피혁 가공용 수용성 폴리우레탄-에폭시 하이브리드 수지의 합성 및 물성에 관한 연구)

  • Lee, Joo-Youb;Kim, Ki-Jun
    • Journal of the Korean Applied Science and Technology
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    • v.27 no.3
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    • pp.325-336
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    • 2010
  • In this study, we experimented that how to synthesis waterborne urethane-epoxy hybrid resin for leather garment coatings. First of all, We had analyzed datas by FT-IR, SEM and TGA for the machanical properties. By instruments analysis measurement we confirmed that synthesis of urethane and epoxy. In this experiment we knew that polyurethane and urethane-epoxy hybrid resin have 4~5 grades of solvent resistance. Tensile strength measured in the urethane-epoxy resin(epoxy 12%, 2.033$kg_f/mm^2$) had the most strong strength than polyurethane(1.833 $kg_f/mm^2$) emulsion samples. Also urethane-epoxy hybrid resin had better result than polyurethane in acid resistance and abrasion test. As hight proportion of epoxy in hybid resin, we obtained low elongation and low flexibility. In this result, the mechanical properties of waterborne polyurethane-epoxy hybrid resin showed that how effect in leather coating by ratio of epoxy emulsion.