A MEARSUREMENT OF THE INTERFACIAL FRACTURE TOUGHNESS BETWEEN CHIP AND LEAD FRAME

  • Kim, J.H. (Dept of Mech. Eng., KAIST) ;
  • Hwang, H.K. (KCC C.R.I.) ;
  • Lee, S.B. (Dept of Mech. Eng., KAIST) ;
  • Earmme, Y.Y. (Dept of Mech. Eng., KAIST)
  • Published : 1998.08.01