Laser CVD에 의한 Poly-Si 막의 퇴적 및 Laser etching 특성

The Characteristics of poly-Si films Deposition by Laser CVD and Laser Etching

  • 권경환 (고려대학교 대학원 전기공학과) ;
  • 김영훈 (고려대학교 대학원 전기공학과) ;
  • 신상우 (고려대학교 대학원 전기공학과) ;
  • 김창덕 (고려대학교 대학원 전기공학과) ;
  • 성영권 (고려대학교 대학원 전기공학과)
  • Kwon, K.H. (Dep. of Electrical Engineering, Korea Univ.) ;
  • Kim, Y.H. (Dep. of Electrical Engineering, Korea Univ.) ;
  • Shin, S.W. (Dep. of Electrical Engineering, Korea Univ.) ;
  • Kim, C.D. (Dep. of Electrical Engineering, Korea Univ.) ;
  • Sung, Y.K. (Dep. of Electrical Engineering, Korea Univ.)
  • 발행 : 1996.07.22

초록

Poly-Si films were deposited by Laser CVD using 193nm ArF Excimer Laser from disilane($Si_{2}H_{6}$) and then the films were etched by Laser Etching using the same Laser with SF6 etching gas. Dependence on various film deposition conditions and etching conditions was investigated respectively.

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