한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)

한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
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진공증착중합법에 의해 제조된 PMDA/4,4′-DDE 폴리이미드의 내열 특성

Heat resistant characterization of PMDA/4,4`-DDE polyimide of fabricated by vapor deposition polymerization

  • 김형권 (인하대학교 전기공학과) ;
  • 이붕주 (인하대학교 전기공학과) ;
  • 우호환 (인하공업전문대학 전기과) ;
  • 이은학 (한라공업전문대학 전기과) ;
  • 이덕출 (인하대학교 전기공학과)
  • 발행 : 1996.05.01
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초록

The thin films are fabricated by VDPM and its heat resistant characteristics are investigated using Thermogravimetry. About polyimide, there is a wide difference between 5% weight loss temperature of TG curve and 20,000hr. of life time by methode of ASTM D2307. Therefore, TGI can be obtained by thermogravimetric analysis of NEMA std. pub. NOREI-1974. The TGI was got 670, 674 and 585 at 20$^{\circ}C$, 40$^{\circ}C$ and 70$^{\circ}C$, respectively.

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