• Title, Summary, Keyword: plastic substrate

Search Result 317, Processing Time 0.061 seconds

Out Gassing from Plastic Substrates Affect on the Electrical Properties of TCO Films (플라스틱 기판의 Outgassing이 TCO 박막의 전기적 특성에 미치는 영향)

  • Kim, Hwa-Min;Ji, Seung-Hun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.22 no.11
    • /
    • pp.961-968
    • /
    • 2009
  • In this work, transparent conductive oxide(TCO) films such as $In_2O_3-SnO_2$(ITO) and $In_2O_3-ZnO$(IZO) were prepared on polyethylene naphthalene(PEN) and glass substrates by using rf-magnetron sputtering system. The TCO films deposited on PEN substrate show very poor conductivity as compared to that of the TCO films deposited on glass substrates. From the results of the residual gas analysis(RGA) test, this poor stability of plastic substrate is presumed to be caused by the deteriorated adhesion between the TCO films and the plastic substrate due to outgassing from the plastic substrate during deposition of TCO films. From our experiment, it is found that the vaporization of some defects in the plastic substrates deteriorate the adhesion of the TCO films to the plastic substrate, because the most plastic substrates containing the water vapor and/or other adsorbed particles such as organic solvents. Mixing of these gases vaporized in the sputtering process will also affect the electrical property of the deposited TCO films. Inorganic thin composite $(SiO_2)_{40}(ZnO)_{60}$ film as a gas barrier layer is coated on the PEN substrate to protecting the diffusion of vapors from the substrate, so that the TCO films with an improved quality can be obtained.

Features of Residual Stress and Plastic Strain in Titanium/Aluminium Friction Welds (티탄과 알루미늄의 마찰용접에서 발생하는 잔류응력.소성변형)

  • 김유철;박정웅
    • Journal of Welding and Joining
    • /
    • v.18 no.5
    • /
    • pp.84-89
    • /
    • 2000
  • Friction welding of titanium and aluminium is numerically modeled by the axisymmetric thermal elastic-plastic analysis. In titanium/aluminium friction welding, heat transfers into the titanium substrate to a distance of z=10(mm) on the side of the bondline and into the whole region of the aluminium substrate having the large thermal conductivity. Adjacent to the bondline, $^{\sigma}r\;and\;^{\sigma\theta}$ are tensile in the substrate whose thermal shrinkage is large, and are compressive in the substrate whose thermal shrinkage is small. $\sigma_z$ along the radial direction is large tensile at the periphery of the component. Plastic strain occurs only close to the bondline in the aluminium substrate. In the components of plastic strain, $\varepsilon^p_r\;and\;\varepsilon^p_{\theta}$ have positive values and $\varepsilon^p_r$ has large negative value. However, $\varepsilon^p_r$ is produced not because of the severity of the mechanical restraint condition, but on purpose to satisfy the condition of the volume constant. A plastic work is proposed as a measure to evaluate the mechanical severity. The plastic work is larger in the aluminium substrate than that in the titanium substrate. The mechanical condition is severer in the aluminium substrate.

  • PDF

Fabrication of thin Film Transistor on Plastic Substrate for Application to Flexible Display (Flexible 디스플레이로의 응용을 위한 플라스틱 기판 위의 박막트랜지스터의 제조)

  • 배성찬;오순택;최시영
    • Journal of the Institute of Electronics Engineers of Korea SD
    • /
    • v.40 no.7
    • /
    • pp.481-485
    • /
    • 2003
  • Amorphous silicon (a-Si:H) based TFT process has been studied at the maximum temperature of 15$0^{\circ}C$ with 25${\mu}{\textrm}{m}$ thick flexible and adhesive tape type polyimide foil substrate, which has benefit on handling a rugged, flexible plastic substrate trough sticking simply it to glass. This paper summarize the process procedure of the TFT on the plastic substrate and shows its electrical characteristics in comparison with glass substrate using primarily the ON/OFF current ratio and the field effect mobility as the quality criterion. The a-SiN:H coating layer played an important role in decreasing surface roughness of plastic substrate, so leakage current of TFT was decreased and mobility was increased. The results show that high quality a-Si:H TFTs can be fabricated on the plastic substrates through coating a rough plastic surface with a-SiN:H.

Plastic Substrate for Flexible Display

  • Kim, In-Sun;Hwang, Hee-Nam;Choi, Jae-Moon;Yeom, Eun-Hee;Park, Yong-Ho
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • /
    • pp.995-997
    • /
    • 2005
  • A plastic substrate for flexible display is developed. The gas barrier and optical properties of the substrate is improved through depositing silicon oxide/nitride layer and coating polymer layer on plastic film by sputtering process and wet coating process. Roll to roll processes will guarantee the productivity in the whole production process of the plastic substrate.

