무전해 니켈 도금액 제조와 복합제에 따른 도금 특성

Preparation of nickel Plating solution and the characteristics of deposition with complexents

Metalization technology of the fine patterns by electroless plating is required in place of electrodeposition as high-density printed circuit boards (PCB) become indispensable with the miniaturization of electronic components. Electroless nickel plating is a suitable diffusion barrier between conductor metals, such as Al and Cu, and solder is essetional in electronic packaging in order to sustain a long period of service. Moreover, Electroless nickel has particular characteristics including non-magnetic property, amorphous structure, wear resistance, corrosion protection and thermal stability. In this study fundamental aspects of electroless nickel deposition were studied with effect of complexeing agents of different kinds. Then, the property of electroless deposit are controlled by the composition of the deposition solution, the deposition condition such as temperature and pH value and so on. the characteristics of the deposits has been carried out.