An Experimental Study on the Dynamic Load Characteristics of Surface Mount Device(SMD)

칩마운트 (SMD) 장비의 동하중(動荷重) 발생특성에 관한 실험적 연구

SMD Equipment convey an electronic parts at high speed, then assemble parts into a circuit board, and it develop a long time-duration dynamic force to be caused by moving mass. Vibration problem to be caused by SMD Equipment have an effect on micro-meter level's precision production process, directly, and dynamic stability of building. In the cause of quantitatively access about its vibration problem, input information(or data) of structure dynamic analysis need accuracy information of dynamic load. Determination of Dynamic load is various kinds of method using experimental and theory. In this paper, we got dynamic load using direct measurement method. We expect that an study on the dynamic load characteristic of SMD can be used to Equipment development of low level vibration and basis information of structure dynamic analysis.