한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)

한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
권호 표지

PDP용 CuN/Cu/CuN 전극재료의 개발에 관한 연구

Development of the CuN/Cu/CuN type Electrode Material for the PDP

  • 성열문 (부산대학교 공과대학 전기공학과) ;
  • 정신수 (부산대학교 공과대학 전기공학과) ;
  • 류재하 (LG 전자 VDP 연구소) ;
  • 김재성 (LG 전자 VDP 연구소) ;
  • 조정수 (부산대학고 전기공학과) ;
  • 박정후 (부산대학고 전기공학과)
  • 발행 : 1996.05.01
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초록

A new type CuN/Cu/CuN thin film electrode material with high adhesion to glass was developed by the dc reactive planar magnetron sputtering system for the PDP(Plasma Display Panel). The adhesive force of the CuxN thin film was in the range of 20∼40(N) under the conditions of the N$_2$ partial pressure of 15%, discharge current of 70mA, discharge voltage of 450v and substrate bias voltage of -100V. The adhesive force was depended on the N$_2$ partial Pressure, discharge current and substrate bias voltage.

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