Thickness Measurement of A Thin Layer Using Plane Ultrasonic waves

평면 초음파를 이용한 미소 간극 측정

  • 김노유 (LG전자 리빙시스템 연구소)
  • Published : 1995.10.01

Abstract

This paper describes a new technique for thickness measurement of a very thin layer less than one-quarter of the wavelength of ultrasonic wave using ultrasonic pulse-echo method. The technique determines the thickness of a thin layer in a layered medium form the amplitudes of the total reflected waves from the back side layer of interst. Thickness of a very thin layer few inch deep inside the media can be measured without using a very high frequency ultrasonic transducer over 100MHz which must be used in the conventional techniques for the precision measurement of a thin layer. The method also requires no inversion process to extract the thickness from the waveform of the reflected waves, so that it makes possible on-line measurement of the thickness of the layer.

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