Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)

Materials Research Society of Korea (한국재료학회)
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MEASUREMENT OF ADHESION STRENGTH BETWEEN CU-BASED LEADFRAME AND EPOXY MOLDING COMPOUND UNDER MIXED MODE LOADING

  • Lee, H.Y. (Dept. of Mat. Sci. and Eng., KAIST) ;
  • Yu, Jin (Dept. of Mat. Sci. and Eng., KAIST)
  • Published : 1998.08.01
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Abstract

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