Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)
- 1998.08a
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- Pages.98.3-98
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- 1998
The Influence of Adhesion o( Heat Spreader and Adhesive on Reliability of the High Power BGA
- Park, I.S. (Package R&D Center, LG Semicon. Co., Ltd) ;
- I.S. Kang (Package R&D Center, LG Semicon. Co., Ltd) ;
- S.J. Heo (Package R&D Center, LG Semicon. Co., Ltd) ;
- Kim, Y.C. (Package R&D Center, LG Semicon. Co., Ltd) ;
- Kim, J.S. (Package R&D Center, LG Semicon. Co., Ltd) ;
- Kim, Y.G. (Package R&D Center, LG Semicon. Co., Ltd)
- Published : 1998.08.01
Abstract
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