• Journal of the Korean Ceramic Society
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• v.35 no.9
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• pp.899-904
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• 1998

Interface reaction between LSMC and YSZ is discussed with chemical composition of LSMC. The reac-tivity between LSMC and YSZ increased with increasing Co amount and A-site deficient perovskite is very effective on reducing reactivity. The (La0.8Sr0.2)xMn0.8Co0.2O3 (X=0.9-1) composition is not reactive with YSZ in experimental range. The electrode reaction reaction resistance increases due to reaction product.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.34 no.5
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• pp.88-92
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• 2006

Proto Flight Model of Reaction Wheel Assembly Interface Unit(RIU) for STSAT-2 was developed. The RIU of STSAT2 has three major functions for interface between satellite system and RWAs. It has switches for RWA main power, communication Mux. and communication line driver.

• Proceedings of the KWS Conference
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• pp.6-9
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• 1996

The Joining of copper rod and zirconia tube was carried out in Ar gas atmosphere. There are two type of the joining. The one is the reaction bond consisting of Cu and zirconia was dominated by surface reaction wi th a undetctable very thin layer. It was found that copper elements were diffused to zirconia side, but that most of Z $r^{4+}$ ions were not diffused to copper side. This result means application of a DC voltage to migrate oxygen to the copper/zirconia interface can oxidize metal at the copper /zirconia interface, and the bonding reaction between zirconia and copper oxide may occur. The other is the reaction bonding was dominated by interdiffusion with a very thick interface layer. This result means application of a DC voltage can reduce zirconia at the interface. The bonding reaction is to be an alloying between Zr and Cr.

• Journal of the Ergonomics Society of Korea
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• v.35 no.5
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• pp.403-411
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• 2016

Objective: This study is concerned with the user interface (UI) design of touch screen based on the reaction time of Automated Teller Machine (ATM) user. Background: Adopting the touch screen technology, the ATM service has recently established a new user interface different from the existing button-type interface. Method: Experiments were conducted by simulating ATM touch screen layouts, and layouts were focused on location of menu buttons (left and right, top and bottom), number of menu buttons (8 and 12 buttons). Results: The results show that there are significant differences in correction ratio and reaction time by user groups, types of menu location, and the number of buttons. Conclusion and Applications: The results of this study can be used to provide baseline information for the interface design of ATM touch screen and the age differences in reaction time.

• Journal of the Korean Society for Computer Game
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• v.30 no.1
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• pp.1-9
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• 2017

In this paper, we analyze user's manipulation and reaction in an accelerometer-based game interface, as compared with a touch joystick-based game interface. To roll the ball, the user carefully grabs and adjusts the smartphone with both hands in the accelerometer-based game interface; while the user very quickly clicks the up, down, left, right, buttons in the touch joystick-based game interface, because it is already familiar to the user. The accelerometer-based game interface is relatively more immersive and interesting than the touch joystick-based game interface; because the user gets more desired results by elaborately operating the game with both hands rather than by clicking the buttons with the thumb.

• 한국전기화학회:학술대회논문집
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• pp.383-390
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• 2005

Effect of applying a DC voltage on the interfacial reaction at the metal to zirconia interface was investigated utilizing an oxygen ionic conductivity of partially stabilized zirconia. The joining of copper rod and zirconia tube was carried out in Ar gas atmosphere at $1000^{\circ}C$. There are two type of the joining. The one is the reaction bond consisting of copper and zirconia was dominated by surface reaction with a undetectable very thin layer. It was found that copper elements were diffused to zirconia side, but that Zr ions were not diffused to copper side. These results mean application of a DC voltage to migrate oxygen to the copper-zirconia interface can oxidize metal at the copper-zirconia interface and the bonding reaction between zirconia and copper oxide may occur. The other is the reaction bonding was dominated by interdiffusion with a very thick interface layer. This result mean application of a DC voltage can reduce zirconia at the interface. The bonding reaction is to be an alloying between Zr and Cu.

• Applied Chemistry for Engineering
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• v.16 no.2
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• pp.288-291
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• 2005

Resol type phenol-formaldehyde (PF) resin was synthesized by addition reaction of formaldehyde (F) and phenol (P). And the PF resin was synthesized by condensation reaction in which water was removed. In this work, we studied the influence of experimental parameters in the addition reaction, such as F/P mole ratio, amount of catalyst, reaction temperature, reaction time, and so on. Also, we studied the influence of molecular weight and viscosity of PE resin as a function of condensation time. As a result, in addition reaction, the reaction time decreased remarkably as the catalyst concentration increased, and the time decreased with increasing reaction temperature at a constant catalyst concentration. Also, in condensation reaction, the viscosity of resol type PF resin increased from 1500 to 9000 cps as a function of condensation time; molecular weight showed from 500 to 1100 g/mol.

• Proceedings of the Korean Society of Rheology Conference
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• pp.25-27
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• 2002

In this study we investigated the reaction kinetics by a convenient but useful method-rheology to characterize the interface between two immiscible blends with a Reactive compatibilizer. Also, we made an attempt to correlate changes of interface roughness with rheological properties. The blend systems employed in this study was mono-carboxylated polystyrene (PS-mCOOH) and an poly(methyl methacrylate-ran-glycidylmethacrylate) (PMMA-GMA). PS-mCOOH was synthesized by an anionic polymerization and PMMA-GMA by a free radical polymerization. We prepared two plates of each polymer using compression molding with a smooth surface molder, then put one upon another. As soon as these two plates welds together inside a rheometer under nitrogen environment, the torque and moduli were obtained with reaction time at different temperatures. Through the analysis of this modulus change with reaction time, we estimated interfacial reaction and roughening. The increment of modulus in initial state can be correlated to the extent of reaction. We obtained the reaction kinetic constant by fitting appropriate kinetic equation into experimental data. We also showed that increment of modulus in later state was due to by roughened interface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• pp.332-336
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• 2001

In this study, the reaction at UBM(Under Bump Metallurgy) and solder interface was investigated. The UBM employed in conventional optical packages, Au/Pt/Ti layer, were found to dissolve into molten Au-Sn eutectic solder during reflow soldering. Therefore, the reaction with different diffusion barrier layer such as Fe, Co, Ni were investigated to replace the conventional Pt layer. The reaction behavior was investigated by reflowing the solder on the pad of the metals defined by Cr layer for 1, 2, 3, 4, and 5 minutes at $330^{\circ}C$. Among the metals, Co was found to be most suitable for the diffusion barrier layer as the wettability with the solder was reasonable and the reaction rate of intermetallic formation at the interface is relatively slow.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• pp.332-336
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• 2001

In this study, the reaction at UBM(Under Bump Metallurgy) and solder interface was investigated. The UBM employed in conventional optical packages, Au/Pt/Ti layer, were found to dissolve into molten Au-Sn eutectic solder during reflow soldering. Therefore, the reaction with different diffusion barrier layer such as Fe, Co, Ni were investigated to replace the conventional R layer. The reaction behavior was investigated by reflowing the solder on the pad of the metals defined by Cr layer for 1, 2, 3, 4, and 5 minutes at 330$^{\circ}C$. Among the metals, Co was found to be most suitable for the diffusion barrier layer as the wettability with the solder was reasonable and the reaction rate of intermetallic formation at the interface is relatively slow.