Fabrication of the Hihg Power SiGe Heterojunction Bipolar Transistors using APCVD

상압 화학 기상 증착기를 이용한 고출력 SiGe HBT제작

  • 한태현 (한국전자통신연구소, 화합물반도체연구부) ;
  • 이수민 (한국전자통신연구소, 화합물반도체연구부) ;
  • 조덕호 (한국전자통신연구소, 화합물반도체연구부) ;
  • 염병령 (한국전자통신연구소, 화합물반도체연구부)
  • Published : 1996.11.01

Abstract

A high power SiGe HBT has been fabricated using APCVD(Atmospheric Pressure Chemical Vapor Deposition) and its perfermanoe has been analysed. The composition of Ge in the SiGe base was graded from 0% at the emitter-base junction to 20% at the base-collector junction. As a base electrode, titanium disilicide(TiSi$_2$) was used to reduce the extrinsic base resistance. The SiGe HBT with an emitter area of 2$\times$8${\mu}{\textrm}{m}$$^2$typically has a cutoff frequency(f$_{T}$) of 7.0GHz and a maximun oscillation frequency(f$_{max}$) of 16.1GHz with a pad de-embedding. The packaged high power SiGe HBT with an emitter area of 2xBx80${\mu}{\textrm}{m}$$^2$typically shows a cutoff frequency of 4.7GHz and a maximun oscillation frequency of 7.1GHz at Ic of 115mA.A.A.

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