• Title, Summary, Keyword: on-chip power module

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Design and analysis of Power supply module in the low power passive transponder (저전력 패시브 트랜스폰더의 전원 모듈에 대한 설계와 분석)

  • Yang, Kyeong-Rok;Kim, Kwang-Soo;Jin, In-Su;Kim, Jong-Beom;Kim, Yang-Mo
    • Proceedings of the KIEE Conference
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    • pp.2647-2649
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    • 1999
  • Electric power system is consisted of power supply and power enable circuit. Power supply provides operating voltage with internal chip. Depending on the operating voltage, power enable circuit provides operating signal, PWREN. Because energy is obtained from signal of external station, passive transponder must have the low power consumption. In this paper, the power supply module of the low power transponder is designed and analyzed.

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Design of Interface Bridge in IP-based SOC

  • 정휘성;양훈모;이문기
    • Proceedings of the IEEK Conference
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    • pp.349-352
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    • 2001
  • As microprocessor and SOC (System On a Chip) performance moves into the GHz speed, the high-speed asynchronous design is becoming challenge due to the disadvantageous power and speed aspects in synchronous designs. The next generation on-chip systems will consist of multiple independently synchronous modules and asynchronous modules for higher performance, so the interface module for data transfer between multiple clocked IPs is designed with Xilinx FPGA and simulated with RISC microprocessor.

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Design of a GaN HEMT 4 W Miniaturized Power Amplifier Module for WiMAX Band (WiMAX 대역 GaN HEMT 4 W 소형 전력증폭기 모듈 설계)

  • Jeong, Hae-Chang;Oh, Hyun-Seok;Heo, Yun-Seong;Yeom, Kyung-Whan;Kim, Kyoung-Min
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.22 no.2
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    • pp.162-172
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    • 2011
  • In this paper, a design and fabrication of 4 W power amplifier for the WiMAX frequency band(2.3~2.7 GHz) are presented. The adopted active device is a commercially available GaN HEMT chip of Triquint Company, which is recently released. The optimum input and output impedances are extracted for power amplifier design using a specially self-designed tuning jig. Using the adopted impedances value, class-F power amplifier was designed based on EM simulation. For integration and matching in the small package module, spiral inductors and interdigital capacitors are used. The fabricated power amplifier with $4.4{\times}4.4\;mm^2$ shows the efficiency above 50 % and harmonic suppression above 40 dBc for second(2nd) and third(3rd) harmonic at the output power of 36 dBm.

A Novel Soft Switched Auxiliary Resonant Circuit of a PFC ZVT-PWM Boost Converter for an Integrated Multi-chips Power Module Fabrication (PFC ZVT-PWM 승압형 컨버터에서 통합형 멀티칩 전력 모듈 제조를 위한 개선된 소프트 스위치 보조 공진 회로)

  • Kim, Yong-Wook;Kim, Rae-Young;Soh, Jae-Hwan;Choi, Ki-Young
    • The Transactions of the Korean Institute of Power Electronics
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    • v.18 no.5
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    • pp.458-465
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    • 2013
  • This paper proposes a novel soft-switched auxiliary resonant circuit to provide a Zero-Voltage-Transition at turn-on for a conventional PWM boost converter in a PFC application. The proposed auxiliary circuit enables a main switch of the boost converter to turn on under a zero voltage switching condition and simultaneously achieves both soft-switched turn-on and turn-off. Moreover, for the purpose of an intelligent multi-chip power module fabrication, the proposed circuit is designed to satisfy several design constraints including space saving, low cost, and easy fabrication. As a result, the circuit is easily realized by a low rated MOSFET and a small inductor. Detail operation and the circuit waveform are theoretically explained and then simulation and experimental results are provided based on a 1.8 kW prototype PFC converter in order to verify the effectiveness of the proposed circuit.

A Study On Design of ZigBee Chip Communication Module for Remote Radiation Measurement (원격 방사선 측정을 위한 ZigBee 원칩형 통신 모듈 설계에 대한 연구)

  • Lee, Joo-Hyun;Lee, Seung-Ho
    • Journal of IKEEE
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    • v.18 no.4
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    • pp.552-558
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    • 2014
  • This paper suggests how to design a ZigBee-chip-based communication module to remotely measure radiation level. The suggested communication module consists of two control processors for the chip as generally required to configure a ZigBee system, and one chip module to configure a ZigBee RF device. The ZigBee-chip-based communication module for remote radiation measurement consists of a wireless communication controller; sensor and high-voltage generator; charger and power supply circuit; wired communication part; and RF circuit and antenna. The wireless communication controller is to control wireless communication for ZigBee and to measure radiation level remotely. The sensor and high-voltage generator generates 500 V in two consecutive series to amplify and filter pulses of radiation detected by G-M Tube. The charger and power supply circuit part is to charge lithium-ion battery and supply power to one-chip processors. The wired communication part serves as a RS-485/422 interface to enable USB interface and wired remote communication for interfacing with PC and debugging. RF circuit and antenna applies an RLC passive component for chip antenna to configure BALUN and antenna impedance matching circuit, allowing wireless communication. After configuring the ZigBee-chip-based communication module, tests were conducted to measure radiation level remotely: data were successfully transmitted in 10-meter and 100-meter distances, measuring radiation level in a remote condition. The communication module allows an environment where radiation level can be remotely measured in an economically beneficial way as it not only consumes less electricity but also costs less. By securing linearity of a radiation measuring device and by minimizing the device itself, it is possible to set up an environment where radiation can be measured in a reliable manner, and radiation level is monitored real-time.

