An Experimental Study on the Thermal Performance of Air filled Thermal Diode during Transfer Process

공기를 작동 유체로 하는 열다이오드의 천이 과정중 열성능에 관한 실험적 연구

  • Published : 1996.10.01

Abstract

thermal diode is a device which allows heat to be transferred in one direction by convection due to difference of density of fluid. Vertical plate for heat collection and radiation are of utility for design of thermal diode. It was considered the transient process of air filled thermal diode with guide vane which combined rectangular and parallelogrammic shape enclosures. Gr was kept constantly on 1.60$\times$1010 and error range was $\pm$2% during the experiment. Nu was examined when inclined angle are 15$^{\circ}$and 45$^{\circ}$and, also the experiments was carried out with and without guide vane as well. Specially, The effect of guide vane was sensitive. Developed region inclined angle, which is characteristic of system.

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