Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)

Materials Research Society of Korea (한국재료학회)
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The Effect of Cu0/Cu20 Ratio on Copper/EMC Interface Adhesion of Oxidized Lead Frame Alloys in Packaging Process Temperature

  • T.G. Kang (Package Technology Team, LG Semicon Co., Ltd.) ;
  • Park, I. S. (Package Technology Team, LG Semicon Co., Ltd.) ;
  • Kim, Y. G. (Package Technology Team, LG Semicon Co., Ltd.)
  • Published : 1998.08.01
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