RF High Power Amplifier Module using AlN Substrate (AlN 기판을 이용한 RF 고전력 증폭기 모듈)

  • Kim, Seung-Yong;Nam, Choong-Mo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.22 no.10
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    • pp.826-831
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    • 2009
  • In this paper, a high power RF amplifier module using AlN substrate of high thermal conductivity has been proposed. This RF amplifier module has the advantage of compact size and effective heat dissipation for the packaging of high power chip. To fabricate the thru-hole and scribing line on AlN substrate, the key parameters of $CO_2$ laser were experimented. And then, microstrip lines and spiral planar inductors were fabricated on an AlN substrate using the thin-film process. The fabricated microstrip lines on the AlN substrate has an attenuation value of 0.1 dB/mm up to 10 GHz. The fabricated spiral planar inductor has a high quality factor, a maximum of about 62 at 1 GHz for a 5.65 nH inductor. Packaging of a RF power amplifier was implemented on an AlN substrate with thru-hole. From the measured results, the gain is 24 dB from 13 to 15 GHz and the output power is 33.65 dBm(2.3 W).

Design of a Low-Power MOS Monolithic Peak Detector (저전력 MOS 모놀리식 피크 감지기의 설계)

  • 박광민;백경호
    • Proceedings of the IEEK Conference
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    • pp.217-220
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    • 2000
  • In this paper, A low-power MOS monolithic peak detector is presented. Designed for monolithic and low-power characteristics, this MOS peak detector can be integrated easily on the same chip as a module of large communication systems. The simulation results of this peak detector which was composed with four NMOSs and two capacitors show the power dissipation of 0.972㎽ and the good operations for 2㎓ operating pulse frequency. Therefore, it may be used as a functional block for various signal processing systems.

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Technology Development of Entry-Level MiC Smart Photovoltaic System based on SOC (SoC 기반 보급형 MiC 스마트 태양광발전시스템 기술개발)

  • Yoon, Yongho
    • The Journal of The Institute of Internet, Broadcasting and Communication
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    • v.20 no.3
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    • pp.129-134
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    • 2020
  • Moisture infiltration inside the solar cell module, filling of EVA sheet, melting of the frame seal, and deterioration of power generation performance in the module one year after installation are occurring. Whitening phenomenon, electrode corrosion phenomenon, and dielectric breakdown phenomenon are appearing in solar cell module installed in Korea before 5-7 years, leading to deterioration of power generation performance, and big problems for long-term reliability and long life technology are emerging. Therefore, in order to solve these problems, the development of a micro inverter (MiCrco Inverter Converter, MiC) including the function of securing the durability of the solar cell module and monitoring the aging progress and the solar cell based on the monitoring data from the MiC smart monitoring programs have been proposed to determine the aging of modules. In addition, in order to become a highly efficient solar smart monitoring system through systematic operation management through IT convergence with MiC that has enhanced monitoring function of solar cell module, SoC(System On Chip) in micro inverter is the environment for solar cell module. There is a demand for functions that can detect information in a complex manner and perform communication and control when necessary. Based on these requirements, this paper aims to develop SoC-based low-cost MiC smart photovoltaic system technology.

Low-Power Design of Hardware One-Time Password Generators for Card-Type OTPs

  • Lee, Sung-Jae;Lee, Jae-Seong;Lee, Mun-Kyu;Lee, Sang-Jin;Choi, Doo-Ho;Kim, Dong-Kyue
    • ETRI Journal
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    • v.33 no.4
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    • pp.611-620
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    • 2011
  • Since card-type one-time password (OTP) generators became available, power and area consumption has been one of the main issues of hardware OTPs. Because relatively smaller batteries and smaller chip areas are available for this type of OTP compared to existing token-type OTPs, it is necessary to implement power-efficient and compact dedicated OTP hardware modules. In this paper, we design and implement a low-power small-area hardware OTP generator based on the Advanced Encryption Standard (AES). First, we implement a prototype AES hardware module using a 350 nm process to verify the effectiveness of our optimization techniques for the SubBytes transform and data storage. Next, we apply the optimized AES to a real-world OTP hardware module which is implemented using a 180 nm process. Our experimental results show the power consumption of our OTP module using the new AES implementation is only 49.4% and 15.0% of those of an HOTP and software-based OTP, respectively.

Manufacturing of PAR Illumination Using COB Line Type LEDs (COB Line형 LED를 사용한 PAR 조명의 제작)

  • Youn, Gap-Suck;Yoo, Kyung-Sun;Lee, Chang-Soo;Hyun, Dong-Hoon
    • Journal of The Korean Society of Manufacturing Technology Engineers
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    • v.24 no.4
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    • pp.448-454
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    • 2015
  • In this paper, the band structural design that is typically in a line was arranged in a ring shape, so as to configure the high power LED lighting in such a way as to form a concentrated light distribution angle of less than 15 degrees. The parabolic aluminized reflector PAR38 that facilitates design using area and the area of the optical system to the same extent, applied a multiple light-source condenser lens optical system for the control of integration. The LED used here implemented a single linear light source using ans LED module with ans LED, flip-chip chip-scale package. The optical system was designed based on the energy star standard.