Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)

The Institute of Electronics and Information Engineers (대한전자공학회)
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Integrated 3-D Microstructures for RF Applications (Invited)

  • Euisik Yoon (National Research Lab. For 3-D Microstructures Dept. of Electrical Engineering Korea Advanced Institute of Science and Technology) ;
  • Yoon, Jun-Bo (National Research Lab. For 3-D Microstructures Dept. of Electrical Engineering Korea Advanced Institute of Science and Technology) ;
  • Park, Eun-Chul (National Research Lab. For 3-D Microstructures Dept. of Electrical Engineering Korea Advanced Institute of Science and Technology) ;
  • Han, Chul-Hi (National Research Lab. For 3-D Microstructures Dept. of Electrical Engineering Korea Advanced Institute of Science and Technology) ;
  • Kim, Choong-Ki (National Research Lab. For 3-D Microstructures Dept. of Electrical Engineering Korea Advanced Institute of Science and Technology)
  • Published : 1999.11.01
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Abstract

In this paper we report new integration technology developed for three-dimensional metallic microstructures in an arbitrary shape. We have developed the two fabrication methods: Multi-Exposure and Single-Development (MESD) and Sacrificial Metallic Mold(SMM) techniques. Three-dimensional photoresist mold can be formed by the MESD method while unlimited number of structural levels can be realized by the SMM technique. Using these two techniques we have fabricated solenoid inductors and levitated spiral inductors for RF applications. We have achieved peak Q- factors over 40 in the 2-10㎓ range, the highest number among the inductors reported to date. Finally, we propose "On-Chip Passives" as a post IC process for monolithic integration of inductors, tunable capacitors, microwave switches, transmission lines, and mixers and filters toward future single-chip transceiver integration.

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