Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)

Materials Research Society of Korea (한국재료학회)
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Bumping, CSPs and Substrates; The new Packaging Materials and Technologies,

  • Lee, Y.M. (Micro Systems, Semiconductor Tech. Division, ETRI) ;
  • Park, H.O. (Micro Systems, Semiconductor Tech. Division, ETRI) ;
  • Ju, C.W. (Micro Systems, Semiconductor Tech. Division, ETRI) ;
  • Lee, S.B. (Micro Systems, Semiconductor Tech. Division, ETRI) ;
  • Baek, J, T. (Micro Systems, Semiconductor Tech. Division, ETRI) ;
  • Kim, B.W. (Micro Systems, Semiconductor Tech. Division, ETRI)
  • Published : 1998.08.01
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