Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)
- 1998.08a
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- Pages.139.2-139
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- 1998
EUTECTIC PB/SH FLIP CHIP SOLDER BUMP AND UNDER BUMP METALLURGY(UBM) INTERFACIAL REACTION AND ADHESION
- Jang, Se-Young (Dept. of Materials Science and Engineering, KAIST) ;
- Paik, Kyung-Wook (Dept. of Materials Science and Engineering, KAIST)
- Published : 1998.08.01
Abstract
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