대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)
- 대한전기학회 1993년도 정기총회 및 추계학술대회 논문집 학회본부
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- Pages.204-206
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- 1993
감광성 폴리이미드를 모울드로 이용한 기반층이 없는 선택적 금속 도금에 관한 기초 연구
A Fundamental Study of Selective Metal Electroplating Without Seed Layers Using a Photosensitive Polyimide as Molds
- Ahn, Dong-Sup (Dept. of Electrical Eng., Seoul Nat'l Univ.) ;
- Lee, Sang-Wook (Dept. of Electrical Eng., Seoul Nat'l Univ.) ;
- Kim, Ho-Sung (dept. of Electrical Eng., Chung-Ang Univ.) ;
- Kim, Yong-Kweon (Dept. of Electrical Eng., Seoul Nat'l Univ.)
- 발행 : 1993.11.26
초록
In this paper we represented electroplating process without seed layers for making metal micro structures needed for applying terminal voltage for one-to-one cell fusion system. In this system, we need thick insulator and metal structures because the diameter of a cell is approximately
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