Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 1998.07g
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- Pages.2541-2543
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- 1998
Fabrication of $100{\mu}m$ High Metallic Structure Using Negative Thick Photoresist and Electroplating
Negative Thick Photoresist를 이용한 $100{\mu}m$ 높이의 금속 구조물의 제작에 관한 연구
- Chang, Hyun-Kee (School of Electrical Engineering Seoul National University) ;
- Kim, Yong-Kweon (School of Electrical Engineering Seoul National University)
- Published : 1998.07.20
Abstract
This paper describes the fabrication process to fabricate metallic structure of high aspect ratio using LlGA-like process. SU-8 is used as an electroplating mold. SU-8 is an epoxy-based photoresist, designed for ultrathick PR structure with single layer coating [1,2]. We can get more than
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