Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)

The Korean Institute of Electrical Engineers (대한전기학회)
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A Study on Developement of CuN/Cu/CuN Electrode Material for PDP

PDP용 CuN/Cu/CuN 전극재료의 개발에 관한 연구

  • Cho, J.S. (Pusan National University Engineering Dept.) ;
  • Park, C.H. (Pusan National University Engineering Dept.) ;
  • Sung, Y.M. (Pusan National University Engineering Dept.) ;
  • Jeong, S.S. (Pusan National University Engineering Dept.) ;
  • Seok, B.Y. (Pusan National University Engineering Dept.) ;
  • Ryu, J.Y. (Pusan National University Engineering Dept.) ;
  • Kim, J.H. (Pusan National University Engineering Dept.)
  • 조정수 (부산대학교 공과대학 전기공학과) ;
  • 박정후 (부산대학교 공과대학 전기공학과) ;
  • 성열문 (부산대학교 공과대학 전기공학과) ;
  • 정신수 (부산대학교 공과대학 전기공학과) ;
  • 석복렬 (부산대학교 공과대학 전기공학과) ;
  • 류주연 (부산대학교 공과대학 전기공학과) ;
  • 김준호 (부산대학교 공과대학 전기공학과)
  • Published : 1996.07.22
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Abstract

A new type $Cu_{x}N/Cu/Cu_{x}N$ thin film electrode material with high adhesion to glass was developed by the dc reactive planar magnetron sputtering system for the PDP(Plasma Display Panel). The adhesive force of the $Cu_{x}N$ thin film was in the range of $20{\sim}40(N)$ under the conditions of the $N_2$ partial pressure of 15%, discharge current of 70mA, discharge voltage of 450V and substrate bias voltage of -100V. The adhesive force was depended on the $N_2$ partial pressure, discharge current and substrate bias voltage.

Keywords