MICROSTRUCTURAL DEVELOPMENT IN THE INTERFACE BETWEEN In AND Au/Ni/Ti THIN FILM DURING In REFLOW PROCESS.

  • Cho, W.G. (Dept. of Mat. Eng., Hanyang Univ.) ;
  • Lee, C.Y. (Dept. of Mat. Eng., Hanyang Univ.) ;
  • Kim, Y.H. (Dept. of Mat. Eng., Hanyang Univ.)
  • Published : 1998.08.01