Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 1997.11a
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- Pages.397-400
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- 1997
Micromachining of Si substrate Using Electrochemical Etch-Stop in Aqueous TMAH/IPA/pyrazine Solution
TMAH/IPA/Pyrazine 수용액에서 전기화학적 식각정지법을 이용한 Si 기판의 미세가공
Abstract
This paper presentes the characteristics of Si anisotropic etching and electrochemical etch-stop in aqueous TMAH/IPA/pyrazine solution. (100) Si etching rate of 0.747
Keywords