대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)
- 대한전기학회 2000년도 하계학술대회 논문집 C
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- Pages.2074-2076
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- 2000
에칭 프로세스를 위한 $SF_{6}/O_2$ 플라즈마 특성에 관한연구
A Study on the $SF_6$ Plasma Characteristic for the etching process
- Ha, Jang-Ho (Yeungnam University) ;
- Jun, Yong-Woo (Yeungnam University) ;
- Shin, Yong-Chul (Yeungnam College of Science and Technology) ;
- Youn, Young-Dae (Pohang 1 College) ;
- Park, Won-Zoo (Yeungnam University) ;
- Lee, Kwang-Sik (Yeungnam University) ;
- Lee, Dong-In (Yeungnam University)
- 발행 : 2000.07.17
초록
In this paper, RFICP equipment is designed and manufactured with the aid of high frequency discharge to produce uniform plasma with high density and large diameter. And
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