한국정밀공학회:학술대회논문집 (Proceedings of the Korean Society of Precision Engineering Conference)
- 한국정밀공학회 1996년도 추계학술대회 논문집
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- Pages.588-592
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- 1996
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- 2005-8446(pISSN)
전문가시스템 기법을 이용한 칩 캡슐화 성형설계 시스템
초록
In this paper, we have constructed an expert system for semiconductor chip encapsulation which combines a knowledge-based system with CAE software. The knowledge-base module includes heuristic and pre-analysis knowledge for evaluation and redesign. Evaluation of the initial design and generation of redesign recommendations can be developed from the rules as applied to a given chip Package. The CAE programs can be used for simulating the filling and packing stage of encapsulation process. The expert system is a new tool which enables package design or process conditions with high yields and high productivity.
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