Effect die attach adhesives on wire bonding integrity and its viscoelastic analysis

  • Yoo, Hee-Y. (R&D center, Anam Semiconductor Inc.) ;
  • Moon, Byung-R. (R&D center, Anam Semiconductor Inc.) ;
  • Sohn, Eun-S. (R&D center, Anam Semiconductor Inc.) ;
  • Chowdhur, Asif (R&D center, Anam Semiconductor Inc.)
  • Published : 1998.08.01