Surface Mounting Device의 동역학적 모델링 및 상태 민감도 해석

  • 장진희 (한양대학교 대학원 정밀기계공학과) ;
  • 한창수 (한양대학교 기계공학과) ;
  • 김정덕 (삼성항공 정밀기기연구소)
  • Published : 1995.10.01

Abstract

In the area of assembly process of micro-chips and electronic parts on the printed circuit board, surface mounting device(SMD) is used as a fundamental tool. Generally speaking, the motion of the SMD is based on the ball screw system operated by any type of actuators. The ball screw system is a mechanical transformer which converts the mechanical rotational motion to the translational one. Also, this system could be considered as an efficient motion device against mechanical backash and friction. Therefore a dynamic modeling and stste sensitivity analysis of the ball screw system in SMD have to be done in the initial design stage. In this paper, a simple mathematical dynamic model for this system and the sensitivity snalysis are mentioned. Especially, the bond graph approach is used for graphical modeling of the dynamic system before analysis stage. And the direct differentiation method is used for the state sensitivity analysis of the system. Finally, some trends for the state variables with respect to the design variables could be suggested for the better design based on the results on the results of dynamic and state sensitivity.

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