Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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A Study on the Manufacturing Process of Ni-P Doped W-Cu Electric Contacts

Ni-P 합금첨가한 W-Cu계 전기접점 제조에 관한 연구

  • Lee, J. S. (Dept. of Met. and Mater. Sci. Hanyang University) ;
  • Shin, H. (Dept. of Met. and Mater. Sci. Hanyang University) ;
  • Bae, K. W. (Dept. of Met. and Mater. Sci. Hanyang University)
  • 이재성 (한양대학교 금속재료공학과) ;
  • 신훈 (한양대학교 금속재료공학과) ;
  • 배광욱 (한양대학교 금속재료공학과)
  • Published : 1988.10.01
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Abstract

The present investigation has been performed on the manufacturing process of Ni-P doped W-Cu electric contacts by infiltration techniques. The addition of small amount of Ni-P alloy aimed at forming a rigid and homogeneous skeleton structure of W-powders which favours subsequent infiltration process of Cu-melts. The experimental results revealed that the small addition of Ni-P alloy appreciably enhances the sintering process of W at low temperatures (even at 1000$^{\circ}C$), simultaneously causing a considerable change of skeleton Morphology and its related best infiltration behaviour of Cu-melts.

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