  • PDF

Generation of Pretilt angles on the Polyimide surface using plymer flims (고분자 필름을 이용한 폴리이미드 표면에서의 프리틸트각 발생)

  • Hwang, Jeoung-Yeon;Nam, Ki-Hyung;Seo, Dae-Shik
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • /
    • pp.81-83
    • /
    • 2003
  • We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with rubbing alignment method on polyimide surfaces using thin plastic substrates. It was found that monodomain alignment of LNC is obtained with rubbing alignment method on polyimide surfaces using thin plastic substrates. The generated NLC pretilt angles are about $3^{\circ}$ by the rubbing alignment method on thin plastic substrates, However, the pretilt angle measured at about $1.7^{\circ}$ lower on the glass substrate than by thin plastic substrate. It is considered that this alignment may be attributed to roughness of micro groove substrate. The tilt angle increases with increasing baking temperature for making polyimide layer using glass substrate. It was concluded that pretilt angle in the polyimide surface is attributable to the increasing of imide rato.

  • PDF

Mechanically Flexible and Transparent Zinc Oxide Thin Film Transistor on Plastic Substrates (Plastic 기판 상의 투명성과 유연성을 지닌 Zinc Oxide 박막 트랜지스터)

  • Park, Kyung-Yea;Ahn, Jong-Hyun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • /
    • pp.10-10
    • /
    • 2009
  • We have fabricated transparent and flexible thin film transistor(TFT) on polyethylene terephthalate(PET) substrate using Zinc Oxide (ZnO) and Indium Tin Oxide (ITO) film as active layer and electrode. The transfer printing method was used for printing the device layer on target plastic substrate at room temperature. This approach have an advantage to separate the high temperature annealing process to improve the electrical properties of ZnO TFT from the device process on plastic substrate. The resulting devices on plastic substrate presented mechanical and electrical properties similar with those on rigid substrate.

  • PDF

Flexible Display i Low Temperature Processes for Plastic LCDs

  • Han, Jeong-In
    • Transactions on Electrical and Electronic Materials
    • /
    • v.4 no.2
    • /
    • pp.10-14
    • /
    • 2003
  • Flexible displays such as plastic-based liquid crystal displays (LCDs) and organic light-emitting diode displays (OLEDDs) have been researched and developed at KETI since 1997. The plastic film substrate is very weak to heat and pressure compared to glass substrate, that its fabrication process is limited to 110$^{\circ}C$ and low pressure. The ITO films were deposited on the bare plastic film substrate by rf-magnetron sputtering. Moreover, in order to maintain uniform cell gap and pressure on the plastic film substrate, we utilized newly-invented jig and fabrication process. Electro-optical characteristics were better than or equivalent to those of typical glass LCDs though it is thinner, lighter-weight, and more robust than glass LCDs.

New Method of Gas Barrier Coating on Plastic Substrate for Flexible Display

  • Hwang, Hee-Nam;Choi, Jae-Moon;Kim, In-Sun;Park, Jong-Rak
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • /
    • pp.985-987
    • /
    • 2004
  • A plastic substrate for flexible display is developed. The gas barrier property in the substrate is improved through depositing metal and metal oxide multi layer on plastic film by PVD process. The metal/metal-oxide multiplayer on plastic film shows excellent gas barrier property and optical property.

  • PDF

Generation of Pretilt Angles on the Polyimide Surface using Plymer Flims (고분자 필름을 이용한 폴리이미드 표면에서의 프리틸트각 발생)

  • 황정연;남기형;서대식
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.16 no.12
    • /
    • pp.1110-1114
    • /
    • 2003
  • We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with rubbing alignment method on polyimide surfaces using thin plastic substrates. It was found that monodomain alignment of NLC is obtained with rubbing alignment method on polyimide surfaces using thin plastic substrates. The NLC pretilt angles generated are about 3$^{\circ}$ by the rubbing alignment method on thin plastic substrates, However, the pretilt angle are at about 1.7$^{\circ}$ lower on the glass substrate than on thin plastic substrate. We obtain that AFM (atomic force microscope) image of rubbed PI surface with polymer film has formed the micro-groove structure at the low curring temperature (120$^{\circ}C$). However, no grooves are obtained on the glass substrate at the same temperature. It is considered that this alignment may be attributed to roughness of micro-groove substrate. The tilt angle increases with increasing baking temperature for making polyimide layer using glass substrate. It was concluded that the pretilt angle in the polyimide surface is attributable to the increasing of imidization rato.

The Study of a-Si Film Crystallization using an XeCl Laser Annealing on the Plastic Substrate

  • Kim, Do-Young;Suh, Chang-Ki;Shim, Myung-Suk;Kim, Chi-Hyung;Yi, Jun-Sin;Lee, Min-Chul;Han, Min-Gu
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • /
    • pp.634-638
    • /
    • 2003
  • We reported the a-Si crystallization using a XeCl excimer laser annealing on the plastic substrate. The poly-Si film is able to grow in the low temperature and light substrate like a plastic. For the preparation of sample, substrate is cleaned by organic liquids. The film of $CeO_{2}$ layer as the buffer layer was grown by sputtering methods. After a-Si film deposition using ICPCVD, the film was crystallized by XeCl excimer laser. In this paper, we present the crystallization properties of a-Si on the plastic substrate

  • PDF